CN109273396A - A kind of wafer carrying platform apparatus for adjusting position - Google Patents
A kind of wafer carrying platform apparatus for adjusting position Download PDFInfo
- Publication number
- CN109273396A CN109273396A CN201811070061.XA CN201811070061A CN109273396A CN 109273396 A CN109273396 A CN 109273396A CN 201811070061 A CN201811070061 A CN 201811070061A CN 109273396 A CN109273396 A CN 109273396A
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- wafer
- bearing table
- sensor
- regulator
- adjuster
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- 229920006351 engineering plastic Polymers 0.000 claims description 3
- 238000001816 cooling Methods 0.000 abstract description 12
- 230000000694 effects Effects 0.000 abstract description 7
- 230000009286 beneficial effect Effects 0.000 abstract description 2
- 235000013399 edible fruits Nutrition 0.000 abstract 1
- 235000012431 wafers Nutrition 0.000 description 171
- 239000000498 cooling water Substances 0.000 description 6
- 238000012546 transfer Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 229920003023 plastic Polymers 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 238000013459 approach Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The present invention provides a kind of wafer carrying platform apparatus for adjusting position, and apparatus for adjusting position is applied in wafer carrying platform；At least provided with an apparatus for adjusting position around wafer carrying platform, apparatus for adjusting position includes inductor and adjuster, and the side of wafer carrying platform is arranged in inductor, and adjuster is correspondingly arranged with inductor；For inductor whether to incude wafer in the position in wafer carrying platform to the offset of adjuster position, adjuster senses that wafer makes wafer far from adjuster when the position in wafer carrying platform is deviated to adjuster position in inductor.The beneficial effects of the present invention are the wafer that positional shift occurs is adjusted by the way that apparatus for adjusting position is arranged around wafer carrying platform, to keep cooling effect fruit of the wafer in wafer carrying platform best.
Description
Technical Field
The invention relates to the field of semiconductor equipment manufacturing, in particular to a position adjusting device for a wafer bearing table.
Background
Most of the existing wafer bearing tables are operated by the way that a conveying mechanism firstly conveys a wafer to a top pin, the top pin conveys the wafer to the wafer bearing table, the wafer bearing table adsorbs the wafer through a vacuum tube, a cooling water pipe is arranged below the vacuum tube to convey cooling water, and cooling water circulation is achieved, so that the purpose of cooling the wafer is achieved. However, before the wafer is transferred by the transfer mechanism, the position of the wafer may be shifted; if there are particles on the bottom of the wafer or the bottom of the wafer is not horizontal, the suction force of the vacuum tube to suck the wafer may not be uniform, and the position of the wafer may be shifted.
However, the prior art has the following problems that most of the wafers are concentrated on the edge of the wafer bearing table; the wafer cannot be adjusted back to a position near the center of the wafer carrier. Resulting in poor cooling of the wafer.
Disclosure of Invention
In view of the above problems in the prior art, a position adjustment device for a wafer carrier is provided to adjust a wafer with a position offset by a position adjustment device disposed on one side of the wafer carrier, so as to optimize the cooling effect of the wafer on the wafer carrier.
The specific technical scheme is as follows: a position adjusting device for a wafer bearing table is applied to the wafer bearing table;
the wafer bearing table is provided with at least one position adjusting device, the position adjusting device comprises a sensor and an adjuster, the sensor is arranged on one side of the wafer bearing table, and the adjuster and the sensor are arranged correspondingly;
the sensor is used for sensing whether the position of the wafer on the wafer bearing platform deviates to the position of the regulator, and the regulator enables the wafer to be far away from the regulator when the sensor senses that the position of the wafer on the wafer bearing platform deviates to the position of the regulator.
Preferably, the position adjusting device for the wafer bearing table is provided with three position adjusting devices arranged around the wafer bearing table, and the three position adjusting devices are uniformly distributed around the wafer bearing table.
Preferably, the position adjusting device for the wafer bearing table comprises an alarm, wherein the alarm is connected with the sensor and alarms when the sensor senses that the position of the wafer on the wafer bearing table deviates to the position of the regulator.
