CN114025592A

CN114025592A - Etched microchannel heat exchanger

Info

Publication number: CN114025592A
Application number: CN202111471531.5A
Authority: CN
Inventors: 李健; 龚振兴
Original assignee: Changzhou Pinrui Electronic Technology Co ltd
Current assignee: Kunshan Ping Tai Electronic Co ltd
Priority date: 2021-12-06
Filing date: 2021-12-06
Publication date: 2022-02-08

Abstract

The invention discloses an etched micro-channel type heat exchanger, which comprises a frame, a cooling liquid micro-channel flow channel is etched in the frame, and heat dissipation fins are welded on the frame. The advantages of the invention are as follows: the heat exchange effect is good, and through the etching process, it can be applied to large-scale production and can improve the processing efficiency and the yield.

Description

Etched microchannel heat exchanger

Technical Field

The invention relates to the technical field of heat dissipation of electronic components, in particular to an etching micro-channel type heat exchanger.

Background

The size and volume of electronic components and electronic equipment assembled by the electronic components are smaller and smaller, the corresponding integration density is greatly increased, and high-heat-flow-density electronic equipment is formed and can reach a very high degree by a faster development trend. Along with the sharp increase of the heat flow density of the electronic equipment, the conventional air cooling heat dissipation mode is difficult to meet the heat dissipation requirement of the electronic equipment, and the liquid cooling has wider application in the field of heat dissipation of the electronic equipment due to higher heat exchange efficiency of the liquid cooling.

The liquid cooling heat dissipation is divided into two modes, one mode is liquid cooling plate heat dissipation, and the principle is that liquid and heating components are utilized to carry out direct contact heat transfer or indirect heat exchange, so that heat is taken away in the flowing or evaporating process, and then the temperature of the heating components is reduced.

The liquid cooling system mainly comprises a cold plate, a circulating pipeline, a pump and an air-liquid heat exchanger.

The other mode is heat dissipation and cooling of a heat exchanger, and the heat exchange principle of the heat exchanger is as follows: the cold fluid is introduced into the internal flow pipeline of the heat exchanger, the hot air is introduced into the external part of the heat exchanger, heat exchange is carried out between the hot air and the internal cold fluid through the heat convection effect of the radiating fins, the hot air is cooled and heated by the cold fluid, and the cooled hot air is conveyed to the equipment or the electronic component needing heat radiation, so that heat transfer and dissipation are realized. In the heat dissipation of the electronic equipment, after the air is cooled by the micro heat exchanger, the air is blown into the electronic equipment or the surface of the electronic component, so that the temperature of the air entering the electronic equipment or the temperature of the electronic component is reduced.

The heat exchange of the micro heat exchange comprises three parts which are respectively: the cooling liquid exchanges heat with the circulation pipeline in a convection mode, the circulation pipeline conducts heat with the external radiating fins, and the radiating fins exchange heat with air in a convection mode. The heat conduction between the circulation pipeline and the external fins is mainly influenced by material characteristics, and the convective heat transfer between the radiating fins and the air is mainly influenced by air flow rate and fin structures. The convective heat transfer between the cooling fluid and the flow-through pipeline is mainly influenced by the pipeline structure and the material properties of the cooling fluid. To enhance the heat convection between the coolant and the flow-through channel, the flow-through channel is generally designed as a microchannel (channel cross-section equivalent diameter is less than 1 mm). In the process of convective heat transfer, a thin layer with violent change of speed and temperature appears near a solid wall surface due to the viscous action of fluid, namely a boundary layer, a laminar bottom layer exists at the bottom of the boundary layer, and heat is conducted in a heat transfer mode of the laminar bottom layer. The structure of the micro-channel can effectively reduce the speed boundary layer, thereby enhancing the convection heat transfer.

At present, the traditional cooling liquid circulation pipelines of the micro heat exchanger are all machined, namely, wire cutting, relieving or CNC, the machining efficiency and yield are low, and the micro heat exchanger is not suitable for large-scale production.

Disclosure of Invention

In order to solve the above problems, the present invention provides an etching microchannel heat exchanger, which has a good heat exchange effect, and is applicable to mass production and capable of improving the processing efficiency and yield by an etching processing method.

In order to solve the technical problems, the technical scheme provided by the invention is as follows: the etched microchannel heat exchanger comprises a frame, wherein a cooling liquid microchannel flow channel is etched in the frame, and a radiating fin is welded on the frame.

