CN112240530B - Light emitting module and vehicle lamp - Google Patents

Abstract

The present invention provides a novel light-emitting module and a vehicle lamp that can realize a plurality of light distributions and contribute to the miniaturization of a vehicle lamp. The light emitting module has: a first light source, which emits light forming a first light distribution pattern, and is composed of at least one first semiconductor light emitting element; a second light source, which emits light forming a second light distribution pattern, and is composed of at least one One or more second semiconductor light emitting elements; a lighting control circuit, which controls the lighting of each semiconductor light emitting element; and a heat sink, which has a first element mounting surface that can be mounted on the first semiconductor light emitting The second element mounting surface on which the second semiconductor light emitting element is mounted, and the circuit mounting surface on which the lighting control circuit can be mounted. The circuit mounting surface is formed to be perpendicular or inclined with respect to the first element mounting surface, which is a different surface from the second element mounting surface.

Description

Light emitting module and vehicle lamp

technical field

The invention relates to a light emitting module.

Background technique

The development of technologies that use semiconductor light-emitting elements such as LEDs (Light Emitting Diode) as light sources in vehicle lamps has been in progress. In such a vehicle lamp, a circuit for controlling lighting of the semiconductor light emitting element is sometimes required. Therefore, a light-emitting module has been proposed that includes a semiconductor light-emitting element, a lighting control circuit that controls the lighting of the semiconductor light-emitting element, and a heat dissipation plate that has an element-mounting surface on which the semiconductor light-emitting element can be mounted and a point that can supply points. The circuit mounting surface on which the light control circuit is mounted (refer to Patent Document 1).

prior art literature

patent documents

Patent Document 1: JP 2012-74217

Contents of the invention

The problem to be solved by the invention

On the other hand, the number of components increases due to the electrification and multi-functionalization of vehicles, and the size and space saving of vehicle lamps are also required due to the requirement of freedom in component layout and vehicle design. However, for example, the light-emitting modules described in the above-mentioned patent documents mainly form light distribution patterns for low beams, and cannot form light distributions for both low beams and high beams.

The present invention has been made in view of such a situation, and an object of the present invention is to provide a novel light-emitting module that can realize a plurality of light distributions and contribute to downsizing of a vehicle lamp.

means of solving problems

In order to solve the above-mentioned problems, a light-emitting module according to an aspect of the present invention includes: a first light source that emits light forming a first light distribution pattern and is composed of at least one first semiconductor light-emitting element; The light of the second light distribution pattern different from the first light distribution pattern is composed of at least one second semiconductor light emitting element; the lighting control circuit controls the lighting of the first semiconductor light emitting element and the second semiconductor light emitting element and a heat dissipation plate having a first element mounting surface capable of mounting a first semiconductor light emitting element, a second element mounting surface capable of mounting a second semiconductor light emitting element, and a circuit mounting capable of mounting a lighting control circuit noodle. The circuit mounting surface is formed to be perpendicular or inclined to at least one of the first element mounting surface and the second element mounting surface, and the first element mounting surface is a different surface from the second element mounting surface.

According to this aspect, since a plurality of light sources configured to form a plurality of light distribution patterns and a lighting control circuit for controlling lighting of the plurality of light sources are mounted on one heat sink, the light emitting module can be downsized.

The first element mounting surface may be formed such that the orientation of the light emitting surface of the first semiconductor light emitting element mounted thereon is different from the orientation of the light emitting surface of the second semiconductor light emitting element mounted on the second element mounting surface. Thereby, since light can be emitted in multiple directions, various light distributions can be formed.

Alternatively, the first light source may have a luminance of 300 to 2000 [lm], consume electric power of 3 to 20 [W], and emit light for forming a low beam light distribution pattern as the first light distribution pattern. Alternatively, the second light source may have a luminance of 150 to 1300 [lm], consume electric power of 1.5 to 13 [W], and emit light for forming a high beam light distribution pattern as the second light distribution pattern.

The heat dissipation plate may be an aluminum plate having a surface area of 16 to 200 [cm ² ] and a thickness of 1 to 5 [mm]. Thereby, a small heat sink can be realized.

Alternatively, the edge of the circuit board provided with the lighting control circuit is provided with a card edge connector, and the heat dissipation plate is formed with a cutout for a socket fitted with the card edge connector to enter. As a result, the socket does not interfere with the heat dissipation plate in a state where the socket and the card edge connector are fitted, and the circuit board can be brought closer to the heat dissipation plate.

