CN112309944A - Die bonder and method for picking and placing chip by needle head - Google Patents
Die bonder and method for picking and placing chip by needle head Download PDFInfo
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- CN112309944A CN112309944A CN202011241434.2A CN202011241434A CN112309944A CN 112309944 A CN112309944 A CN 112309944A CN 202011241434 A CN202011241434 A CN 202011241434A CN 112309944 A CN112309944 A CN 112309944A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
- H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
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- Condensed Matter Physics & Semiconductors (AREA)
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- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Die Bonding (AREA)
Abstract
本公开属于固晶机领域，公开一种固晶机以及针头取放芯片方法，固晶机包括针头，针头用于对芯片进行取放动作，所述针头设置为多个；针头上均独立安装有针头驱动单元，针头驱动单元能够带动针头进行芯片所在平面的任意位置调节；多针头作业时，其中针对于针头的运作方式，多个针头之间可同时运行亦可相互独立运行，利用多个针头同时运作，相对于单个针头，进行相同时间内提高了固晶机产能，节约时间成本，增加市场占有率；针对于有限空间内增加针头数量，提高了空间利用率；通过针头能够与对应的芯片进行对焦，单个针头取芯片时，可以全方位更精准取芯片，当采用多针头同时取芯片，不仅整体取芯片速度快而且更加精准。
The present disclosure belongs to the field of die bonding machines, and discloses a die bonding machine and a method for picking and placing a chip with a needle. The die bonding machine includes a needle, and the needle is used for picking and placing a chip. The needles are arranged in multiple numbers; There is a needle drive unit, and the needle drive unit can drive the needle to adjust any position of the plane where the chip is located; when working with multiple needles, according to the operation mode of the needles, the multiple needles can run simultaneously or independently of each other. The needles operate at the same time. Compared with a single needle, the production capacity of the die bonder is increased in the same time, saving time and cost, and increasing the market share; for increasing the number of needles in a limited space, the space utilization rate is improved; When the chip is focused, when a single needle takes the chip, it can take the chip more accurately in all directions. When using multiple needles to take the chip at the same time, the overall chip taking speed is not only faster but also more accurate.
Description
Technical Field
The disclosure belongs to the field of die bonder, and particularly relates to a die bonder and a method for picking and placing chips by using a needle head.
Background
At present, a single needle head type is adopted for a die bonder machine table, a chip is taken and placed under the condition that a CCD camera confirms the position, and the problem of low output of the die bonder machine exists.
Disclosure of Invention
The invention aims to provide a die bonder and a needle head chip picking and placing method, which are used for picking and placing chips by multiple needle heads.
The purpose of the disclosure can be realized by the following technical scheme:
a die bonder comprises a plurality of needle heads, wherein the needle heads are used for picking and placing chips;
all independently install syringe needle drive unit on the syringe needle, syringe needle drive unit can drive the syringe needle and carry out the planar optional position control in chip place.
In some disclosures, the needle drive unit is an XYZ linear motion servo.
In some disclosures, the needle drive unit is an XZ linear and Y rotary motion servo.
In some disclosures, the needle drive unit is a motion servo of X-rotation, Y-rotation, and Z-line.
A method for picking and placing chips by a needle head of a die bonder comprises the following steps:
the CCD camera is used for shooting and counting the position of the chip, the system adjusts the position of each needle head according to the actual position of the chip, the position of each needle head is focused with the position of the corresponding chip, after focusing is completed, the position of each needle head is kept fixed, and then the chips are directly taken and placed through the multiple needle heads.
The beneficial effect of this disclosure:
when the multi-needle head works, aiming at the operation mode of the needle head, the multiple needle heads can operate simultaneously or independently, the multiple needle heads operate simultaneously, the productivity of the die bonder is improved within the same time, the time cost is saved, and the market share is increased; the number of needle heads is increased in a limited space, so that the space utilization rate is improved; can focus with the chip that corresponds through the syringe needle, when the chip was got to single syringe needle, can all-round more accurate get the chip, get the chip simultaneously when adopting many syringe needles, not only wholly get chip fast and more accurate.
