CN112485933A - Water-cooling pressure head on mobile phone display screen bonding equipment - Google Patents
Water-cooling pressure head on mobile phone display screen bonding equipment Download PDFInfo
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- CN112485933A CN112485933A CN201910856767.7A CN201910856767A CN112485933A CN 112485933 A CN112485933 A CN 112485933A CN 201910856767 A CN201910856767 A CN 201910856767A CN 112485933 A CN112485933 A CN 112485933A
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
- F25D1/00—Devices using naturally cold air or cold water
- F25D1/02—Devices using naturally cold air or cold water using naturally cold water, e.g. household tap water
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B6/00—Heating by electric, magnetic or electromagnetic fields
- H05B6/02—Induction heating
- H05B6/10—Induction heating apparatus, other than furnaces, for specific applications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B6/00—Heating by electric, magnetic or electromagnetic fields
- H05B6/02—Induction heating
- H05B6/36—Coil arrangements
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- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Nonlinear Science (AREA)
- Electromagnetism (AREA)
- General Engineering & Computer Science (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Crystallography & Structural Chemistry (AREA)
- Combustion & Propulsion (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Combinations Of Printed Boards (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
本发明属于手机显示屏制造技术领域，尤其为一种手机显示屏邦定设备上的水冷压头，包括两个水冷压盖，两个所述水冷压盖相互靠近的一侧设有压头安装块，所述压头安装块均与两个水冷压盖固定连接，所述压头安装块上固定安装有刀头，所述压头安装块的两侧均固定安装有端盖，两个所述端盖分别与两个所述水冷压盖的两侧相接触，两个所述端盖的同一侧均固定安装有第一冷却水管。本发明避免了FPC电子线路邦定过程中因压头高温状态下撤离使材料发生回弹造成电子线路接触和机械连接不良的情况。
The invention belongs to the technical field of mobile phone display screen manufacturing, in particular to a water-cooled pressure head on a mobile phone display screen bonding device, comprising two water-cooled pressure caps, and the two water-cooled pressure caps are provided with a pressure head installation on one side close to each other The indenter mounting block is fixedly connected with two water-cooled glands, a cutter head is fixedly installed on the indenter mounting block, end caps are fixedly installed on both sides of the indenter mounting block, and the two The end caps are respectively in contact with two sides of the two water-cooled glands, and a first cooling water pipe is fixedly installed on the same side of the two end caps. The invention avoids the situation of poor electronic circuit contact and mechanical connection caused by the material rebounding due to the withdrawal of the indenter in a high temperature state during the bonding process of the FPC electronic circuit.
Description
Technical Field
The invention relates to the technical field of mobile phone display screen manufacturing, in particular to a water-cooling pressure head on mobile phone display screen bonding equipment.
Background
The bonding pressure head is widely applied to equipment for connecting a liquid crystal Display module (LCM) (liquid Display module) combination of a mobile phone screen with a bonding process; namely, the liquid crystal display, the drive Circuit, the FPC (Flexible Printed Circuit board), the backlight and other structural components are assembled together, and the mechanical connection and the electrical conduction of the liquid crystal glass, the drive Circuit and the FPC in the liquid crystal display are the core parts of LCM production, wherein the production process of the liquid crystal glass and the FPC is FOG (film On glass) bonding process, namely, the FPC is carried On a glass panel; the ram is used by the processing equipment in the FOG bonding process, and the following is the basic flow of the process:
1. pre-pasting an ACF: pasting an ACF with a specified length at an ITO end of the liquid crystal glass or a pin needing to be bonded of the FPC;
2. pre-bonding: aligning pins of the FPC and the ITO end of the liquid crystal glass through an auxiliary image system on an FOG bonding machine, and prepressing to form preliminary connection;
3. main bonding: under higher temperature and pressure, the pre-bonded LCM product is subjected to main bonding, the electrical connection between the FPC and the liquid crystal glass is realized through the deformation of ACF conductive particles and the breakage of an insulating layer, and meanwhile, two different materials of the FPC and the liquid crystal glass are connected together through the polymerization hardening of ACF glue at high temperature to provide enough mechanical connection strength.
The full-automatic COG bonding machine mainly comprises three units of ACF (anisotropic conductive adhesive or anisotropic conductive film), prepressing and local pressing, wherein the local pressing unit is also called a local pressing bonding device and is used for completing the rear-end process of the display screen, namely the local pressing stage. Specifically, the ram of the present compression bonding apparatus is primarily responsible for providing a Z-axis motion that imparts about 150 Ν and 300 Ν to the buffered silica gel ribbon, which is then transmitted to the glass substrate and the IC.
