CN109390299B - Power semiconductor device, motor controller, and vehicle - Google Patents

Abstract

The invention belongs to the field of electronic packaging devices, and specifically provides a power semiconductor device, a motor controller and a vehicle. The invention aims to solve the problem that the stray inductance at the connection port is relatively large and the power device does not have expandability caused by the connection mode of the busbar capacitance and the power module of the existing power device. The power semiconductor device of the present invention includes a plurality of electronic packaging devices. The electronic packaging device includes a packaging outer body and a power semiconductor unit and a capacitor arranged in the packaging outer body. The capacitor is connected to the DC side of the power semiconductor unit. Such a setting greatly shortens the distance between the power semiconductor unit and the capacitor, effectively reducing the stray inductance of the busbar; at the same time, such a setting also greatly improves the modularization of the power device and the scalability of the design.

Description

Power semiconductor devices, motor controllers and vehicles

technical field

The invention belongs to the field of electronic packaging devices, and specifically provides an electronic packaging device, a power semiconductor device, a motor controller and a vehicle.

Background technique

Taking the motor controller as an example, for the motor controller, the stray inductance of the DC busbar has an important influence on the system efficiency. Especially for the application of wide bandgap semiconductors, low stray inductance can effectively increase the switching speed of semiconductor devices and reduce switching losses.

For traditional motor controllers, semiconductor power modules and busbar capacitors are usually designed and manufactured separately, and then connected together by screws or welding during the final assembly process of the motor controller. In this way, although the design of the two is relatively independent, there is no need to over-consider the consistency and versatility of the busbar interface, but such a design method usually makes the stray inductance at the connection port of the semiconductor power module and the busbar capacitor larger, It becomes the bottleneck restricting the further optimization of the system. Secondly, the traditional design is not scalable. Systems with different power levels often need to redesign the power modules and busbar capacitors, which prolongs the system development cycle and increases hardware costs.

In order to achieve lower busbar stray inductance, improve the power density of the motor controller, and reduce the difficulty of assembling the motor controller in the final production process, it is best for the busbar capacitor and power module to have a unified and scalable Sexual overall design and packaging.

Correspondingly, a new electronic packaging device is needed in the art to solve the above problems.

Contents of the invention

In a first aspect, the present invention provides an electronic packaging device, comprising an outer packaging body, a power semiconductor unit and a capacitor disposed in the outer packaging body, and the capacitor is connected to a DC side of the power semiconductor unit.

In the preferred technical solution of the above-mentioned electronic packaging device, the electronic packaging device further includes a first capacitor DC terminal and a second capacitor DC terminal; one side of the first capacitor DC terminal is connected to the capacitor, and the first The other side of the DC terminal of the capacitor is connected to the DC side of the power semiconductor unit; one side of the DC terminal of the second capacitor is connected to the capacitor, and the other side of the DC terminal of the second capacitor is arranged through the On the outer body of the package.

In the preferred technical solution of the above-mentioned electronic packaging device, the electronic packaging device further includes an AC terminal, one side of the AC terminal is connected to the AC side of the power semiconductor unit, and the other side of the AC terminal is provided through the on the outer body of the package.

In a preferred technical solution of the above-mentioned electronic packaging device, the electronic packaging device further includes a heat dissipation structure disposed in the outer packaging body and arranged along the power semiconductor unit and/or the capacitor.

In a preferred technical solution of the above-mentioned electronic packaging device, the heat dissipation structure includes a coolant channel, and the coolant inlet and coolant outlet of the coolant channel are both arranged on the outer packaging body.

In a preferred technical solution of the above-mentioned electronic packaging device, the heat dissipation structure includes a plurality of heat dissipation through holes, and a heat dissipation opening of each of the heat dissipation through holes is arranged on the outer package body.

In a preferred technical solution of the above-mentioned electronic package device, the DC terminal of the first capacitor, the DC terminal of the second capacitor and the AC terminal all include a bus bar.

In a second aspect, the present invention also provides a power semiconductor device, including a plurality of electronic packaging devices described in any one of the above-mentioned preferred technical solutions; the DC terminals of the second capacitors of the plurality of electronic packaging devices are connected in parallel.

In a third aspect, the present invention also provides a motor controller, including the power semiconductor device described in the above preferred technical solution.