Preferably, the position adjusting device for the wafer carrying table comprises a sensor, wherein the sensor comprises a signal transmitting port and a signal receiving port, the signal transmitting port and the signal receiving port are arranged oppositely and have a predetermined distance therebetween, and when a wafer is located between the signal transmitting port and the signal receiving port, the position of the wafer on the wafer carrying table is determined to be offset towards the position of the adjuster.
Preferably, a projection of a connection line between the signal transmitting port and the signal receiving port on a plane where the upper surface of the wafer bearing table is located is tangent to an edge of the upper surface of the wafer bearing table, and a tangent point is a center of a projection of a connection line between the signal transmitting port and the signal receiving port on the plane where the upper surface of the wafer bearing table is located.
Preferably, a vacuum valve is arranged below the wafer bearing table, a vacuum guide channel for adsorbing the wafer is arranged on the upper surface of the wafer bearing table, the vacuum guide channel is connected with the vacuum valve through a vacuum tube, the sensor is connected with the vacuum valve, and the vacuum valve is closed when the position of the wafer on the wafer bearing table deviates to the position of the regulator.
Preferably, a wafer plummer position control device, wherein, position control device includes pivot, rocking arm and round pin post, and power supply is connected to pivot one end, and the one end of rocking arm is connected to the other end, and the round pin post is connected to the other end of rocking arm.
Preferably, the device for adjusting the position of the wafer bearing table comprises a rocker arm and a rocker arm, wherein the rocker arm is parallel to the upper surface of the wafer bearing table.
Preferably, the device for adjusting the position of the wafer bearing table comprises a rocker arm, wherein the length of the rocker arm satisfies the following formula:
A≥B+C；
wherein,
a is used for indicating the length of the rocker arm;
b is used for representing the projection of the center of the rotating shaft on the plane of the upper surface of the wafer bearing table and the distance from the center of the rotating shaft to the edge of the upper surface of the wafer bearing table;
c is used to represent the difference between the radius of the upper surface of the wafer stage minus the radius of the wafer.
Preferably, the wafer bearing table position adjusting device is characterized in that the pin columns are made of engineering plastics.
The technical scheme has the following advantages or beneficial effects: the wafer with the position deviation is adjusted by arranging the position adjusting device around the wafer bearing platform, so that the cooling effect of the wafer on the wafer bearing platform is optimal.
Drawings
Embodiments of the present invention will now be described more fully hereinafter with reference to the accompanying drawings. The drawings are, however, to be regarded as illustrative and explanatory only and are not restrictive of the scope of the invention.
FIG. 1 is a schematic diagram of an overall structure of an embodiment of a position adjustment apparatus for a wafer stage according to the present invention;
FIG. 2 is a top view of an embodiment of an adjuster for adjusting the position of a wafer stage;
fig. 3 is a front view of an adjuster of an embodiment of a wafer stage position adjusting apparatus according to the present invention.
Reference numerals: 1. the device comprises a position adjusting device 2, an adjuster 21, a pin 22, a rocker arm 23, a rotating shaft 3, a sensor 31, a signal receiving port 32, a signal transmitting port 33, a sensing area 4 and a wafer bearing table.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It should be noted that the embodiments and features of the embodiments may be combined with each other without conflict.
The invention is further described with reference to the following drawings and specific examples, which are not intended to be limiting.
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It should be noted that the embodiments and features of the embodiments may be combined with each other without conflict.
The invention is further described with reference to the following drawings and specific examples, which are not intended to be limiting.
As shown in fig. 1, the present invention includes a position adjusting device 1 for a wafer carrier 4, the position adjusting device 1 is applied on the wafer carrier 4, wherein at least one position adjusting device 1 is disposed around the wafer carrier 4, the position adjusting device 1 includes a sensor 3 and an adjuster 2, the sensor 3 is disposed on one side of the wafer carrier 4, and the adjuster 2 is disposed corresponding to the sensor 3;
the sensor 3 senses whether the position of the wafer on the wafer bearing table 4 deviates from the position of the regulator 2, and the regulator 2 makes the wafer far away from the regulator 2 when the sensor 3 senses that the position of the wafer on the wafer bearing table 4 deviates from the position of the regulator 2.
