CN109560018B - 基板处理装置和基板处理方法 - Google Patents
基板处理装置和基板处理方法 Download PDFInfo
- Publication number
- CN109560018B CN109560018B CN201811120882.XA CN201811120882A CN109560018B CN 109560018 B CN109560018 B CN 109560018B CN 201811120882 A CN201811120882 A CN 201811120882A CN 109560018 B CN109560018 B CN 109560018B
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- substrate
- liquid
- cup body
- cup
- processing
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- 239000000758 substrate Substances 0.000 title claims abstract description 232
- 238000012545 processing Methods 0.000 title claims abstract description 203
- 238000003672 processing method Methods 0.000 title claims abstract description 13
- 239000007788 liquid Substances 0.000 claims abstract description 392
- 238000011282 treatment Methods 0.000 claims abstract description 124
- 238000011084 recovery Methods 0.000 claims abstract description 103
- 239000002699 waste material Substances 0.000 claims abstract description 85
- 230000002093 peripheral effect Effects 0.000 claims description 49
- 238000004140 cleaning Methods 0.000 claims description 29
- 230000003028 elevating effect Effects 0.000 claims description 12
- 238000002360 preparation method Methods 0.000 claims 2
- 238000000034 method Methods 0.000 abstract description 15
- 238000000926 separation method Methods 0.000 abstract description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 51
- 239000007789 gas Substances 0.000 description 42
- 239000008367 deionised water Substances 0.000 description 20
- 229910021641 deionized water Inorganic materials 0.000 description 20
- 239000003595 mist Substances 0.000 description 10
- 238000012986 modification Methods 0.000 description 10
- 230000004048 modification Effects 0.000 description 10
- 230000005540 biological transmission Effects 0.000 description 9
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 6
- 238000004891 communication Methods 0.000 description 6
- 239000000126 substance Substances 0.000 description 6
- 238000012546 transfer Methods 0.000 description 5
- 238000004381 surface treatment Methods 0.000 description 4
- 238000003780 insertion Methods 0.000 description 3
- 230000037431 insertion Effects 0.000 description 3
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 2
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 230000001965 increasing effect Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 238000005406 washing Methods 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 1
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 1
- 229910021529 ammonia Inorganic materials 0.000 description 1
- 229910001873 dinitrogen Inorganic materials 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
- H01L21/02052—Wet cleaning only
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02057—Cleaning during device manufacture
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67023—Apparatus for fluid treatment for general liquid treatment, e.g. etching followed by cleaning
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Weting (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2017185312A JP6983602B2 (ja) | 2017-09-26 | 2017-09-26 | 基板処理装置及び基板処理方法 |
| JP2017-185312 | 2017-09-26 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN109560018A CN109560018A (zh) | 2019-04-02 |
| CN109560018B true CN109560018B (zh) | 2022-10-18 |
Family
ID=65864708
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811120882.XA Active CN109560018B (zh) | 2017-09-26 | 2018-09-26 | 基板处理装置和基板处理方法 |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP6983602B2 (ja) |
| KR (1) | KR102221337B1 (ja) |
| CN (1) | CN109560018B (ja) |
| TW (1) | TWI687266B (ja) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102271566B1 (ko) * | 2019-10-28 | 2021-07-01 | 세메스 주식회사 | 기판 처리 장치 |
| TWI711491B (zh) * | 2020-01-03 | 2020-12-01 | 弘塑科技股份有限公司 | 基板濕處理設備及回收環 |
| TWI755122B (zh) * | 2020-10-28 | 2022-02-11 | 辛耘企業股份有限公司 | 晶圓蝕刻機 |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002166216A (ja) * | 2000-11-29 | 2002-06-11 | Shibaura Mechatronics Corp | スピン処理装置及び飛散防止用カップ |
| JP2011249848A (ja) * | 2011-08-31 | 2011-12-08 | Tokyo Electron Ltd | 液処理装置及び液処理方法 |
| TW201215458A (en) * | 2010-06-03 | 2012-04-16 | Tokyo Electron Ltd | Substrate liquid processing apparatus |
| CN104916570A (zh) * | 2014-03-11 | 2015-09-16 | 斯克林集团公司 | 基板处理装置以及基板处理方法 |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2533339Y2 (ja) | 1991-06-28 | 1997-04-23 | 大日本スクリーン製造株式会社 | 基板の回転処理装置 |
| JPH09115873A (ja) * | 1995-10-20 | 1997-05-02 | Mitsubishi Electric Corp | 半導体の製造装置および半導体の製造方法 |
| JP3691227B2 (ja) * | 1996-10-07 | 2005-09-07 | 東京エレクトロン株式会社 | 液処理方法及びその装置 |
| JP2002329705A (ja) * | 2001-04-26 | 2002-11-15 | Shibaura Mechatronics Corp | スピン処理装置 |
| JP4319221B2 (ja) * | 2004-03-12 | 2009-08-26 | リアライズ・アドバンストテクノロジ株式会社 | 基板処理装置 |
| US8479753B2 (en) * | 2006-06-16 | 2013-07-09 | Tokyo Electron Limited | Liquid processing apparatus and method |
| TW200832587A (en) * | 2006-10-05 | 2008-08-01 | Tokyo Electron Ltd | Substrate processing equipment, substrate processing method and cleaning method of exhaust liquid cup |
| JP2008153521A (ja) * | 2006-12-19 | 2008-07-03 | Dainippon Screen Mfg Co Ltd | 回収カップ洗浄方法および基板処理装置 |
| JP5084639B2 (ja) * | 2008-06-30 | 2012-11-28 | 芝浦メカトロニクス株式会社 | スピン処理装置 |
| JP4949338B2 (ja) * | 2008-08-06 | 2012-06-06 | 東京エレクトロン株式会社 | 液処理装置 |
| JP5844681B2 (ja) * | 2011-07-06 | 2016-01-20 | 東京エレクトロン株式会社 | 基板液処理装置及び基板液処理方法 |
| JP6020271B2 (ja) * | 2013-03-18 | 2016-11-02 | 東京エレクトロン株式会社 | 液処理装置 |
-
2017
- 2017-09-26 JP JP2017185312A patent/JP6983602B2/ja active Active
-
2018
- 2018-09-07 TW TW107131482A patent/TWI687266B/zh active
- 2018-09-20 KR KR1020180113166A patent/KR102221337B1/ko active Active
- 2018-09-26 CN CN201811120882.XA patent/CN109560018B/zh active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002166216A (ja) * | 2000-11-29 | 2002-06-11 | Shibaura Mechatronics Corp | スピン処理装置及び飛散防止用カップ |
| TW201215458A (en) * | 2010-06-03 | 2012-04-16 | Tokyo Electron Ltd | Substrate liquid processing apparatus |
| JP2011249848A (ja) * | 2011-08-31 | 2011-12-08 | Tokyo Electron Ltd | 液処理装置及び液処理方法 |
| CN104916570A (zh) * | 2014-03-11 | 2015-09-16 | 斯克林集团公司 | 基板处理装置以及基板处理方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201929965A (zh) | 2019-08-01 |
| JP2019062075A (ja) | 2019-04-18 |
| KR20190035549A (ko) | 2019-04-03 |
| CN109560018A (zh) | 2019-04-02 |
| TWI687266B (zh) | 2020-03-11 |
| KR102221337B1 (ko) | 2021-03-02 |
| JP6983602B2 (ja) | 2021-12-17 |
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| PB01 | Publication | ||
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| GR01 | Patent grant |