In a fourth aspect, the present invention also provides a vehicle, including the motor controller described in the above preferred technical solution.

Those skilled in the art can understand that, in the technical solution of the present invention, the electronic packaging device includes a packaging outer body and a power semiconductor unit and a capacitor arranged in the packaging outer body, and the DC between the capacitor and the power semiconductor unit side connection.

Compared with the traditional design mentioned in the background technology, the integrated packaging of the power semiconductor unit and the capacitor greatly shortens the distance between the power semiconductor unit and the capacitor, and effectively reduces the stress at the connection end of the power semiconductor unit and the capacitor. Stray inductance improves the switching speed of semiconductor devices, which is particularly important for further improving the efficiency of power modules based on wide bandgap semiconductors; at the same time, such settings also greatly improve the modularization and design of electronic packaging devices The scalability and modular design also make the system design very convenient, only need to connect an appropriate number of electronic packaging devices in parallel according to the power requirements of the system.

Description of drawings

Describe preferred embodiment of the present invention below with reference to accompanying drawing and in conjunction with automobile, in accompanying drawing:

1 is a schematic structural view of a power semiconductor device of a motor controller according to an embodiment of the present invention;

FIG. 2 and FIG. 3 are structural schematic diagrams of an electronic packaging device of a power semiconductor device according to an embodiment of the present invention;

List of reference signs:

1. Electronic packaging device; 11. Packaging outer body; 12. Power semiconductor unit; 121. AC terminal; 13. Capacitor; 131. First capacitor DC terminal; 132. Second capacitor DC terminal; 14. Heat dissipation structure; 141. Coolant inlet; 142, coolant outlet.

detailed description

Those skilled in the art should understand that the embodiments in this section are only used to explain the technical principle of the present invention, and are not used to limit the protection scope of the present invention. For example, although the present invention describes and illustrates the electronic packaging device of the present invention in conjunction with the motor controller of an automobile, this is not a limitation to the scope and scenarios of the electronic packaging device of the present invention, and the electronic packaging device of the present invention is also It can be used in other scenarios, such as power components used in oil well power supply circuits, etc. Those skilled in the art can make adjustments as needed so as to adapt to specific application occasions, and the adjusted technical solution will still fall within the protection scope of the present invention.

It should be noted that, in the description of the present invention, the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer" etc. Terms indicating directions or positional relationships are based on the directions or positional relationships shown in the drawings, which are merely for convenience of description, and do not indicate or imply that the device or element must have a specific orientation, be constructed and operated in a specific orientation, Therefore, it should not be construed as limiting the invention. In addition, the terms "first" and "second" are used for descriptive purposes only, and should not be understood as indicating or implying relative importance.

In addition, it should be noted that, in the description of the present invention, unless otherwise clearly stipulated and limited, the terms "installation", "connection" and "connection" should be understood in a broad sense, for example, it can be a fixed connection or a It is a detachable connection or an integral connection; it may be a mechanical connection or an electrical connection; it may be a direct connection or an indirect connection through an intermediary, and it may be the internal communication of two components. Those skilled in the art can understand the specific meanings of the above terms in the present invention according to specific situations.

As shown in Figures 1 to 3, Figure 1 is a schematic structural view of a power semiconductor device of a motor controller according to an embodiment of the present invention; Figure 2 and Figure 3 are electronic packaging devices of a power semiconductor device according to an embodiment of the present invention Schematic diagram of the structure. 1 to 3 , the car includes a motor controller, the motor controller includes a power semiconductor device, the power semiconductor device is composed of multiple electronic packaging devices 1 connected in parallel, and the multiple electronic packaging devices 1 are arranged side by side. Each electronic packaging device 1 includes an outer packaging body 11 , and a power semiconductor unit 12 and a capacitor 13 disposed inside the outer packaging body 11 , and the capacitor 13 is connected to the DC side of the power semiconductor unit 12 . As an example, the power semiconductor device is an inverter.

By integrating the power semiconductor unit 12 and the capacitor 13 into an integrated package, the distance between the power semiconductor unit 12 and the capacitor 13 is greatly shortened, the stray inductance of the busbar is effectively reduced, and the power density and working efficiency of the motor controller are improved. ; At the same time, such a setting also greatly improves the modularization of the motor controller and the scalability of the design, reduces the difficulty of assembling the motor controller in the final production process, and makes the design of the motor controller very convenient, such as It is only necessary to connect an appropriate number of electronic packaging devices 1 in parallel according to power requirements.