The light emitting module may further include a shield covering the lighting control circuit to suppress leakage of electromagnetic noise to the outside. It is also possible that the shield has a locking portion, and the locking portion is locked to a part of the socket so that the card edge connector fitted with the socket will not fall off. Thus, even if no special design is provided for the socket, the shield can prevent the socket from falling off.

Another aspect of the present invention is a vehicle lamp. The vehicular lamp includes: the light-emitting module described above; a first reflector that reflects light emitted from the first semiconductor light-emitting element toward the front of the vehicle to form a low-beam light distribution pattern; The second reflector that reflects from the front of the vehicle to form a light distribution pattern for high beams. Alternatively, the heat sink may have a first element mounting surface such that the light emitting surface of the first semiconductor light emitting element faces upward, and a second element mounting surface such that the light emitting surface of the second semiconductor light emitting element faces downward. .

According to this aspect, in the vehicle lamp capable of forming the light distribution pattern for low beam and the light distribution pattern for high beam, since a plurality of light sources and a lighting control circuit for controlling the lighting of the plurality of light sources are mounted on one radiator board, it is possible to miniaturize the vehicle lamp.

The vehicle lamp may further include: an opening formed between the first reflector and the second reflector into which a part of the light-emitting module is inserted; and a guide formed from the opening toward the front of the vehicle. Thereby, by inserting the light emitting module from the opening, the light emitting module can be attached to a predetermined position with respect to each reflector.

Still another aspect of the present invention is a vehicle lamp. The vehicular lamp may include: the light-emitting module described above; a reflector that reflects light emitted from the first light source toward the front of the vehicle to form a low beam light distribution pattern; and transmits light emitted from the second light source toward the front of the vehicle to form Lens with light distribution pattern for high beam. Alternatively, the radiator plate may be formed with a first element mounting surface such that the light emitting surface of the first semiconductor light emitting element faces upward, and a second element mounting surface may be formed such that the light emitting surface of the second semiconductor light emitting element faces toward the front of the vehicle. noodle.

According to this aspect, in the vehicle lamp capable of forming the light distribution pattern for low beam and the light distribution pattern for high beam, since a plurality of light sources and a lighting control circuit for controlling the lighting of the plurality of light sources are mounted on one radiator board, it is possible to miniaturize the vehicle lamp.

The output of the second light source may be smaller than that of the first light source when forming the light distribution pattern for high beam. Thereby, the number of semiconductor light emitting elements in the second light source can be reduced, or low output semiconductor light emitting elements can be used. In addition, by suppressing heat generation by the second light source, it is possible to reduce the size and thickness of the radiator plate.

In addition, any combination of the above constituent elements and an expression form of the present invention are also effective as embodiments of the present invention by converting between methods, apparatuses, systems, and the like.

Invention effect

According to the present invention, it is possible to provide a novel light-emitting module capable of realizing a plurality of light distributions and contributing to downsizing of a vehicle lamp.

Description of drawings

FIG. 1 is a side view showing a schematic configuration of a vehicle headlamp according to a first embodiment.

Fig. 2 is a perspective view of the heat sink according to the first embodiment.

3 is a perspective view showing a schematic configuration of the light emitting module according to the first embodiment.

4 is a partial cross-sectional view for explaining wiring in the light emitting module according to the first embodiment.

5 is a diagram showing an example of wiring between the lighting control circuit and each element according to the first embodiment.

6 is a partial cross-sectional view illustrating another example of wiring in the light emitting module according to the first embodiment.

7 is a diagram showing another example of wiring between the lighting control circuit and each element according to the first embodiment.

8 is a side view showing a schematic configuration of a vehicle headlamp according to a second embodiment.

9 is a partial cross-sectional view for explaining wiring in the light emitting module according to the second embodiment.

(a) in FIG. 10 is a front view of the reflector according to the third embodiment, and (b) in FIG. 10 is for explaining a state where a light-emitting module is inserted into the reflector according to the third embodiment. (c) in FIG. 10 is a main part plan view for explaining the state of inserting the light emitting module into the reflector according to the third embodiment.

Fig. 11 is an exploded perspective view showing a schematic configuration of a light emitting module according to a fourth embodiment.

Fig. 12 is an exploded perspective view showing a schematic configuration of another light emitting module according to the fourth embodiment.