Preferably, in this embodiment, three position adjusting devices 1 are disposed around the wafer carrier 4, and the three position adjusting devices 1 are uniformly distributed around the wafer carrier 4, that is, a connection line of tangent lines of the position adjusting devices 1 can form an equilateral triangle, and at this time, the position adjusting devices 1 can adjust the position of the wafer on the wafer carrier 4 to the offset position of the adjuster 2 in each direction.
In an embodiment, the operation steps of the wafer stage 4 are as follows:
first, a transfer mechanism (e.g., a robot arm) transfers the wafer and drops the wafer onto the pins when the wafer reaches the pin-ejecting position.
The top pin is then pinned to the wafer and dropped to place the wafer on the wafer stage 4, and the wafer stage 4 adsorbs the wafer through the lower vacuum tube (in this embodiment, the vacuum tube is of a circular design).
A plurality of heat conduction holes are arranged in the wafer bearing table 4, cooling water is conveyed through cooling water pipes arranged below the vacuum pipes, and cooling water circulation is achieved, so that the purpose of cooling the wafer is achieved.
When the wafer position is deviated (there are many situations, for example, the wafer position is deviated before the wafer is transferred by the transfer mechanism (for example, a robot arm), for example, there are particles on the bottom of the wafer or the bottom of the wafer is not horizontal, which may cause uneven suction force of the vacuum tube to suck the wafer, thereby causing the wafer position to be deviated), the position adjustment device 1 is required to help the wafer position to be adjusted to the center of the wafer stage 4.
In the prior art, a pair of fixing pins is arranged around the wafer bearing table 4, and the fixing pins are arranged on the left side of the wafer, so that the fixing pins can prevent the wafer from falling off from the wafer bearing table 4, maintain the wafer in a fixed range, but cannot adjust the position of the wafer.
Aiming at the defect that the position of the wafer cannot be adjusted by adopting a fixing pin in the prior art, the invention is provided with at least three groups of position adjusting devices 1, thereby realizing the full-range adjustment of the wafer in an offset state.
It should be noted that the wafer position deviation may cause the wafer to be cooled unevenly during the cooling process, and the expected cooling temperature cannot be reached.
The position adjusting device 1 comprises an alarm, the alarm is connected with the sensor 3, and alarms when the sensor 3 senses that the position of the wafer on the wafer bearing table 4 deviates to the position of the adjuster 2.
In the embodiment, the sensor 3 is arranged to sense whether the position of the wafer on the wafer bearing table 4 deviates from the position of the regulator 2, and the regulator 2 performs targeted position regulation on the wafer according to a sensing signal sent by the sensor 3, so that the wafer is far away from the regulator 2, and the wafer is moved to the midword of the wafer bearing table 4 to optimize and correct the position of the wafer in advance of the wafer bearing table 4, thereby optimizing the cooling effect of the wafer on the wafer bearing table 4.
In the above embodiment, preferably, a set of sensors 3 may be provided, each sensor 3 includes a signal transmitting port 32 and a signal receiving port 31, the signal transmitting port 32 and the signal receiving port 31 are disposed opposite to each other with a predetermined distance therebetween, and when a wafer is located between the signal transmitting port 32 and the signal receiving port 31, it is determined that the position of the wafer on the wafer stage 4 is shifted from the position of the conditioner 2.
The projection of the connection line between the signal transmitting port 32 and the signal receiving port 31 on the plane of the upper surface of the wafer bearing table 4 is tangent to the edge of the upper surface of the wafer bearing table 4, and the tangent point is the center of the projection of the connection line between the signal transmitting port 32 and the signal receiving port 31 on the plane of the upper surface of the wafer bearing table 4.
A vacuum valve is arranged below the wafer bearing table 4, a vacuum guide channel for adsorbing the wafer is arranged on the upper surface of the wafer bearing table 4, the vacuum guide channel is connected with the vacuum valve through a vacuum tube, the inductor 3 is connected with the vacuum valve, the vacuum valve is closed when the position of the wafer on the wafer bearing table 4 deviates to the position of the regulator 2, and the regulator 2 is convenient to move the wafer after the vacuum valve is closed, so that the wafer cannot be damaged.
