CN109155260B - 引线接合装置、其电路以及半导体装置的制造方法 - Google Patents
引线接合装置、其电路以及半导体装置的制造方法 Download PDFInfo
- Publication number
- CN109155260B CN109155260B CN201780031626.0A CN201780031626A CN109155260B CN 109155260 B CN109155260 B CN 109155260B CN 201780031626 A CN201780031626 A CN 201780031626A CN 109155260 B CN109155260 B CN 109155260B
- Authority
- CN
- China
- Prior art keywords
- lead
- relay
- power supply
- detection circuit
- switch
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/782—Protection means against electrical discharge
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/78268—Discharge electrode
- H01L2224/78271—Circuitry of the discharge electrode
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/78301—Capillary
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/786—Means for supplying the connector to be connected in the bonding apparatus
- H01L2224/78601—Storing means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/786—Means for supplying the connector to be connected in the bonding apparatus
- H01L2224/78611—Feeding means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/789—Means for monitoring the connection process
- H01L2224/78901—Means for monitoring the connection process using a computer, e.g. fully- or semi-automatic bonding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/85009—Pre-treatment of the connector or the bonding area
- H01L2224/8503—Reshaping, e.g. forming the ball or the wedge of the wire connector
- H01L2224/85035—Reshaping, e.g. forming the ball or the wedge of the wire connector by heating means, e.g. "free-air-ball"
- H01L2224/85045—Reshaping, e.g. forming the ball or the wedge of the wire connector by heating means, e.g. "free-air-ball" using a corona discharge, e.g. electronic flame off [EFO]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/8512—Aligning
- H01L2224/85148—Aligning involving movement of a part of the bonding apparatus
- H01L2224/85169—Aligning involving movement of a part of the bonding apparatus being the upper part of the bonding apparatus, i.e. bonding head, e.g. capillary or wedge