If the circuit between the IC and the glass substrate is well communicated, in the stage of the pressure, the required temperature of the pressure head is as high as 200-420 ℃, the temperature of the heat insulation plate is rapidly increased, the heat is transferred to the part on the upper part of the pressure head, the expansion coefficient of the product material is unstable under the heating state and the influence of the ambient temperature, and the product yield is directly improved.
The existing pressure head is used in the similar FOG bonding LCM product process, the opposite conductive adhesive and the OLED material are bonded, when the pressure head is used for bonding the product, the temperature of the pressure head is kept at a high temperature (such as 180-360 degrees), the pressure head is withdrawn in a hot state, and the material is not completely cooled. Therefore, after the material is heated, the material needs to be naturally cooled, the material of the product rebounds under the high-temperature strong state to cause poor contact of an electronic pin circuit, so that the circuit connection conduction strength and the adhesion force between the FPC and the liquid crystal glass are reduced, the electrode pins of the FPC and the liquid crystal glass are induced to be opened due to the particle condition, the LCM product bonded by the FOG technology has serious potential quality hazards, and the water-cooling pressure head on the bonding equipment of the mobile phone display screen is provided for the purpose.
Disclosure of Invention
The invention aims to solve the defects in the prior art, and provides a water-cooling pressure head on bonding equipment for a display screen of a mobile phone.
In order to achieve the purpose, the invention adopts the following technical scheme: the utility model provides a water-cooling pressure head on mobile phone display screen nation decides equipment, includes two water-cooling glands, two one side that water-cooling gland is close to each other is equipped with pressure head installation piece, pressure head installation piece all with two water-cooling gland fixed connection, fixed mounting has the tool bit on the pressure head installation piece, the equal fixed mounting in both sides of pressure head installation piece has the end cover, two the end cover respectively with two the both sides of water-cooling gland contact, two the end cover with the equal fixed mounting in one side have a condenser tube.
Preferably, one side of each end cover, which is close to each other, is fixedly provided with a second cooling water pipe, and two ends of each second cooling water pipe are fixedly connected with the two first cooling water pipes respectively.
Preferably, one end of each of the two first cooling water pipes, which is far away from the two end covers, is fixedly provided with the same fixing plate.
Preferably, an induction heating coil is fixedly mounted on one side of the fixing plate.
Preferably, the two end covers are fixedly provided with temperature sensing probes, and the two temperature sensing probes are fixedly connected with the fixing plate.
Preferably, fixed mounting has the connecting plate on the fixed plate, the bottom fixed mounting of connecting plate has two pottery heat insulating mattress, two pottery heat insulating mattress all with pressure head installation piece fixed connection.
Preferably, the top of connecting plate fixed mounting has two pottery heat insulating ring, two the equal fixed mounting in top of pottery heat insulating ring has the connecting block.
Preferably, the two end covers are welded with a first plug and a second plug.
Compared with the prior art, the invention has the beneficial effects that: firstly, the device is matched with a water-cooling gland, a tool bit, a first plug, an induction heating coil, an end cover, a second plug, a first cooling water pipe, a temperature induction probe, a connecting plate, a ceramic heat insulation ring, a connecting block, a second cooling water pipe, a pressure head mounting block, a ceramic heat insulation pad and a fixing plate, a medium frequency controller is started to preheat the tool bit when the device is started, so that the temperature reaches the process requirement temperature (160 plus 280 ℃), after the temperature reaches a set value, a Z-axis pressing mechanism is started, the Z-axis pressing mechanism above the tool bit is vertically downward at a constant speed, the Z-axis pressing mechanism drives the device to integrally move downward through the connecting block, so as to drive the tool bit to move downward, the tool bit is bound, the tool bit indirectly presses a product through buffer silica gel, then the Z-axis pressing mechanism is kept motionless and the temperature of the pressure head is kept stable within the, closing the intermediate frequency controller, introducing cooling water into one of the first cooling water pipes, allowing the cooling water to enter the other first cooling water pipe through the second cooling water pipe and flow out, and allowing cold water in the second cooling water pipe to flow rapidly to rapidly cool the cutter head to a lower limit (70-110 ℃); when the cutter head is cooled to the set offline temperature, the bonding position part of the product is also cooled to the temperature (70-100 ℃) of the product material in the shaping state, so that the conditions of material expansion and contraction and electronic circuit instability are controlled, the product quality is improved, then the cutter head is lifted to return to the standby position, and a binding process is completed.