Explanation of reference signs

10: vehicle headlight; 12: light emitting module; 14: first reflector; 16: second reflector; 18: first semiconductor light emitting element; 20: first light source; 22: second semiconductor light emitting element; 24 : second light source; 26: lighting control circuit; 26a: circuit substrate; 26b: edge; 28: heat dissipation plate; 28a: first element mounting surface; 28b: second element mounting surface; 28c: circuit mounting surface; 30 : connection terminal; 36: light emitting module; 38: heat dissipation plate; 38a: opening; 42: connection terminal; 44: light emitting module; 50: vehicle headlight; 52: light emitting module; 54: projection lens; 56: heat dissipation Board; 56a: first element mounting surface; 56b: second element mounting surface; 56c: circuit mounting surface; 56d: opening; 58: connection terminal; 60: reflector; 60a: opening; 62: guide; 62a : slot; 64: light emitting module; 66: card edge connector; 68: socket; 70: shield; 70a: locking part.

Detailed ways

Hereinafter, the present invention will be described based on embodiments with reference to the drawings. The same or equivalent structural elements, components, and processes shown in the drawings are given the same reference numerals, and redundant descriptions are appropriately omitted. In addition, the embodiment is not a limitation of the invention but an example, and not all the features and combinations described in the embodiment are essential to the invention.

In addition, in each of the following embodiments, a lamp for a vehicle such as a two-wheeled vehicle and a four-wheeled vehicle, especially a vehicle headlight for a two-wheeled vehicle requiring low cost and space saving will be described as an example.

(first embodiment)

FIG. 1 is a side view showing a schematic configuration of a vehicle headlamp according to a first embodiment. Fig. 2 is a perspective view of the heat sink according to the first embodiment. 3 is a perspective view showing a schematic configuration of the light emitting module according to the first embodiment.

The vehicle headlamp 10 includes a light emitting module 12 , a first reflector 14 , and a second reflector 16 . The light emitting module 12 has: a first light source 20, which emits light forming a first light distribution pattern, and is composed of at least one first semiconductor light emitting element 18; a second light source 24, which emits light forming a second light distribution pattern , and is composed of at least one second semiconductor light emitting element 22; a lighting control circuit 26, which controls the lighting of the first semiconductor light emitting element 18 and the second semiconductor light emitting element 22; and a cooling plate 28.

As the semiconductor light emitting element, LED, LD (Laser Diode), OLED (Organic Light Emitting Diode) are used, for example. In addition, the reflective surface of the first reflector 14 is configured to reflect the light L1 emitted from the first semiconductor light emitting element 18 toward the front of the vehicle to form a light distribution pattern for low beam. Similarly, the reflective surface of the second reflector 16 is configured to reflect the light L2 emitted from the second semiconductor light emitting element 22 toward the front of the vehicle to form a light distribution pattern for high beam.

The heat sink 28 has a first element mounting surface 28a on which the first semiconductor light emitting element 18 can be mounted, a second element mounting surface 28b on which the second semiconductor light emitting element 22 can be mounted, and a circuit mounting surface 28b on which the lighting control circuit 26 can be mounted. Surface 28c. The heat dissipation plate 28 is preferably an inexpensive material with high heat dissipation, for example, an aluminum plate with a thickness of 1 to 5 [mm] and good heat conductivity. The width W1 of the cooling plate 28 can be 50-80mm, the length D1 of the circuit mounting surface 28c can be 80-120mm, and the length D2 of the first element mounting surface 28a (second element mounting surface 28b) can be in the range of 30-50mm. Alternatively, the surface area of the radiator plate 28 may be 16 to 200 [cm ² ]. Thereby, a small heat sink can be realized.

In addition, the heat dissipation plate 28 is formed with a plurality of screw holes 28d through which screws used when fixing the heat dissipation plate 28 to the lamp pass; The connection terminal through which the second semiconductor light emitting element 22 and the lighting control circuit 26 are connected passes through. The circuit mounting surface 28c is formed to be perpendicular to or inclined with respect to at least one of the first element mounting surface 28a and the second element mounting surface 28b.

In this way, in the light emitting module 12 according to the present embodiment, the first light source 20 and the second light source 24 capable of forming a plurality of light distribution patterns, and the lighting control circuit 26 for controlling the lighting of the plurality of light sources are configured. Mounted on an L-shaped heat sink 28 . Therefore, the light emitting module 12 can be downsized and space-saving, and the length in the vehicle front-rear direction can be made compact.

The first light source 20 has a luminance of 300 to 2000 [lm] and a power consumption of 3 to 20 [W], and emits light L1 for forming a low beam light distribution pattern. The second light source 24 has a luminance of 150 to 1300 [lm] and a power consumption of 1.5 to 13 [W], and emits light L2 for forming a light distribution pattern for high beam.