- H01L2224/8518—Translational movements
- H01L2224/85181—Translational movements connecting first on the semiconductor or solid-state body, i.e. on-chip, regular stitch
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Wire Bonding (AREA)
- Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)
Abstract
本发明提供一种引线接合装置、引线接合装置用电路及半导体装置的制造方法。包括:线轴、夹持器、焊炬电极、高压电源电路、断开检测电路、切换线轴与高压电源电路或断开检测电路的连接的第一切换开关、以及使夹持器与第一切换开关的线轴侧的连接接通/关断的继电器,并且包括控制部,所述控制部是将第一切换开关设为高压电源电路侧,并且使继电器关断而产生放电,将第一切换开关设为断开检测电路侧,并且使继电器接通而进行断开检测。因此,能够利用简单的结构,来抑制引线夹持器的电腐蚀,并且进行断开检测。
Description
技术领域
本发明涉及一种引线接合装置、引线接合装置用电路的结构及半导体装置的制造方法。
背景技术
引线接合装置正在被大量使用,所述引线接合装置是利用金属的引线来连接配置在电路基板上的半导体芯片等元件的电极与电路基板的导线(lead)之间。引线接合是在引线的前端利用电焊炬(torch)而形成自由空气球(free air ball),通过瓷嘴(capillary)将所述自由空气球接合于元件的电极之后,将瓷嘴打成环状,利用瓷嘴将引线按压至电路基板的导线,然后,将引线在由夹持器(clamper)抓持着的状态下拉起来而切断引线。自由空气球是通过利用夹持器夹住引线,对引线施加自由空气球形成用的高电压,使其与电焊炬之间产生放电而使引线熔融而形成。此时,存在如下的情况:在夹住引线的夹持器与引线之间产生二次放电,从而可在夹持器的表面上形成电腐蚀。当在夹持器的表面上形成伤痕时,有时夹持器抓持引线的力会降低,或由于因电腐蚀而产生的夹持器的伤痕而损伤引线表面。因此,提出了与引线切割(wire cut)用的夹持器另外地设置电性连接用的夹持器的技术(例如,参照专利文献1)。
现有技术文献
专利文献
专利文献1:日本专利第3041812号说明书
发明内容
发明所要解决的问题
但是,在专利文献1中所述的现有技术的引线接合装置中,存在如下的问题:无法抑制电气连接用的夹持器与引线之间的二次放电,在电性连接用的夹持器的表面上产生电腐蚀,由此使得引线表面产生损伤。并且,当设为不对电性连接用的夹持器施加自由空气球形成用的高电压时,存在无法确保引线与断开检测电路之间的电性连接,无法进行断开检测的问题。
因此,本发明的目的在于利用简单的结构,来抑制引线夹持器的电腐蚀,并且进行断开检测。
解决问题的手段
本发明的引线接合装置包括:线轴(spool);夹持器,抓持从线轴抽出的引线;焊炬电极,通过放电而在引线的前端形成自由空气球;高压电源电路,对焊炬电极供电;断开检测电路,进行引线与元件或基板的断开检测;第一切换开关,切换线轴与高压电源电路或断开检测电路的连接;继电器,使夹持器与第一切换开关的线轴侧的连接接通/关断;以及控制部,将第一切换开关设为高压电源电路侧,并且使继电器关断而产生放电,将第一切换开关设为断开检测电路侧,并且使继电器接通而进行断开检测。
在本发明的引线接合装置中,可以设为:包括第二切换开关,所述第二切换开关配置在第一切换开关的线轴侧与线轴之间,切换第一切换开关的线轴侧与接地线的连接,控制部将第一切换开关设为断开检测电路侧,并且使继电器接通,而且将第二切换开关设为接地线侧而进行线轴的导通确认。
在本发明的引线接合装置中,可以设为包括:引线导件(wire guide),配置在线轴与夹持器之间,具有引线的至少一部分所接触的贯通孔;以及连接线,将引线导件与第一切换开关的线轴侧加以连接。
本发明的引线接合装置用电路包括:高压电源电路,对焊炬电极供电,所述焊炬电极通过放电而在引线的前端形成自由空气球;断开检测电路,进行引线与元件或基板的断开检测;第一切换开关,切换抽出引线的线轴与高压电源电路或断开检测电路的连接;继电器,使夹持器与第一切换开关的线轴侧的连接接通/关断,所述夹持器抓持从线轴抽出的引线;以及控制部,将第一切换开关设为高压电源电路侧,并且使继电器关断而产生放电,而且将第一切换开关设为断开检测电路侧,并且使继电器接通而进行断开检测。