Drawings
In order to more clearly illustrate the embodiments or technical solutions in the prior art of the present disclosure, the drawings used in the description of the embodiments or prior art will be briefly described below, and it is obvious for those skilled in the art that other drawings can be obtained based on these drawings without creative efforts.
Fig. 1 is an overall schematic diagram of a first embodiment of the disclosure.
Detailed Description
The technical solutions in the embodiments of the present disclosure will be clearly and completely described below with reference to the drawings in the embodiments of the present disclosure, and it is obvious that the described embodiments are only a part of the embodiments of the present disclosure, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments disclosed herein without making any creative effort, shall fall within the protection scope of the present disclosure.
As shown in fig. 1, the thickness of the chip 2, the blue film, or the size of the needle 1 may be exaggerated for clarity, and the same reference numerals in the drawings denote the same or similar structures, and thus detailed descriptions thereof will be omitted.
As shown in fig. 1, a die bonder comprises a plurality of needles 1, wherein the needles 1 are used for picking and placing chips 2, and the number of the needles 1 is multiple;
all independently install syringe needle drive unit 10 on syringe needle 1, syringe needle drive unit 10 can drive syringe needle 1 and carry out the arbitrary position regulation on chip 2 place plane.
When the multi-needle-head-1-type wafer fixing machine is used, when the multi-needle-head 1 works, aiming at the operation mode of the needle head 1, the multiple needle heads 1 can simultaneously operate or can independently operate, the multiple needle heads 1 can simultaneously operate, the productivity of the wafer fixing machine is improved in the same time, the time cost is saved, and the market share is increased; the number of the needle heads 1 is increased in a limited space, so that the space utilization rate is improved;
aiming at the relative position relation between a chip 2 and a needle 1 during the operation of a multi-needle 1, in some prior disclosures, a single needle 1 can only take and place the chip 2 along the vertical direction, at the moment, the needle 1 can not adjust any position of the plane where the chip 2 is located, the chip 2 needs to be placed on the vertical direction where the needles 1 are aligned, the single needle 1 takes and places the chip 2 along the vertical direction, and when the needle 1 and the chip 2 are deviated at the plane position where the chip 2 is located, the needle 1 can not take and place the corresponding chip 2;
in a scenario where the needle 1 performs the picking and placing operation on the chip 2 along the vertical direction, the embodiment is only an example case of some existing disclosures, and certainly, in some other existing disclosures, the needle 1 may also perform the picking and placing operation on the chip 2 in other linear motion manners, where the straight line is not necessarily vertical, for convenience of description, the needle 1 also performs the picking and placing operation on the chip 2 along the vertical direction in the following embodiment, which is described and should not be taken as a reason for limiting the embodiment.
For the present disclosure, when a plurality of multi-needle heads 1 operate, if the needle head 1 is set to move only along the vertical direction, because the plurality of needle heads 1 carry a plurality of chips 2 simultaneously, at this time, for a single needle head 1, the plurality of needle heads 1 relatively increase the offset rate between the needle head 1 and the chip 2 to be sucked about the plane position of the chip 2, once the needle heads 1 and the chips 2 cannot be aligned, that is, the chips 2 and the needle heads 1 vertically focus, so that part of the needle heads 1 cannot take and place the corresponding chips 2;
according to the needle head design method, the needle head driving unit 10 is mounted on the needle head 1, the needle head driving unit 10 can drive the needle head 1 to adjust any position of the plane where the chip 2 is located, when the needle head 1 and the sucked chip 2 deviate relative to the plane where the chip 2 is located, the needle head driving unit 10 can drive the needle head 1, the needle head 1 and the chip 2 are vertically focused, when a single needle head is used for taking the chip, the chip can be taken in an all-round and more accurate mode by adopting the needle head design method, when multiple needle heads are used for simultaneously taking the chip in the needle head design method, the chip taking speed is high and the chip taking speed is more accurate; the chip is fixed on the blue film and has the same distance, so that the chip can be faster and more accurate.
