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CN111508885A - 静电吸盘 - Google Patents

静电吸盘 Download PDF

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Publication number
CN111508885A
CN111508885A CN201911345382.0A CN201911345382A CN111508885A CN 111508885 A CN111508885 A CN 111508885A CN 201911345382 A CN201911345382 A CN 201911345382A CN 111508885 A CN111508885 A CN 111508885A
Authority
CN
China
Prior art keywords
groove
grooves
region
gas introduction
gas
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN201911345382.0A
Other languages
English (en)
Chinese (zh)
Other versions
CN111508885B (zh
Inventor
池口雅文
糸山哲朗
西愿修一郎
白石纯
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toto Ltd
Original Assignee
Toto Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toto Ltd filed Critical Toto Ltd
Priority to CN202510254170.0A priority Critical patent/CN120300053A/zh
Publication of CN111508885A publication Critical patent/CN111508885A/zh
Application granted granted Critical
Publication of CN111508885B publication Critical patent/CN111508885B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67109—Apparatus for thermal treatment mainly by convection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/3244—Gas supply means
    • H01J37/32449—Gas control, e.g. control of the gas flow
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32715—Workpiece holder
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32715—Workpiece holder
    • H01J37/32724—Temperature
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32798—Further details of plasma apparatus not provided for in groups H01J37/3244 - H01J37/32788; special provisions for cleaning or maintenance of the apparatus
    • H01J37/32853—Hygiene
    • H01J37/32862—In situ cleaning of vessels and/or internal parts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
    • H01L21/6833—Details of electrostatic chucks

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Drying Of Semiconductors (AREA)
CN201911345382.0A 2018-12-21 2019-12-20 静电吸盘 Active CN111508885B (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202510254170.0A CN120300053A (zh) 2018-12-21 2019-12-20 静电吸盘

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018-239399 2018-12-21
JP2018239399 2018-12-21

Related Child Applications (1)

Application Number Title Priority Date Filing Date
CN202510254170.0A Division CN120300053A (zh) 2018-12-21 2019-12-20 静电吸盘

Publications (2)

Publication Number Publication Date
CN111508885A true CN111508885A (zh) 2020-08-07
CN111508885B CN111508885B (zh) 2025-03-25

Family

ID=71140110

Family Applications (2)

Application Number Title Priority Date Filing Date
CN201911345382.0A Active CN111508885B (zh) 2018-12-21 2019-12-20 静电吸盘
CN202510254170.0A Pending CN120300053A (zh) 2018-12-21 2019-12-20 静电吸盘

Family Applications After (1)

Application Number Title Priority Date Filing Date
CN202510254170.0A Pending CN120300053A (zh) 2018-12-21 2019-12-20 静电吸盘

Country Status (4)

Country Link
JP (1) JP7484152B2 (ja)
KR (1) KR102296560B1 (ja)
CN (2) CN111508885B (ja)
TW (1) TWI748304B (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI803809B (zh) * 2021-01-18 2023-06-01 得立亞科技有限公司 用於靜電吸盤的參數分析方法

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06275546A (ja) * 1993-03-24 1994-09-30 Tokyo Electron Ltd プラズマ処理装置
US5382311A (en) * 1992-12-17 1995-01-17 Tokyo Electron Limited Stage having electrostatic chuck and plasma processing apparatus using same
JPH07335630A (ja) * 1994-06-13 1995-12-22 Hitachi Ltd 真空処理装置
JP2000332091A (ja) * 1999-05-25 2000-11-30 Toto Ltd 静電チャックおよび処理装置
US6215641B1 (en) * 1998-03-06 2001-04-10 VENTEC GESELLSCHAFT FüR VENTUREKAPITAL UND UNTERNEHMENSBERATUNG Electrostatic device for supporting wafers and other components for use at temperatures of up to 230° C.
US20010054389A1 (en) * 2000-06-14 2001-12-27 Yasumi Sago Electro-static chucking mechanism and surface processing apparatus
JP2005136104A (ja) * 2003-10-29 2005-05-26 Ngk Spark Plug Co Ltd 静電チャック
JP2006157032A (ja) * 2006-01-12 2006-06-15 Toto Ltd 静電チャック、静電吸着方法、加熱冷却処理装置、静電吸着処理装置
JP2013021151A (ja) * 2011-07-12 2013-01-31 Fujitsu Semiconductor Ltd 静電チャック及び半導体製造装置
TW201330164A (zh) * 2011-09-30 2013-07-16 Applied Materials Inc 具有溫度控制之靜電夾具

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3086970B2 (ja) * 1991-07-03 2000-09-11 東京エレクトロン株式会社 基板処理装置
JP4642358B2 (ja) * 2004-01-13 2011-03-02 株式会社日立ハイテクノロジーズ ウエハ載置用電極
JP2006253204A (ja) * 2005-03-08 2006-09-21 Hitachi High-Technologies Corp プラズマ処理装置の試料載置電極
KR20080061108A (ko) * 2006-12-28 2008-07-02 세메스 주식회사 기판을 지지하기 위한 척 및 이를 포함하는 기판 가공 장치
JP2011119708A (ja) * 2009-10-30 2011-06-16 Canon Anelva Corp 基板保持装置、及び、プラズマ処理装置
JP5462946B2 (ja) 2010-06-30 2014-04-02 株式会社アルバック 基板処理装置及び基板冷却方法
JP2012129547A (ja) 2012-02-25 2012-07-05 Tokyo Electron Ltd 基板載置台、基板処理装置、および温度制御方法

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5382311A (en) * 1992-12-17 1995-01-17 Tokyo Electron Limited Stage having electrostatic chuck and plasma processing apparatus using same
JPH06275546A (ja) * 1993-03-24 1994-09-30 Tokyo Electron Ltd プラズマ処理装置
JPH07335630A (ja) * 1994-06-13 1995-12-22 Hitachi Ltd 真空処理装置
US6215641B1 (en) * 1998-03-06 2001-04-10 VENTEC GESELLSCHAFT FüR VENTUREKAPITAL UND UNTERNEHMENSBERATUNG Electrostatic device for supporting wafers and other components for use at temperatures of up to 230° C.
JP2000332091A (ja) * 1999-05-25 2000-11-30 Toto Ltd 静電チャックおよび処理装置
US20010054389A1 (en) * 2000-06-14 2001-12-27 Yasumi Sago Electro-static chucking mechanism and surface processing apparatus
JP2005136104A (ja) * 2003-10-29 2005-05-26 Ngk Spark Plug Co Ltd 静電チャック
JP2006157032A (ja) * 2006-01-12 2006-06-15 Toto Ltd 静電チャック、静電吸着方法、加熱冷却処理装置、静電吸着処理装置
JP2013021151A (ja) * 2011-07-12 2013-01-31 Fujitsu Semiconductor Ltd 静電チャック及び半導体製造装置
TW201330164A (zh) * 2011-09-30 2013-07-16 Applied Materials Inc 具有溫度控制之靜電夾具

Also Published As

Publication number Publication date
TW202025378A (zh) 2020-07-01
KR102296560B1 (ko) 2021-09-01
CN120300053A (zh) 2025-07-11
CN111508885B (zh) 2025-03-25
KR20200078360A (ko) 2020-07-01
JP7484152B2 (ja) 2024-05-16
JP2020102618A (ja) 2020-07-02
TWI748304B (zh) 2021-12-01

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