本发明的半导体装置的制造方法包括如下工序:准备引线接合装置,所述引线接合装置包括线轴、抓持从线轴抽出的引线的夹持器、通过放电而在引线的前端形成自由空气球的焊炬电极、对焊炬电极供电的高压电源电路、进行引线与元件或基板的断开检测的断开检测电路、切换线轴与高压电源电路或断开检测电路的连接的第一切换开关、以及使夹持器与第一切换开关的线轴侧的连接接通/关断的继电器;将第一切换开关设为高压电源电路侧,并且使继电器关断,高压电源电路对焊炬电极供电而形成自由空气球;将形成有自由空气球的引线接合于元件或基板;以及将第一切换开关设为断开检测电路侧,并且使继电器接通,而进行引线与元件或基板的断开检测。
发明的效果
本发明能够利用简单的结构,来抑制引线夹持器的电腐蚀,并且进行断开检测。
附图说明
图1是本发明的实施方式中的引线接合装置的系统图。
图2是表示图1所示的引线接合装置中的自由空气球形成时的电流的流动的说明图。
图3是表示图1所示的引线接合装置中的断开检测时的电流的流动的说明图。
图4是本发明的另一实施方式的引线接合装置的系统图。
图5是本发明的另一实施方式的引线接合装置的系统图。
符号的说明
10:线轴
11:本体
12:旋转轴
13:滑环
14:马达
15:端子
16:端部
17、25、32、33、41、57:连接线
18:基板
19:元件
21:引线
21a:尾端引线
22:夹持器
23:瓷嘴
24:自由空气球
24a:压接球
30:高压电源电路
31:焊炬电极
34:内部配线
40:断开检测电路
50:第一切换开关
51:高压电源电路侧继电器
52:断开检测电路侧继电器
53:继电器
54:第二切换开关
55:接地线
56:引线导件
60:控制部
61:CPU
62:存储器
100、200、300:引线接合装置
具体实施方式
以下,一边参照附图,一边对本实施方式的引线接合装置100进行说明。如图1所示,引线接合装置100包括线轴10、夹持器22、焊炬电极31、高压电源电路30、断开检测电路40、第一切换开关50、继电器53及控制部60。再者,在图1中,点划线表示信号线。在其它图中也同样。
线轴10包括:本体11,在圆筒部的两端设有凸缘,在圆筒部上缠绕引线21;旋转轴12,与本体11连接;滑环(slip ring)13,安装在旋转轴12上;以及端子15,设置在本体11的凸缘上,连接缠绕在圆筒部上的引线21的端部16。在旋转轴12上,连接着旋转驱动本体11的马达14。
夹持器22安装在线轴10与瓷嘴23之间。夹持器22通过未图示的开闭驱动部而打开或关闭,从而抓持或放开引线21。
焊炬电极31配置在从瓷嘴23的前端延伸出来的引线21的附近,借由从高压电源电路30供给的电力,而与引线21的前端之间产生放电,在引线21的前端形成自由空气球24。焊炬电极31是在形成自由空气球24时,推出至引线21的前端附近为止,在除此以外的情况下,则被拉入至与引线21的前端分离的位置。
断开检测电路40对引线21施加电压,当所施加的电压下降时,检测出引线21与元件19连接着,当即使对引线21施加电压,电压也不会下降时,检测出引线21与连接于地线(ground)的基板18上的元件19之间的断开(连接不良)。
第一切换开关50包括高压电源电路侧继电器51及断开检测电路侧继电器52这两个继电器。通过使两个继电器中的任一个接通,使另一个关断,来切换线轴10与高压电源电路30或断开检测电路40的连接。
高压电源电路30的正(plus)侧端子通过连接线32而与焊炬电极31连接。并且,通过内部配线34而连接于地线的高压电源电路30的地线侧端子通过连接线33而与高压电源电路侧继电器51的一端连接。高压电源电路侧继电器51的另一端通过连接线17而与线轴10的滑环13连接。断开检测电路40的端子通过连接线41而与断开检测电路侧继电器52的一端连接。断开检测电路侧继电器52的另一端与连接线17连接。连接线17与夹持器22之间通过连接线25而连接,并通过继电器53而连接、放开。
高压电源电路30、断开检测电路40、夹持器22、第一切换开关50的高压电源电路侧继电器51与断开检测电路侧继电器52、继电器53及马达14连接于控制部60,并构成为通过控制部60的命令而运行。控制部60是包括中央处理器(Central Processing Unit,CPU)61及存储器62的计算机,所述CPU 61在内部进行信息处理或运算,所述存储器62保存控制程序或控制数据。
再者,高压电源电路30、断开检测电路40、第一切换开关50、继电器53及控制部60构成未图示的引线接合装置用电路。
其次,一边参照图2,一边说明在引线接合装置100中形成自由空气球24的动作。如图2所示,控制部60使第一切换开关50的高压电源电路侧继电器51接通,使断开检测电路侧继电器52关断。并且,控制部60使继电器53关断,使夹持器22关闭。然后,控制部60将焊炬电极31抽出至从瓷嘴23的前端延伸出来的引线21的前端附近为止,如图2的箭头81、箭头82所示,从高压电源电路30对焊炬电极31施加高电压。