According to the needle head driving device, the needle head driving units 10 are mounted on the needle head 1, the needle head driving units 10 are relatively independent, the needle head 1 can be selectively driven according to actual requirements, and picking and placing actions of the needle head 1 on chips 2 can be carried out, for example, in some publications, the number of the chips 2 is smaller than that of the needle heads 1, the needle heads 1 corresponding to the number of the chips 2 are selected, a single needle head 1 corresponds to a single chip 2, a plurality of needle heads 1 carry out simultaneous picking and placing actions on the corresponding chips 2, and the rest of the needle heads 1 can be subjected to idle processing; in some disclosures, the number of the chips 2 is equal to that of the needles 1, a single needle 1 corresponds to a single chip 2, and the plurality of needles 1 simultaneously pick and place the corresponding chips 2, so that the plurality of chips 2 are simultaneously transported; in some disclosures, the number of the chips 2 is larger than that of the needles 1, a single needle 1 corresponds to a single chip 2, a plurality of needles 1 perform simultaneous pick-and-place actions on the corresponding chips 2, after the pick-and-place actions are finished, the rest chips 2 are picked and placed by using the same needle 1, and other needles 1 are idle; thereby saving energy consumption and improving the productivity of the die bonder in the same time.
In some disclosures, the needle driving unit 10 may be an XYZ linear motion servo mechanism, assuming that the vertical direction is the Z direction and the plane where the chip 2 is located is an XY plane, the needle driving unit 10 drives the needle 1 to move in the vertical direction to pick and place the chip 2; when the chip 2 and the needle head 1 deviate on the plane of the chip 2, the needle head 1 is adjusted on the plane of the chip 2 in an X-line and Y-line mode, so that the needle head 1 and the chip 2 are focused;
in some disclosures, the needle driving unit 10 may be a motion servo mechanism with an XZ straight line and a Y rotation, and assuming that the vertical direction is a Z direction and the plane where the chip 2 is located is an XY plane, the needle driving unit 10 drives the needle 1 to move in the vertical direction to pick and place the chip 2; when the chip 2 and the needle head 1 deviate on the plane of the chip 2, the needle head 1 is adjusted on the plane of the chip 2 in an X-line and Y-rotation mode, so that the needle head 1 and the chip 2 are focused;
in some disclosures, the needle driving unit 10 may be a movement servo mechanism of X rotation, Y rotation and Z straight line, and assuming that the vertical direction is the Z direction and the plane where the chip 2 is located is an XY plane, the needle driving unit 10 drives the needle 1 to move in the vertical direction to pick and place the chip 2; when the chip 2 and the needle 1 deviate on the plane of the chip 2, the needle 1 is adjusted on the plane of the chip 2 by using an X-rotation mode and a Y-rotation mode, so that the needle 1 and the chip 2 are focused.
Certainly, the needle driving unit 10 is not limited to the above cases, and may be in other cases as long as the position of the needle 1 can be adjusted, so that the needle 1 can focus on the corresponding chip 2 when the needle 1 takes and places the chip 2.
The motion servo mechanisms for the X-line, the Y-line and the Z-line in the embodiments include, but are not limited to, a screw nut transmission, an air cylinder, an electric cylinder, an axis slide rail, a gear rack, a synchronous belt mechanism, a variable frequency motor and the like in some disclosures.
For the rotary motion servo mechanism, the Y rotary motion servo mechanism and the X rotary motion servo mechanism in the embodiments, some disclosures include, but are not limited to, a spiral rotary mechanism, a cam rotary mechanism, a crank rotary mechanism, a motor drive, a gear transmission, and the like.