The first element mounting surface 28a is a different surface from the second element mounting surface 28b. The faces are oriented differently (opposite in Figure 1). That is, in the heat sink 28 according to the present embodiment, the first element mounting surface 28a is formed so that the light emitting surface of the first semiconductor light emitting element 18 faces upward, and the light emitting surface of the second semiconductor light emitting element 22 faces downward. The second element mounting surface 28b is formed in this manner. Thereby, since light can be emitted in multiple directions, various light distributions can be formed.

4 is a partial cross-sectional view for explaining wiring in the light emitting module according to the first embodiment. 5 is a diagram showing an example of wiring between the lighting control circuit and each element according to the first embodiment.

As shown in FIG. 4 , the lighting control circuit 26 is connected to the element substrate 19 on which the first semiconductor light emitting element 18 is mounted and the element substrate 23 on which the second semiconductor light emitting element 22 is mounted via connection terminals 30 and 32 . In addition, in the second light source 24 , a switch 34 is provided in parallel with the second semiconductor light emitting element 22 . When the switch 34 is turned on while the current is flowing through the lighting control circuit 26 to the first light source 20, only the first semiconductor light emitting element 18 is turned on to form a light distribution pattern for low beam. In addition, in the state where the current is passed through the lighting control circuit 26 to the first light source 20, if the switch 34 is turned off, the second semiconductor light emitting element 22 is also lighted in addition to the first semiconductor light emitting element 18, thereby forming a remote light source. Light distribution pattern for light.

In this way, in the vehicle headlamp 10 according to the present embodiment capable of forming the light distribution pattern for low beam and the light distribution pattern for high beam, the first light source 20 and the second light source 24 and the lighting of each light source Since the lighting control circuit 26 for controlling is mounted on one radiator plate 28, the vehicle headlamp 10 itself can be downsized.

In addition, the light emitting module 12 according to this embodiment has two LED chips as the first semiconductor light emitting element 18 and one LED chip as the second semiconductor light emitting element 22 . Furthermore, when the vehicle headlamp 10 forms a light distribution pattern for low beam, a driving current If=0.7A and a forward voltage Vf=3.3V are applied to the two first semiconductor light emitting elements 18, thereby passing 4.4W The power consumption of the light beam is 500 lumens.

In the case of forming the high beam light distribution pattern of the vehicle headlamp 10, a driving current If=0.7A and a forward voltage Vf=3.3 are applied to the two first semiconductor light emitting elements 18 and one second semiconductor light emitting element 22. V, so that a beam of 750 lumens can be obtained by 6.6W of power consumption.

6 is a partial cross-sectional view illustrating another example of wiring in the light emitting module according to the first embodiment.

Compared with the light emitting module 36 shown in FIG. 6 and the heat sink 28 of the light emitting module 12 shown in FIG. 4 , the structure of the heat sink 38 is different. Specifically, the opening 38a through which the connection terminal 42 passes is formed between the first element mounting surface 28a and the second element mounting surface 28b. Furthermore, the element substrate 23 on which the second semiconductor light emitting element 22 is mounted is connected not to the lighting control circuit 26 but to the element substrate 19 .

7 is a diagram showing another example of wiring between the lighting control circuit and each element according to the first embodiment. In the light emitting module 44 shown in FIG. 7 , a first light source 20 composed of three first semiconductor light emitting elements 18 and a second light source 24 composed of two second semiconductor light emitting elements 22 are connected to a lighting control circuit 26 . Also, in the first light source 20 , a switch 46 is connected in series with the first semiconductor light emitting element 18 , and in the second light source 24 , a switch 48 is connected in series with the second semiconductor light emitting element 22 .

When the current is passed through the lighting control circuit 26 to the first light source 20 (the switch 46 is turned on), if the switch 48 is turned off, only the first semiconductor light emitting element 18 is turned on to form a light distribution pattern for low beam. In addition, in the state where the switch 46 is turned off and the switch 48 is turned on, one first semiconductor light emitting element 18 and two second semiconductor light emitting elements 22 are turned on by the lighting control circuit 26, thereby forming a high beam. Lighting pattern.

In the case of forming the light distribution pattern for low beam in the vehicle headlamp equipped with the light emitting module 44 shown in FIG. 3.3V, so that a light beam of 1000 lumens can be obtained by consuming electric power of 10W.