通过经施加的高电压,而在焊炬电极31与引线21的前端之间产生放电,从而在引线21的前端形成自由空气球24。并且,通过放电而流入至焊炬电极31与引线21之间的电流如图2的箭头83、箭头84所示,从缠绕在线轴10的本体11上的引线21的端部16流入至端子15,并如图2的箭头85所示,从本体11的凸缘部穿过旋转轴12而抵达至滑环13。然后,如图2的箭头85、箭头86所示,从滑环13穿过连接线17、高压电源电路侧继电器51,并如图2的箭头87~箭头89所示,穿过连接线33流入至高压电源电路30的地线侧端子,并且通过内部配线34而如箭头90,流入至地线。
因此,在引线接合装置100中,在形成自由空气球24时,电流不会流入至夹持器22与引线21之间,从而不会产生夹持器22与引线21之间的二次放电。因此,引线接合装置100能够抑制夹持器22的电腐蚀的产生。
其次,一边参照图3,一边说明在引线接合装置100中,检测接合后的引线21与元件19的电极之间的断开的动作。当使瓷嘴23下降,使得自由空气球24与元件19的电极接合而使压接球24a成形时,如图3中以虚线所示,成为打开的状态。控制部60在接合于元件19后,紧接着使第一切换开关50的高压电源电路侧继电器51关断,并使断开检测电路侧继电器52接通。并且,控制部60使继电器53接通。然后,控制部60从断开检测电路40对连接线41施加检测电压。当施加检测电压后,如图3的箭头71~箭头73所示,电流从断开检测电路侧继电器52穿过连接线17流入至滑环13,并从滑环13穿过旋转轴12、端子15,如图3的箭头74所示,从引线21的端部16流入至缠绕在线轴10的本体11上的引线21。然后,如箭头75、箭头76所示,电流穿过直线部分的引线21,如箭头77所示,穿过从瓷嘴23的前端延伸出来的引线21流入至与元件19的电极接合着的压接球24a。然后,从元件19的电极流入至地线。
当引线21与元件19的电极电性连接时,电流通过如以上所述的路径从断开检测电路40流入至地线,使得从断开检测电路40施加至连接线41的电压下降。然后,当连接线41的电压下降时,控制部60判断为引线21与元件19良好地连接着,相反地,当施加电压不下降时,判断为引线21与元件19之间的连接不良而产生了断开,并输出断开检测的信号。
并且,在压接球形成后使引线21与基板18接合之后,在基板18与瓷嘴23之间,形成为图3中以点划线表示的尾端引线21a延伸出来的状态。控制部60使夹持器22关闭而将引线21拉起来,从基板18上切断尾端引线21a。在所述切断动作即将进行之前,控制部60与以上所述同样地,从断开检测电路40对连接线41施加电压而进行基板18与引线21的断开检测。在所述状态下,夹持器22为关闭,因此除了以上所说明的路径以外,如图3的箭头78、箭头79所示,电流还从连接线17穿过继电器53、连接线25流入至夹持器22,电流还从夹持器22流入至引线21。控制部60与以上所说明同样地,当连接线41的电压下降时,判断为引线21与基板18良好地连接着,相反地,当施加电压不下降时,判断为引线21与基板18之间的连接不良而产生了断开,并输出断开检测的信号。
如以上所说明那样,本实施方式的引线接合装置100将第一切换开关50设为高压电源电路侧,使继电器53关断,而形成自由空气球24,并将第一切换开关50设为断开检测电路侧,使得继电器53接通而进行断开检测,因此能够在形成自由空气球24时,防止夹持器22与引线21之间的二次放电的产生而抑制夹持器22的电腐蚀,并且进行引线21与元件19或基板18的断开检测。并且,通过如上所述的工序,能够制造如下的半导体装置:一边抑制夹持器22的电腐蚀,并且进行引线21与元件19或基板18的断开检测,一边使引线21接合于基板18上的元件19或基板18,而利用引线21将元件19与基板18加以连接。
其次,一边参照图4,一边说明本发明的另一实施方式的引线接合装置200。对与先前参照图1至图3所说明的引线接合装置100相同的部分标注相同的符号,并且省略说明。
当利用以上所述的引线接合装置100进行元件19与引线的断开检测时,通过从断开检测电路40对连接线41施加检测电压,而使得电流穿过线轴10从引线21、压接球24a流入至地线。此时,当线轴10的滑环13的导通不良时,施加电压不会下降,尽管引线21与元件19连接着,也有可能错误检测出断开。因此,本实施方式的引线接合装置200如图4所示,引线接合装置200包括将第一切换开关50的线轴侧与接地线55的连接切换成参照图1至图3所说明的引线接合装置100的连接线17的第二切换开关54,使得能够进行线轴10的滑环13的导通确认。如图4所示,第二切换开关54与控制部60连接,并通过控制部60的命令而运行。因此,引线接合装置200能够辨别施加电压不下降的主要因素是来自于断开还是来自于滑环13的导通不良,从而能够抑制错误检测出断开的情况,能够更确实地进行断开检测。
一边参照图4,一边说明利用引线接合装置200进行滑环13的导通确认的动作。控制部60将第二切换开关54切换至接地线55之侧,使连接线17与接地线55导通,并中断连接线17与高压电源电路侧继电器51的线轴侧的导通。而且,控制部60使继电器53接通,并且使夹持器22关闭。