The connection line between the signal receiving port 31 and the signal transmitting port 32 of the sensor 3 forms a sensing region 33, which can sense whether the position of the wafer on the wafer stage 4 is shifted toward the position of the regulator 2, and preferably, the sensing range of the sensing region 33 in this embodiment is within 150mm of the radius from the center of the wafer stage 4. When the wafer position is between the sensing areas 33, it is determined that the position of the wafer on the wafer stage 4 is shifted toward the position of the conditioner 2, and at this time, the alarm connected to the sensor 3 issues a warning to prompt the position of the wafer on the wafer stage 4 to be shifted toward the position of the conditioner 2. At this time, the vacuum valve under the wafer stage 4 is closed, the suction of the wafer by the vacuum guide is stopped, and then the conditioner 2 is turned on. After the regulator 2 is opened, if the sensor 3 senses that the position of the wafer on the wafer bearing table 4 deviates to the position of the regulator 2, a deviation signal is sent to the regulator 2, the regulator 2 receives the signal, and the wafer is pushed to move away from the regulator 2 to approach the center of the wafer bearing table 4; if the sensor 3 senses that the position of the wafer on the wafer bearing table 4 is not deviated from the position of the regulator 2, a non-deviation signal is sent to the regulator 2, the regulator 2 receives the signal, and the regulator 2 stops and returns to the original position.
As shown in fig. 2-3, the position adjustment device 1 includes a rotating shaft 23, a rocker arm 22 and a pin 21, wherein one end of the rotating shaft 23 is connected to the power source, the other end is connected to one end of the rocker arm 22, and the other end of the rocker arm 22 is connected to the pin 21.
The swing arm 22 is parallel to the upper surface of the wafer stage 4.
The length of the rocker arm 22 satisfies the following formula:
A≥B+C；
wherein,
a is used to indicate the length of the rocker arm 22;
b is used to indicate the distance from the projection of the center of the spindle 23 on the plane of the upper surface of the wafer carrier 4 to the edge of the upper surface of the wafer carrier 4;
c is used to represent the difference between the radius of the upper surface of the wafer carrier 4 minus the radius of the wafer.
Thereby ensuring that the rocker arm 22 can contact the wafer in the working state, and further adjusting the position of the wafer.
The pin 21 is made of engineering plastic, and the pin 21 is a cylinder with a radius of 20mm and a height of 20 mm.
The rocker arm 22 is a cylinder with the radius of 15mm and the height of 30mm, and the rocker arm 22 can realize position adjustment in a small range, so that the cooling range of the wafer is enlarged, and the cooling effect is better.
In the above embodiment, it is preferable that the rotation shaft 23 is a plastic link rod with a length of 30mm, a width of 10mm and a height of 10mm, and the use of the plastic link rod is more cost-effective.
In summary, the working principle of the present invention is to sense whether the position of the wafer on the wafer loading platform 4 deviates from the position of the regulator 2 by the position sensing device, once the position of the wafer on the wafer loading platform 4 deviates from the position of the regulator 2, the sensor 3 sends an alarm, the machine stops processing the wafer, the regulator 2 is turned on, the regulator 2 adjusts the position of the wafer according to the signal of the sensor 3 until the position of the wafer gets closer to the center position of the wafer loading platform 4 away from the regulator 2, and the regulator 2 completes the adjustment and returns to the original position. Then the machine platform processes the wafer, and the cooling effect of the wafer can obtain the best effect at the moment.
While the invention has been described with reference to a preferred embodiment, it will be understood by those skilled in the art that various changes in form and detail may be made therein without departing from the spirit and scope of the invention.
Claims (10)
1. A position adjusting device for a wafer bearing table is applied to the wafer bearing table;
the wafer bearing table is characterized in that at least one position adjusting device is arranged around the wafer bearing table and comprises a sensor and an adjuster, the sensor is arranged on one side of the wafer bearing table, and the adjuster is arranged corresponding to the sensor;
the sensor is used for sensing whether the position of the wafer on the wafer bearing table deviates towards the position of the regulator, and the regulator enables the wafer to be far away from the regulator when the sensor senses that the position of the wafer on the wafer bearing table deviates towards the position of the regulator.
2. The apparatus of claim 1, wherein three of the position adjustment devices are disposed around the wafer carrier and are evenly distributed around the wafer carrier.