In addition, when the vehicle headlamp including the light emitting module 44 forms a light distribution pattern for high beam, by applying a drive current If=1.0A to one first semiconductor light emitting element 18 and two second semiconductor light emitting elements 22, Forward voltage Vf=3.3V, so that a light beam of 1000 lumens can be obtained by consuming electric power of 10W.

In the light emitting module 12 and the light emitting module 44 described above, the output of the second light source 24 is smaller than that of the first light source 20 when forming the light distribution pattern for high beam. Accordingly, the number of second semiconductor light emitting elements 22 in the second light source 24 can be reduced, or low output second semiconductor light emitting elements 22 can be used. In addition, by suppressing heat generation by the second light source 24, the heat sink plate can be reduced in size and thickness.

(second embodiment)

8 is a side view showing a schematic configuration of a vehicle headlamp according to a second embodiment. 9 is a partial cross-sectional view for explaining wiring in the light emitting module according to the second embodiment.

The vehicle headlamp 50 includes a light emitting module 52 , a first reflector 14 that reflects the light L1 emitted from the first light source 20 toward the front of the vehicle to form a light distribution pattern for low beam, and makes the light emitted from the second light source 24 The projection lens 54 that transmits the L2 toward the front of the vehicle and forms a light distribution pattern for high beam. The heat dissipation plate 56 has a first element mounting surface 56a formed so that the light emitting surface of the first semiconductor light emitting element 18 faces upward, and a second element mounting surface 56a is formed so that the light emitting surface of the second semiconductor light emitting element 22 faces forward of the vehicle. Face 56b.

Compared with the light emitting module 52 shown in FIG. 9 and the heat sink 28 of the light emitting module 12 shown in FIG. 4 , the structure of the heat sink 56 is different. Specifically, openings 56d and 56e through which the connection terminals 58 pass are formed on the circuit mounting surface 56c and the second element mounting surface 56b. Furthermore, the element substrate 23 on which the second semiconductor light emitting element 22 is mounted is connected to the lighting control circuit 26 via the connection terminal 58 .

Thus, in the vehicle headlamp 50 capable of forming the light distribution pattern for low beam and the light distribution pattern for high beam, the first light source 20, the second light source 24, and the lighting control for controlling the lighting of each light source Since the electric circuit 26 is mounted on one radiator plate 56, the vehicle headlamp 50 itself can be downsized.

(third embodiment)

(a) in FIG. 10 is a front view of the reflector according to the third embodiment, and (b) in FIG. 10 is for explaining a state where a light-emitting module is inserted into the reflector according to the third embodiment. (c) in FIG. 10 is a main part plan view for explaining the state of inserting the light emitting module into the reflector according to the third embodiment.

The reflector 60 composed of the first reflector 14 and the second reflector 16 has an opening 60a formed at the bottom thereof, and two guides 62 are provided so as to protrude from the edge of the opening 60a toward the front of the vehicle. The guide portion 62 is formed with a groove 62a, and by inserting the rectangular plate portion 29 having the first element mounting surface 28a and the second element mounting surface 28b of the heat sink 28 into the groove 62a, the light emitting module is positioned relative to the reflector 60. 12 remains firmly in place.

In this way, the vehicle headlight having the opening 60a formed between the first reflector 14 and the second reflector 16 into which a part of the light emitting module 12 is inserted and the guide portion 62 formed from the opening 60a toward the front of the vehicle In the lamp, the light emitting module 12 can be attached to a predetermined position with respect to the reflector 60 by inserting the light emitting module 12 from the opening 60a.

(fourth embodiment)

Fig. 11 is an exploded perspective view showing a schematic configuration of a light emitting module according to a fourth embodiment. Fig. 12 is an exploded perspective view showing a schematic configuration of another light emitting module according to the fourth embodiment. In the light emitting module 64, the card edge connector 66 is formed in the edge part 26b of the circuit board 26a provided with the lighting control circuit 26. As shown in FIG. The heat sink plate 28 is formed with a cutout 28f for the socket 68 fitted with the card edge connector 66 to enter. As a result, the receptacle 68 does not interfere with the heat sink 28 in a state where the card edge connector 66 is fitted, which facilitates assembly and brings the lighting control circuit 26 closer to the heat sink 28 . In addition, by feeding power through the card edge connector 66, the power input connector portion can be reduced in size and cost.