控制部60与先前的断开检测的动作同样地,从断开检测电路40对连接线41施加检测电压。当施加检测电压后,如图4的箭头71、箭头91、箭头78、箭头79所示,电流从断开检测电路侧继电器52穿过连接线17、继电器53而流入至夹持器22。然后,如图4的箭头83、箭头84所示,电流从夹持器22流入至引线21,从缠绕在线轴10的本体11上的引线21的端部16流入至端子15,如图4的箭头85所示,从本体11的凸缘部穿过旋转轴12从滑环13流入至连接线17,如箭头92所示,穿过第二切换开关54流入至接地线55,并如箭头93、箭头94所示流入至接地线55。与以上所述的断开检测同样,如果滑环13经导通,那么电流会通过如以上所说明的路径从断开检测电路40流入至地线,使得从断开检测电路40施加至连接线41的电压下降。并且,当连接线41的电压下降时,控制部60判断为滑环13的导通正常。并且,相反地,当施加电压不下降时,则判断为滑环13的导通不良,输出滑环13的导通不良的信号。
如以上说明,在本实施方式的引线接合装置200中,除了与以上所说明的引线接合装置100同样的效果以外,还可以辨别施加电压不降低的主要因素是来自于断开还是来自于滑环13的导通不良,从而能够抑制断开错误检测,更确实地进行断开检测。
其次,一边参照图5,一边对另一实施方式的引线接合装置300进行说明。对与先前参照图1~图4而说明的引线接合装置100、引线接合装置200相同的部分标注相同的符号,并省略说明。引线接合装置300是对先前参照图4所说明的引线接合装置200追加有引线导件56、连接线57的装置。
引线导件56配置在线轴10与夹持器22之间,具有引线21的至少一部分所接触的贯通孔。引线导件56为金属制。引线导件56可以是从下侧对贯通孔喷附空气而对引线21施加向上的张力的吹起部。引线导件56通过连接线57而与第一切换开关50的线轴侧连接。
对引线接合装置300中的滑环13的导通确认进行说明。来自断开检测电路40的电流如图5的箭头95、箭头96所示,从第一切换开关50的线轴侧穿过连接线17流入至引线导件56。引线导件56与引线21接触,因此电流从引线导件56流入至引线21,并与先前参照图4所说明的同样地,从线轴10穿过接地线55流入至地线。因此,引线接合装置300即使在夹持器22为打开的状态下,也能够进行滑环13的导通确认。
如以上所述,本实施方式的引线接合装置300与以上所说明的引线接合装置200相比,可以更确实地进行滑环13的导通确认,能够更确实地抑制错误检测出断开的情况,因此能够更确实地进行断开检测。
Claims (5)
1.一种引线接合装置,包括:
线轴;
夹持器,抓持从所述线轴抽出的引线;
焊炬电极,通过放电而在所述引线的前端形成自由空气球;
高压电源电路,对所述焊炬电极供电;
断开检测电路,进行所述引线与元件或基板的断开检测;
第一切换开关,切换所述线轴与所述高压电源电路或所述断开检测电路的连接;
继电器,使所述夹持器与所述第一切换开关的线轴侧的连接接通/关断;以及
控制部,将所述第一切换开关设为高压电源电路侧,并且使所述继电器关断而产生所述放电,将所述第一切换开关设为断开检测电路侧,并且使所述继电器接通而进行所述断开检测。
2.根据权利要求1所述的引线接合装置,包括:
第二切换开关,配置在所述第一切换开关的所述线轴侧与所述线轴之间,切换所述第一切换开关的所述线轴侧与接地线的连接,
所述控制部将所述第一切换开关设为所述断开检测电路侧,并且使所述继电器接通,而且将所述第二切换开关设为接地线侧,从而进行所述线轴的导通确认。
3.根据权利要求2所述的引线接合装置,包括:
引线导件,配置在所述线轴与所述夹持器之间,具有所述引线的至少一部分所接触的贯通孔;以及
连接线,将所述引线导件与所述第一切换开关的所述线轴侧加以连接。
4.一种引线接合装置用电路,包括:
高压电源电路,对焊炬电极供电,所述焊炬电极通过放电而在引线的前端形成自由空气球;
断开检测电路,进行所述引线与元件或基板的断开检测;
第一切换开关,切换抽出所述引线的线轴与所述高压电源电路或所述断开检测电路的连接;
继电器,使夹持器与所述第一切换开关的线轴侧的连接接通/关断,所述夹持器抓持从所述线轴抽出的所述引线;以及
控制部,将所述第一切换开关设为高压电源电路侧,并且使所述继电器关断而产生所述放电,并且将所述第一切换开关设为断开检测电路侧,并且使所述继电器接通而进行所述断开检测。
5.一种半导体装置的制造方法,包括如下的工序:
准备引线接合装置,所述引线接合装置包括线轴、抓持从所述线轴抽出的引线的夹持器、通过放电而在所述引线的前端形成自由空气球的焊炬电极、对所述焊炬电极供电的高压电源电路、进行所述引线与元件或基板的断开检测的断开检测电路、切换所述线轴与所述高压电源电路或所述断开检测电路的连接的第一切换开关、以及使所述夹持器与所述第一切换开关的线轴侧的连接接通/关断的继电器;