The invention avoids the condition that the materials rebound to cause poor contact and mechanical connection of the electronic circuit due to the evacuation of the pressure head under the high-temperature state in the bonding process of the FPC electronic circuit.
Drawings
FIG. 1 is a schematic structural view of the present invention;
FIG. 2 is a side cross-sectional structural view of the end cap and ram mounting block of the present invention;
fig. 3 is an exploded view of the present invention.
In the figure: 1. water-cooling the gland; 2. a cutter head; 3. a first plug; 4. an induction heating coil; 5. an end cap; 6. a second plug; 7. a first cooling water pipe; 8. a temperature sensing probe; 9. a connecting plate; 10. a ceramic heat insulating ring; 11. connecting blocks; 12. a second cooling water pipe; 13. a pressure head mounting block; 14. a ceramic heat insulating mat; 15. and (7) fixing the plate.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Examples
Referring to fig. 1-3, the present invention provides a technical solution: a water-cooling pressure head on a mobile phone display screen bonding device comprises two water-cooling pressure covers 1, wherein a pressure head mounting block 13 is arranged on one side, close to each other, of each of the two water-cooling pressure covers 1, each pressure head mounting block 13 is fixedly connected with the two water-cooling pressure covers 1, a tool bit 2 is fixedly mounted on each pressure head mounting block 13, end covers 5 are fixedly mounted on two sides of each pressure head mounting block 13, the two end covers 5 are respectively contacted with two sides of the two water-cooling pressure covers 1, and a first cooling water pipe 7 is fixedly mounted on the same side of each end cover 5;
a second cooling water pipe 12 is fixedly installed on one side of each of the two end covers 5 close to each other, two ends of the second cooling water pipe 12 are respectively and fixedly connected with the two first cooling water pipes 7, one end of each of the two first cooling water pipes 7 far away from the two end covers 5 is fixedly installed with the same fixing plate 15, one side of each fixing plate 15 is fixedly installed with an induction heating coil 4, temperature induction probes 8 are fixedly installed on the two end covers 5, the two temperature induction probes 8 are respectively and fixedly connected with the fixing plate 15, a connecting plate 9 is fixedly installed on the fixing plate 15, two ceramic heat insulation pads 14 are fixedly installed at the bottom of the connecting plate 9, the two ceramic heat insulation pads 14 are respectively and fixedly connected with a pressure head installation block 13, two ceramic heat insulation rings 10 are fixedly installed at the top of the connecting plate 9, connecting blocks 11 are respectively and fixedly installed at the top of the two ceramic heat insulation, through the matching of a water-cooling gland 1, a tool bit 2, a first plug 3, an induction heating coil 4, an end cover 5, a second plug 6, a first cooling water pipe 7, a temperature induction probe 8, a connecting plate 9, a ceramic heat insulation ring 10, a connecting block 11, a second cooling water pipe 12, a pressure head mounting block 13, a ceramic heat insulation pad 14 and a fixing plate 15, a medium frequency controller is started to preheat the tool bit 2 when the temperature reaches a process requirement temperature of 160 and 280 ℃, a Z-axis mechanism is started after the temperature reaches a set value, the Z-axis pressing mechanism above the tool bit 2 is vertically downward at a constant speed, the Z-axis pressing mechanism drives the device to integrally move downward through the connecting block 11 so as to drive the tool bit 2 to move downward, the tool bit 2 is bound, the tool bit 2 indirectly presses a product through buffering silica gel, and then the Z-axis pressing mechanism is kept still and the temperature of the pressure head is kept stable within the process requirement, when the bonding time is up, the intermediate frequency controller is closed, cooling water is introduced into one of the first cooling water pipes 7, the cooling water enters the other first cooling water pipe 7 through the second cooling water pipe 12 and flows out, and cold water in the second cooling water pipe 12 flows rapidly to rapidly cool the cutter head 2 to a lower limit (70-110 ℃); when the cutter head 2 is cooled to the set offline temperature, the temperature of the product bonding position part is also reduced to the product material shaping state temperature (70-100 ℃), so that the conditions of material expansion and contraction and electronic circuit instability are controlled, the product quality is improved, and then the cutter head 2 is lifted to return to the standby position to complete a binding process. The invention avoids the condition that the materials rebound to cause poor contact and mechanical connection of the electronic circuit due to the evacuation of the pressure head under the high-temperature state in the bonding process of the FPC electronic circuit.