The light emitting module 64 also has a conductive shield 70 that covers the lighting control circuit 26 to suppress leakage of electromagnetic noise to the outside. The shield 70 has a locking portion 70a, and the locking portion 70a is locked to a part 68a of the socket 68 so that the card edge connector 66 fitted with the socket 68 will not fall off. Accordingly, even if no special design is provided for the socket 68, the shield 70 can prevent the socket 68 from falling off, thereby improving connection reliability.

As mentioned above, the present invention has been described with reference to the above-mentioned embodiments, but the present invention is not limited to the above-mentioned embodiments, and structures obtained by appropriately combining and substituting the structures of the respective embodiments are also included in the present invention. . In addition, based on the knowledge of those skilled in the art, it is also possible to appropriately reorganize the combinations and the order of processing in each embodiment, and to add various modifications such as design changes to each embodiment. Embodiments with such modifications are also included in within the scope of the present invention.

Claims (9)

1. A light-emitting module, characterized in that, The light emitting module has: A first light source, which emits light forming a first light distribution pattern, and is composed of at least one first semiconductor light emitting element; A second light source, which emits light forming a second light distribution pattern different from the first light distribution pattern, and is composed of at least one second semiconductor light emitting element; a lighting control circuit that controls lighting of the first semiconductor light emitting element and the second semiconductor light emitting element; and A heat sink having a first element mounting surface on which the first semiconductor light emitting element can be mounted, a second element mounting surface on which the second semiconductor light emitting element can be mounted, and a surface on which the lighting control circuit can be mounted. circuit mounting surface, The circuit mounting surface is formed to be perpendicular to or inclined relative to at least one of the first element mounting surface and the second element mounting surface, The first component mounting surface is a different surface from the second component mounting surface, The circuit substrate provided with the lighting control circuit is provided with a card edge connector at the edge, The heat dissipation plate is formed with a cutout for the socket fitted with the card edge connector to enter, The circuit mounting surface is oriented in a direction opposite to a direction in which light is emitted. 2. The light emitting module according to claim 1, characterized in that, The first element mounting surface is formed such that the orientation of the light emitting surface of the first semiconductor light emitting element mounted thereon is different from the orientation of the light emitting surface of the second semiconductor light emitting element mounted on the second element mounting surface. 3. The light emitting module according to claim 1 or 2, characterized in that, The brightness of the first light source is 300-2000lm, the power consumption is 3-20W, and the light used to form the light distribution pattern for low beam is emitted as the first light distribution pattern, The brightness of the second light source is 150-1300lm, the power consumption is 1.5-13W, and emits light for forming a light distribution pattern for high beam as the second light distribution pattern. 4. The lighting module according to claim 3, characterized in that, The heat dissipation plate is an aluminum plate with a surface area of 16-200 cm ² and a thickness of 1-5 mm. 5. The lighting module according to claim 1, characterized in that, The light emitting module further has a shield that covers the lighting control circuit to suppress leakage of electromagnetic noise to the outside, The shield has a locking portion, and the locking portion is locked to a part of the socket so that the card edge connector fitted with the socket will not fall off. 6. A lamp for a vehicle, characterized in that, The vehicle lamp has: The light emitting module according to any one of claims 1 to 5; a first reflector that reflects light emitted from the first semiconductor light emitting element toward the front of the vehicle to form a low beam light distribution pattern; and a second reflector that reflects light emitted from the second semiconductor light emitting element toward the front of the vehicle to form a light distribution pattern for high beam, The heat sink is formed with the first element mounting surface such that the light emitting surface of the first semiconductor light emitting element faces upward, and forms the heat sink so that the light emitting surface of the second semiconductor light emitting element faces downward. The second component mounting surface is described. 7. The vehicle lamp according to claim 6, wherein: The vehicle lamp also has: an opening formed between the first reflector and the second reflector and into which a part of the light emitting module is inserted; and A guide portion is formed from the opening toward the front of the vehicle. 8. A lamp for a vehicle, characterized in that, The vehicle lamp has: The light emitting module according to any one of claims 1 to 5; a reflector that reflects the light emitted from the first light source toward the front of the vehicle to form a low beam light distribution pattern; and a lens that transmits light emitted from the second light source toward the front of the vehicle to form a light distribution pattern for high beam, The heat sink is formed with the first element mounting surface such that the light emitting surface of the first semiconductor light emitting element faces upward, and the heat sink is formed with the light emitting surface of the second semiconductor light emitting element facing forward of the vehicle. The second component mounting surface. 9. The vehicle lamp according to any one of claims 6 to 8, characterized in that, The output of the second light source is smaller than that of the first light source when forming the light distribution pattern for high beam.

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