将所述第一切换开关设为高压电源电路侧,并且使所述继电器关断,所述高压电源电路对所述焊炬电极供电而形成自由空气球;
将形成有所述自由空气球的所述引线接合于元件或基板;以及
将所述第一切换开关设为断开检测电路侧,并且使所述继电器接通,而进行所述引线与所述元件或基板的所述断开检测。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016-061147 | 2016-03-25 | ||
JP2016061147 | 2016-03-25 | ||
PCT/JP2017/012080 WO2017164386A1 (ja) | 2016-03-25 | 2017-03-24 | ワイヤボンディング装置、ワイヤボンディング装置用回路並びに半導体装置の製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN109155260A CN109155260A (zh) | 2019-01-04 |
CN109155260B true CN109155260B (zh) | 2021-10-29 |
Family
ID=59899523
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201780031626.0A Expired - Fee Related CN109155260B (zh) | 2016-03-25 | 2017-03-24 | 引线接合装置、其电路以及半导体装置的制造方法 |
Country Status (7)
Country | Link |
---|---|
US (1) | US10964661B2 (zh) |
JP (1) | JP6676748B2 (zh) |
KR (1) | KR102069565B1 (zh) |
CN (1) | CN109155260B (zh) |
SG (1) | SG11201811528TA (zh) |
TW (1) | TWI639202B (zh) |
WO (1) | WO2017164386A1 (zh) |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5468927A (en) * | 1993-09-21 | 1995-11-21 | Kabushiki Kaisha Shinkawa | Wire bonding apparatus |
JP2000306940A (ja) * | 1999-04-21 | 2000-11-02 | Shinkawa Ltd | バンプボンディングにおける不着検査方法及び装置 |
CN1790652A (zh) * | 2004-11-05 | 2006-06-21 | 株式会社海上 | 引线接合装置 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3041812U (ja) | 1997-01-16 | 1997-10-03 | 義一 花本 | 開閉式拡大レンズ付き腕時計 |
JPH11243119A (ja) | 1998-02-26 | 1999-09-07 | Power:Kk | ワイヤボンディング方法および装置 |
JP3908640B2 (ja) * | 2002-09-26 | 2007-04-25 | 株式会社新川 | ワイヤボンディング方法及び装置 |
JP4397326B2 (ja) * | 2004-12-27 | 2010-01-13 | 株式会社新川 | ボンディング装置 |
JP4547330B2 (ja) * | 2005-12-28 | 2010-09-22 | 株式会社新川 | ワイヤボンディング装置、ボンディング制御プログラム及びボンディング方法 |
-
2017
- 2017-03-24 SG SG11201811528TA patent/SG11201811528TA/en unknown
- 2017-03-24 US US16/088,081 patent/US10964661B2/en active Active
- 2017-03-24 JP JP2018507451A patent/JP6676748B2/ja active Active
- 2017-03-24 WO PCT/JP2017/012080 patent/WO2017164386A1/ja active Application Filing
- 2017-03-24 CN CN201780031626.0A patent/CN109155260B/zh not_active Expired - Fee Related
- 2017-03-24 KR KR1020187030659A patent/KR102069565B1/ko active Active