In one embodiment of the present invention, the electronic packaging device 1 further includes a first capacitor DC terminal 131 and a second capacitor DC terminal 132; one side of the first capacitor DC terminal 131 is connected to the capacitor 13, and the first capacitor DC terminal 131 The other side of the second capacitor DC terminal 132 is connected to the DC side of the power semiconductor unit 12; one side of the second capacitor DC terminal 132 is connected to the capacitor 13, and the other side of the second capacitor DC terminal 132 is penetrated and arranged on the package outer body 11, and multiple electrons The DC terminals 132 of the second capacitor of the packaged device 1 are connected in parallel. The second capacitive DC terminals 132 of the plurality of electronic packaging devices 1 are all at one end of the power semiconductor device. The electronic packaging device 1 further includes an AC terminal 121 , one side of the AC terminal 121 is connected to the AC side of the power semiconductor unit 12 , and the other side of the AC terminal 121 is penetratingly disposed on the package body 11 . The AC terminals 121 are located at the end of the package body 11 , and the AC terminals 121 of the plurality of electronic packaging devices 1 are located at the other end of the power semiconductor device. Through such setting, the normal operation of the electronic packaging device 1 is guaranteed.

As an example, the first capacitor DC terminal 131 , the second capacitor DC terminal 132 and the AC terminal 121 all include a bus bar, and the first capacitor DC terminal 131 and the second capacitor DC terminal 132 are integrally structured. It can be understood that the first capacitor DC terminal 131 and the second capacitor DC terminal 132 can also be a split structure, and those skilled in the art can reasonably set the first capacitor DC terminal 131 and the second capacitor DC terminal according to the actual situation and needs. 132, as long as the electrical connection between the power semiconductor unit 12 and the capacitor 13 and the electrical connection with the external load can be realized.

Continuing to refer to FIG. 2 and FIG. 3 , the electronic package device 1 further includes a heat dissipation structure 14 disposed inside the package body 11 and arranged along the power semiconductor unit 12 , so as to better remove the heat dissipated by the power semiconductor unit 12 . By directly setting the heat dissipation structure 14 on the packaging outer body 11, the working temperature of the electronic packaging device 1 can be effectively reduced, the normal operation of the motor controller can be ensured, and the reliability of the operation of the motor controller can be improved.

It can be understood that the heat dissipation structure 14 can also be arranged along the power semiconductor unit 12 and the capacitor 13 to realize effective heat dissipation for the power semiconductor unit 12 and the capacitor 13 . Those skilled in the art can reasonably arrange the heat dissipation structure 14 according to the actual situation and needs, as long as the position of the heat dissipation structure 14 can realize the heat dissipation of the power semiconductor unit 12 and/or the capacitor 13 .

In one embodiment of the present invention, the heat dissipation structure 14 includes a coolant channel, and the coolant inlet 141 and the coolant outlet 142 of the coolant channel are both arranged on the package outer body 11 . Coolant can be introduced into the coolant channel to realize effective heat dissipation of the electronic packaging device 1 .

By setting the coolant channel, the heat of the power semiconductor unit 12 and the capacitor 13 can be taken away by the coolant, so as to provide effective heat dissipation for the electronic packaging device 1 . Since the semiconductor chip is easy to generate heat in the working process and generates more heat, the coolant inlet 141 and the coolant outlet 142 can be arranged at a position close to the power semiconductor unit 12, and the power semiconductor unit 12 is firstly exchanged for heat, so as to achieve sufficient The coolant is used to effectively dissipate heat from the power semiconductor unit 12 .

In another embodiment of the present invention, the heat dissipation structure 14 includes a plurality of heat dissipation through holes, and the heat dissipation opening of each heat dissipation through hole is disposed on the package outer body 11 . By providing heat dissipation through holes on the package outer body 11 , the heat in the heat dissipation through holes can be taken away by wind or coolant to provide effective heat dissipation for the electronic package device 1 .