Preferably, the material of the cooling liquid microchannel flow channel is aluminum or copper.

Preferably, the radiating fins are made of aluminum.

Preferably, the shape of the heat dissipation fin is zigzag or corrugated.

The invention also comprises a processing mode for etching the microchannel heat exchanger, which comprises the following specific steps:

the method comprises the following steps: firstly, a cooling liquid circulation pipeline is processed in an etching mode;

step two: if the frame is made of aluminum, firstly carrying out nickel plating treatment on the frame; if the copper material is copper, nickel plating is not needed;

step three: carrying out nickel plating treatment on the radiating fins;

step four: welding the radiating fins on the surface of the hollowed-out part of the frame by adopting reflow soldering;

step five: and an axial flow or turbine fan is arranged above or below the radiating fins.

Compared with the prior art, the invention has the advantages that: when the micro heat exchanger is used, the cooling liquid circulation pipeline of the micro heat exchanger is processed in an etching mode, and the pipeline can be etched into a bionic structure pipeline or other pipelines (such as a corrugated pipeline, a sawtooth pipeline and the like) capable of enhancing the heat convection effect according to the theory of hydrodynamics or heat transfer.

The etched micro-channel has smaller cross section size, and the thickness of a fluid boundary layer in the process of convection heat exchange is smaller, so that the convection heat exchange effect of a cooling liquid side can be improved, and the heat exchange performance of a heat exchanger is further improved. On the other hand, the etching mode makes the structure type of microchannel pipeline shaping abundanter, shaping efficiency and yield are higher.

Drawings

Fig. 1 is a front view of the present patent.

Fig. 2 is a right side view of the present patent.

FIG. 3 is a partial view of a microchannel of the present invention.

Fig. 4 is a three-dimensional structural view of the present invention patent.

As shown in the figure: 1. a coolant microchannel flow channel; 2. and (4) radiating fins.

Detailed Description

The present invention will be described in further detail with reference to the accompanying drawings.

With reference to fig. 1 to 4, the etched microchannel heat exchanger includes a frame, a coolant microchannel flow channel 1 is etched in the frame, and a heat dissipation fin 2 is welded on the frame.

The cooling liquid micro-channel flow channel 1 is made of aluminum or copper.

The radiating fins 2 are made of aluminum.

The radiating fins 2 are zigzag or corrugated.

The invention also comprises a processing mode of etching the micro-channel heat exchanger, which comprises the following specific steps:

step three: carrying out nickel plating treatment on the radiating fins;

The specific implementation mode of the invention is as follows: when the etching microchannel heat exchanger is used, namely, the fluid channels adopt the etching technology to process the microchannel structure, the microchannels are welded in a diffusion welding mode, and the radiating fins 2 are welded among the microchannels to form the etching microchannel heat exchanger.

The present invention and its embodiments have been described above, and the description is not intended to be limiting, and the drawings are only one embodiment of the present invention, and the actual structure is not limited thereto. In summary, those skilled in the art should appreciate that they can readily use the disclosed conception and specific embodiments as a basis for designing or modifying other structures for carrying out the same purposes of the present invention without departing from the spirit and scope of the invention as defined by the appended claims.

Claims

1. Etching microchannel type heat exchanger, it is characterized in that: comprise frame, described frame is etched with cooling liquid microchannel flow channel (1), and described frame is welded with cooling fin (2).

2 . The etched micro-channel heat exchanger according to claim 1 , wherein the material of the cooling liquid micro-channel flow channel ( 1 ) is aluminum or copper. 3 .

3 . The etched micro-channel heat exchanger according to claim 1 , wherein the material of the heat dissipation fins ( 2 ) is aluminum. 4 .

4. The etched micro-channel heat exchanger according to claim 1, wherein the shape of the heat dissipation fins (2) is a sawtooth shape or a corrugated shape.

5. The etched micro-channel heat exchanger according to claim 1, characterized in that: its processing method is:

Step 1: First, the coolant circulation pipeline is processed by etching;

Step 2: If the frame is made of aluminum, nickel-plating it first; if it is made of copper, no nickel-plating is required;

Step 3: Nickel plating the cooling fins;

Step 4: Use reflow soldering to weld the heat dissipation fins on the surface of the frame hollow;

Step 5: Install an axial flow or turbo fan above or below the cooling fins.