During the use, the CCD camera is shot and is counted into chip 2 position, and the system adjusts the position of every syringe needle 1 according to chip 2 actual position, makes syringe needle 1 position focus with the position of the chip 2 that corresponds, and after focusing is accomplished, keeps the position of syringe needle 1 fixed, then directly gets simultaneously through many syringe needles 1 and puts chip 2.
In the description herein, references to the description of "one embodiment," "an example," "a specific example," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the disclosure. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
The foregoing illustrates and describes the general principles, principal features, and advantages of the present disclosure. It will be understood by those skilled in the art that the present disclosure is not limited to the embodiments described above, which are presented solely for purposes of illustrating the principles of the disclosure, and that various changes and modifications may be made to the disclosure without departing from the spirit and scope of the disclosure, which is intended to be covered by the claims.
Claims (5)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011241434.2A CN112309944A (en) | 2020-11-09 | 2020-11-09 | Die bonder and method for picking and placing chip by needle head |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011241434.2A CN112309944A (en) | 2020-11-09 | 2020-11-09 | Die bonder and method for picking and placing chip by needle head |
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| Publication Number | Publication Date |
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| CN112309944A true CN112309944A (en) | 2021-02-02 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202011241434.2A Pending CN112309944A (en) | 2020-11-09 | 2020-11-09 | Die bonder and method for picking and placing chip by needle head |
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Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004006512A (en) * | 2002-05-31 | 2004-01-08 | Matsushita Electric Ind Co Ltd | Part mounting substrate manufacturing apparatus |
| CN102184874A (en) * | 2011-04-02 | 2011-09-14 | 何永基 | Chip bonding system and method |
| CN203536379U (en) * | 2013-10-25 | 2014-04-09 | 深圳市恒睿智达科技有限公司 | A multi-soldering-arm device for a die bonder |
| CN106024685A (en) * | 2014-10-17 | 2016-10-12 | 华开朗 | Chip tray pushing device |
| CN107180779A (en) * | 2017-05-16 | 2017-09-19 | 杭州长川科技股份有限公司 | Multifunctional integrated circuit nozzle unit |
| CN109411397A (en) * | 2018-12-06 | 2019-03-01 | 深圳市佳思特光电设备有限公司 | Semiconductor chip packaging is bonded mould group and bonding technology |
| CN111370350A (en) * | 2020-03-19 | 2020-07-03 | 深圳新益昌科技股份有限公司 | Die bonder |
| CN213212138U (en) * | 2020-11-09 | 2021-05-14 | 博讯光电科技(合肥)有限公司 | Die bonder |
-
2020
- 2020-11-09 CN CN202011241434.2A patent/CN112309944A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004006512A (en) * | 2002-05-31 | 2004-01-08 | Matsushita Electric Ind Co Ltd | Part mounting substrate manufacturing apparatus |
| CN102184874A (en) * | 2011-04-02 | 2011-09-14 | 何永基 | Chip bonding system and method |
| CN203536379U (en) * | 2013-10-25 | 2014-04-09 | 深圳市恒睿智达科技有限公司 | A multi-soldering-arm device for a die bonder |
| CN106024685A (en) * | 2014-10-17 | 2016-10-12 | 华开朗 | Chip tray pushing device |
| CN107180779A (en) * | 2017-05-16 | 2017-09-19 | 杭州长川科技股份有限公司 | Multifunctional integrated circuit nozzle unit |
| CN109411397A (en) * | 2018-12-06 | 2019-03-01 | 深圳市佳思特光电设备有限公司 | Semiconductor chip packaging is bonded mould group and bonding technology |
| CN111370350A (en) * | 2020-03-19 | 2020-07-03 | 深圳新益昌科技股份有限公司 | Die bonder |
| CN213212138U (en) * | 2020-11-09 | 2021-05-14 | 博讯光电科技(合肥)有限公司 | Die bonder |
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