As an example, the heat dissipation through hole is configured as a cylindrical cavity, so that wind or coolant can better pass through the heat dissipation through hole and take away heat. It can be understood that the heat dissipation through hole can also be set in other shapes, such as a cuboid cavity or a special-shaped cavity, etc. Those skilled in the art can reasonably set the shape of the heat dissipation through hole according to the actual situation and needs, as long as the heat dissipation through hole can make Wind or coolant can pass through and carry the heat away.

It should be noted that since the power semiconductor unit 12 and the capacitor 13 are directly packaged and integrated to form the smallest unit, when the power level required by the motor controller is low, a smaller number of "minimum units" (that is, the electronic packaging device 1 ) power semiconductor device; obviously, when the power level required by the motor controller is high, a large number of "minimum units" can be used for parallel connection to meet the demand. With such a setting, for the power semiconductor unit 12, the stray inductance of the DC circuit is expected to be controlled within 10nH, which not only effectively reduces the stray inductance, but also makes the assembly of the motor controller more convenient and quick.

It can be seen from the above description that the power semiconductor device of the motor controller of the present invention includes a plurality of electronic packaging devices connected in parallel, and each electronic packaging device includes a packaging outer body and a power semiconductor unit and a capacitor arranged in the packaging outer body. Such an arrangement greatly shortens the distance between the power semiconductor unit and the capacitor, and effectively reduces the stray inductance of the busbar; at the same time, it also greatly improves the modularization of the motor controller and the scalability of the design. Preferably, the electronic packaging device includes a first capacitor DC terminal, a second capacitor DC terminal and an AC terminal. Through such setting, the normal operation of the motor controller is guaranteed. Preferably, a heat dissipation structure is arranged on the package outer body. Through such setting, the operating temperature of the power semiconductor unit and the capacitor can be effectively reduced, the normal operation of the motor controller can be ensured, and the reliability of the operation of the motor controller can be improved.

So far, the technical solutions of the present invention have been described in conjunction with the preferred embodiments shown in the accompanying drawings, but those skilled in the art will easily understand that the protection scope of the present invention is obviously not limited to these specific embodiments. Without departing from the principles of the present invention, those skilled in the art can make equivalent changes or substitutions to relevant technical features, and the technical solutions after these changes or substitutions will all fall within the protection scope of the present invention.

Claims (7)

1. A power semiconductor device, comprising a plurality of electronic packaging devices; The electronic packaging device includes an outer packaging body and a power semiconductor unit and a capacitor arranged in the outer packaging body, The capacitor is connected to the DC side of the power semiconductor unit; The electronic packaging device also includes a first capacitor DC terminal and a second capacitor DC terminal; One side of the DC terminal of the first capacitor is connected to the capacitor, and the other side of the DC terminal of the first capacitor is connected to the DC side of the power semiconductor unit; One side of the DC terminal of the second capacitor is connected to the capacitor, and the other side of the DC terminal of the second capacitor is arranged through the outer body of the package; The multiple electronic packaging devices are arranged side by side, and the second capacitor DC terminals of the multiple electronic packaging devices are connected in parallel; The second capacitive DC terminals of the plurality of electronic packaging devices are all located at one end of the power semiconductor device; The electronic packaging device also includes an AC terminal, one side of the AC terminal is connected to the AC side of the power semiconductor unit, and the other side of the AC terminal is provided through the outer body of the package, and the AC terminal Located at the end of the packaging outer body, the AC terminals of the plurality of electronic packaging devices are located at the other end of the power semiconductor device. 2 . The power semiconductor device according to claim 1 , wherein the electronic package device further comprises a heat dissipation structure arranged inside the package outer body and arranged along the power semiconductor unit and/or the capacitor. 3 . 3 . The power semiconductor device according to claim 2 , wherein the heat dissipation structure comprises a coolant channel, and a coolant inlet and a coolant outlet of the coolant channel are both arranged on the outer packaging body. 4 . 4 . The power semiconductor device according to claim 3 , wherein the heat dissipation structure comprises a plurality of heat dissipation vias, and a heat dissipation port of each of the heat dissipation vias is disposed on the package outer body. 5 . The power semiconductor device according to claim 1 , wherein the DC terminal of the first capacitor, the DC terminal and the AC terminal of the second capacitor all comprise bus bars. 6. A motor controller, characterized by comprising the power semiconductor device according to any one of claims 1-5. 7. A vehicle, characterized by comprising the motor controller of claim 6.

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