- 2017-03-24 TW TW106109850A patent/TWI639202B/zh active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5468927A (en) * | 1993-09-21 | 1995-11-21 | Kabushiki Kaisha Shinkawa | Wire bonding apparatus |
JP2000306940A (ja) * | 1999-04-21 | 2000-11-02 | Shinkawa Ltd | バンプボンディングにおける不着検査方法及び装置 |
CN1790652A (zh) * | 2004-11-05 | 2006-06-21 | 株式会社海上 | 引线接合装置 |
Also Published As
Publication number | Publication date |
---|---|
TWI639202B (zh) | 2018-10-21 |
KR20180125557A (ko) | 2018-11-23 |
CN109155260A (zh) | 2019-01-04 |
JPWO2017164386A1 (ja) | 2019-01-31 |
US10964661B2 (en) | 2021-03-30 |
JP6676748B2 (ja) | 2020-04-08 |
TW201801207A (zh) | 2018-01-01 |
WO2017164386A1 (ja) | 2017-09-28 |
US20200294957A1 (en) | 2020-09-17 |
SG11201811528TA (en) | 2019-01-30 |
KR102069565B1 (ko) | 2020-01-23 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP6428770B2 (ja) | 多線巻線方法及び多線巻線装置 | |
CN106165076A (zh) | 打线装置以及半导体装置的制造方法 | |
JP6428771B2 (ja) | 多線巻線方法及び多線巻線装置 | |
CN109155260B (zh) | 引线接合装置、其电路以及半导体装置的制造方法 | |
WO2014010065A1 (ja) | 電線処理装置 | |
JP4176671B2 (ja) | ワイヤボンディング装置 | |
JP3665296B2 (ja) | コイル巻線時の端末処理方法 | |
CN113625010B (zh) | 一种接线装置 | |
TW200926319A (en) | Wire bonding device and wire bonding method | |
KR102692793B1 (ko) | 정션 블록 검사 장치 및 방법 | |
KR200172658Y1 (ko) | 반도체 패키지 제조용 와이어본딩 장비의 와이어 스풀구조 | |
CN103111742A (zh) | 焊接漆包线用点焊头 | |
CN103323632A (zh) | 测试线 | |
JP2000269028A (ja) | ソレノイド装置 | |
JP3908640B2 (ja) | ワイヤボンディング方法及び装置 | |
JP3666404B2 (ja) | 細線処理装置 | |
CN205405255U (zh) | 一种遥控阀门的总线控制系统里的故障判断机构 | |
JPS59230411A (ja) | ワイヤストリップ機の異常検出装置 | |
JPH06313786A (ja) | 被膜検査装置 | |
JP2004354378A (ja) | 絶縁検査装置、及び、電気絶縁部の検査方法 | |
KR100685127B1 (ko) | 스프링손상감지장치를 구비하는 이송장치 | |
JP2004119639A (ja) | ワイヤボンディング方法及び装置 | |
WO2014162714A1 (ja) | プラズマ切断用トーチ、プラズマ切断用電源およびプラズマ切断装置 | |
JP2014093896A (ja) | 高電圧インターロック装置 | |
JP2010162565A (ja) | 電子部品の製造方法、アーク溶接装置、及びアーク溶接方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
GR01 | Patent grant | ||
GR01 | Patent grant | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20211029 |
|
CF01 | Termination of patent right due to non-payment of annual fee |