3. A wafer carrier table position adjustment apparatus as claimed in claim 1, wherein the position adjustment apparatus comprises an alarm connected to the sensor and configured to alarm when the sensor senses that the position of the wafer on the wafer carrier table deviates from the position of the adjuster.
4. The apparatus of claim 1, wherein the sensor comprises a signal emitting port and a signal receiving port, the signal emitting port and the signal receiving port are disposed opposite to each other with a predetermined distance therebetween, and the position of the wafer on the wafer stage is determined to be shifted from the position of the regulator when the wafer is located between the signal emitting port and the signal receiving port.
5. The apparatus of claim 4, wherein a projection of a connecting line between the signal transmitting port and the signal receiving port on a plane of the upper surface of the wafer carrier is tangent to an edge of the upper surface of the wafer carrier, and a tangent point is a center of a projection of the connecting line between the signal transmitting port and the signal receiving port on the plane of the upper surface of the wafer carrier.
6. A wafer carrier table position adjustment apparatus as claimed in claim 1, wherein a vacuum valve is provided below the wafer carrier table, a vacuum channel for sucking the wafer is provided on the upper surface of the wafer carrier table, the vacuum channel is connected to the vacuum valve through a vacuum tube, the sensor is connected to the vacuum valve, and the vacuum valve is closed when the position of the wafer on the wafer carrier table deviates from the position of the regulator.
7. The apparatus of claim 1, wherein the apparatus comprises a shaft, a rocker arm and a pin, the shaft is connected to a power source at one end and to one end of the rocker arm at the other end, and the pin is connected to the other end of the rocker arm.
8. The apparatus of claim 7, wherein the swing arm is parallel to the top surface of the wafer carrier.
9. The apparatus of claim 7, wherein the length of the swing arm satisfies the following equation:
A≥B+C；
wherein,
a is used for indicating the length of the rocker arm;
b is used for representing the distance from the projection of the center of the rotating shaft on the plane of the upper surface of the wafer bearing table to the edge of the upper surface of the wafer bearing table;
and C is used for representing the difference of the radius of the upper surface of the wafer bearing table minus the radius of the wafer.
10. The apparatus of claim 7, wherein the pin is made of engineering plastic.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811070061.XA CN109273396A (en) | 2018-09-13 | 2018-09-13 | A kind of wafer carrying platform apparatus for adjusting position |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811070061.XA CN109273396A (en) | 2018-09-13 | 2018-09-13 | A kind of wafer carrying platform apparatus for adjusting position |
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| Publication Number | Publication Date |
|---|---|
| CN109273396A true CN109273396A (en) | 2019-01-25 |
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| CN201811070061.XA Pending CN109273396A (en) | 2018-09-13 | 2018-09-13 | A kind of wafer carrying platform apparatus for adjusting position |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113947871A (en) * | 2020-07-17 | 2022-01-18 | 南亚科技股份有限公司 | Alarm device and alarm method thereof |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101459102A (en) * | 2007-12-13 | 2009-06-17 | 中芯国际集成电路制造(上海)有限公司 | Wafer positioning method |
| CN102479736A (en) * | 2010-11-29 | 2012-05-30 | 东京毅力科创株式会社 | Substrate treatment system, substrate treatment method, and non-transitory computer storage medium |
| CN103515264A (en) * | 2012-06-26 | 2014-01-15 | 盛美半导体设备（上海）有限公司 | Detection apparatus and detection method for wafer position |
-
2018
- 2018-09-13 CN CN201811070061.XA patent/CN109273396A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101459102A (en) * | 2007-12-13 | 2009-06-17 | 中芯国际集成电路制造(上海)有限公司 | Wafer positioning method |
| CN102479736A (en) * | 2010-11-29 | 2012-05-30 | 东京毅力科创株式会社 | Substrate treatment system, substrate treatment method, and non-transitory computer storage medium |
| CN103515264A (en) * | 2012-06-26 | 2014-01-15 | 盛美半导体设备（上海）有限公司 | Detection apparatus and detection method for wafer position |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113947871A (en) * | 2020-07-17 | 2022-01-18 | 南亚科技股份有限公司 | Alarm device and alarm method thereof |
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