In the embodiment, firstly, an intermediate frequency controller is arranged on one side of the device, the induction heating coil 4 is connected with the intermediate frequency controller, a Z-axis local pressing mechanism is arranged above the device, a connecting block 11 is fixedly connected with the Z-axis local pressing mechanism, the intermediate frequency controller is started to preheat the cutter head 2 when the device is started, so that the temperature reaches the process required temperature (160-, cooling water enters the other first cooling water pipe 7 through the second cooling water pipe 12 and flows out, and cold water in the second cooling water pipe 12 flows rapidly to rapidly cool the cutter head 2 to a lower limit (70-110 ℃); when the cutter head 2 is cooled to the set offline temperature, the bonding position part of the product is also reduced to the temperature (70-100 ℃) of the product material in the shaping state, so that the conditions of material expansion caused by heat and contraction caused by cold and electronic circuit instability are controlled, the product quality is improved, and then the cutter head 2 is lifted to return to the standby position to complete a binding process;
in the device, the tool bit 2 is made of YG12X tungsten steel, and is subjected to vacuum heat treatment, so that the heating deformation of a workpiece in use can be ignored, the surface smoothness reaches 0.4 mu m, and the parallelism reaches 0.001 mm;
the first plug 3 and the second plug 6 are welded with the end cover in a seamless mode by adopting stainless steel 316 in structural design so as to meet the requirement that repeated heating and cooling can not generate water seepage;
the water-cooling gland 1 is used for coating the second cooling pipe 12 and the pressure head mounting block 13, so that the temperature of the tool bit 2 is reduced;
the end cover 5 is made of 316 stainless steel, and is used for fixing the connection of the second cooling pipe 12 and the first cooling water pipe 7 and installing a temperature sensing probe;
the temperature sensing probe 8 is used for detecting the temperature change of the pressure head during heating and use, and the process temperature change process is realized through mutual adjustment of the temperature controller and the intermediate frequency controller;
the connecting plate 9 is used for fixing the induction heating coil 4 and is made of 6061 aluminum alloy, because the connecting plate 9 is closer to the induction heating coil 4, the aluminum alloy is less affected by eddy current and meets the strength requirement, and the connecting plate can be used as a heat dissipation plate to prevent heat from being conducted to an upper component;
the ceramic heat insulation ring 10 is made of ceramic materials, and heat conduction of the upper connecting plate is reduced in the heating process of the cutter head 2;
the ceramic insulating mat 14 reduces the upper part temperature transfer during rapid heating of the cutting head 2.
The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art should be considered to be within the technical scope of the present invention, and the technical solutions and the inventive concepts thereof according to the present invention should be equivalent or changed within the scope of the present invention.
Claims (8)
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| Application Number | Priority Date | Filing Date | Title |
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| CN201910856767.7A CN112485933B (en) | 2019-09-11 | 2019-09-11 | A water-cooled pressure head on a mobile phone display bonding device |
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| CN201910856767.7A CN112485933B (en) | 2019-09-11 | 2019-09-11 | A water-cooled pressure head on a mobile phone display bonding device |
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| CN112485933A true CN112485933A (en) | 2021-03-12 |
| CN112485933B CN112485933B (en) | 2025-01-14 |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11330791A (en) * | 1998-05-14 | 1999-11-30 | Matsushita Electric Ind Co Ltd | Electronic part mounting apparatus |
| JP2004259917A (en) * | 2003-02-26 | 2004-09-16 | Toray Eng Co Ltd | Bonding method and device thereof |
| CN101515076A (en) * | 2009-02-16 | 2009-08-26 | 太原风华信息装备股份有限公司 | Main pressure mechanism used for a liquid crystal display (LCD) module binding process |
| CN210666246U (en) * | 2019-09-11 | 2020-06-02 | 东莞市华慧智能装备有限公司 | Water-cooling pressure head on mobile phone display screen bonding equipment |
-
2019
- 2019-09-11 CN CN201910856767.7A patent/CN112485933B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11330791A (en) * | 1998-05-14 | 1999-11-30 | Matsushita Electric Ind Co Ltd | Electronic part mounting apparatus |
| JP2004259917A (en) * | 2003-02-26 | 2004-09-16 | Toray Eng Co Ltd | Bonding method and device thereof |
| CN101515076A (en) * | 2009-02-16 | 2009-08-26 | 太原风华信息装备股份有限公司 | Main pressure mechanism used for a liquid crystal display (LCD) module binding process |
| CN210666246U (en) * | 2019-09-11 | 2020-06-02 | 东莞市华慧智能装备有限公司 | Water-cooling pressure head on mobile phone display screen bonding equipment |
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| CN112485933B (en) | 2025-01-14 |
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