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CN108231928A - A kind of HJT hetero-junction solar cells and its multi-layer transparent electroconductive film - Google Patents

A kind of HJT hetero-junction solar cells and its multi-layer transparent electroconductive film Download PDF

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CN108231928A
CN108231928A CN201711395346.6A CN201711395346A CN108231928A CN 108231928 A CN108231928 A CN 108231928A CN 201711395346 A CN201711395346 A CN 201711395346A CN 108231928 A CN108231928 A CN 108231928A
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film
ito
transparent conductive
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崔鸽
何永才
郁操
张津燕
徐希翔
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Beijing Juntai Innovation Technology Co Ltd
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Priority to EP18183592.7A priority patent/EP3503208A1/en
Priority to PCT/CN2018/095796 priority patent/WO2019119788A1/en
Priority to CA3011855A priority patent/CA3011855A1/en
Priority to AU2018206805A priority patent/AU2018206805A1/en
Priority to JP2018002821U priority patent/JP3218305U/en
Priority to KR2020180003383U priority patent/KR20190001652U/en
Priority to US16/048,192 priority patent/US20190198698A1/en
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    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F19/00Integrated devices, or assemblies of multiple devices, comprising at least one photovoltaic cell covered by group H10F10/00, e.g. photovoltaic modules
    • H10F19/30Integrated devices, or assemblies of multiple devices, comprising at least one photovoltaic cell covered by group H10F10/00, e.g. photovoltaic modules comprising thin-film photovoltaic cells
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
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    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/08Oxides
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34Sputtering
    • C23C14/35Sputtering by application of a magnetic field, e.g. magnetron sputtering
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00Constructional details of devices covered by this subclass
    • H10F77/20Electrodes
    • H10F77/244Electrodes made of transparent conductive layers, e.g. transparent conductive oxide [TCO] layers
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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    • Y02EREDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00Energy generation through renewable energy sources
    • Y02E10/50Photovoltaic [PV] energy

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Abstract

一种多层透明导电薄膜及其制备方法,所述多层透明导电薄膜包括至少两层叠加的透明导电薄膜,至少两层透明导电薄膜均为ITO薄膜,所述第一层ITO薄膜的锡的掺量为10‑15重量%,所述第二层ITO薄膜的锡的掺量≥5重量%且<10重量%;所述制备方法包括:在真空条件下连续制备多层ITO薄膜,并且在一层ITO薄膜与另一层ITO薄膜的过渡过程中,维持真空状态。本申请还提供了一种包括上述多层透明导电薄膜的HJT异质结电池。本申请的多层透明导电薄膜的光电性能较好,与p、n型非晶硅层的功函数匹配;HJT电池的各项性能指标都得到了提升。

A multi-layer transparent conductive film and a preparation method thereof, the multi-layer transparent conductive film comprises at least two layers of superimposed transparent conductive films, at least two layers of transparent conductive films are ITO films, the tin of the first layer of ITO film The dosing amount is 10-15% by weight, and the tin dosing amount of the second layer of ITO film is more than 5% by weight and <10% by weight; the preparation method comprises: continuously preparing a multi-layer ITO film under vacuum conditions, and During the transition process between one layer of ITO film and another layer of ITO film, the vacuum state is maintained. The present application also provides a HJT heterojunction battery comprising the above-mentioned multi-layer transparent conductive film. The photoelectric performance of the multi-layer transparent conductive thin film of the application is good, matching with the work function of the p-type and n-type amorphous silicon layers; various performance indexes of the HJT battery have been improved.

Description

一种HJT异质结电池及其多层透明导电薄膜A kind of HJT heterojunction battery and its multilayer transparent conductive film

技术领域technical field

本申请涉及但不限于太阳能电池工艺技术领域,特别涉及但不限于一种HJT异质结电池及其多层透明导电薄膜。The present application relates to but not limited to the technical field of solar cell technology, and particularly relates to but not limited to a HJT heterojunction cell and its multilayer transparent conductive film.

背景技术Background technique

异质结非晶硅/晶硅太阳能电池HJT(Hetero-junction with Intrinsic Thinlayer,简称HJT)是目前主流的高效太阳能电池。其基本结构通常如图1所示,包含1:晶体硅;2:本征非晶硅层;3:p型非晶硅层;4:n型非晶硅层;5:透明导电薄膜层;6:正面栅线;7:背面栅线。The heterojunction amorphous silicon/crystalline silicon solar cell HJT (Hetero-junction with Intrinsic Thinlayer, referred to as HJT) is currently the mainstream high-efficiency solar cell. Its basic structure is usually shown in Figure 1, including 1: crystalline silicon; 2: intrinsic amorphous silicon layer; 3: p-type amorphous silicon layer; 4: n-type amorphous silicon layer; 5: transparent conductive film layer; 6: Front grid line; 7: Back grid line.

氧化铟锡薄膜(Indium Oxide doped Tin Film,简称ITO)由于具有低电阻率、高可见光透过率等优良的物理特性,被广泛应用于HJT太阳能电池的透明导电薄膜层。Indium Oxide doped Tin Film (ITO for short) is widely used in the transparent conductive film layer of HJT solar cells due to its excellent physical properties such as low resistivity and high visible light transmittance.

ITO在HJT电池中起着导电和减反射膜的作用。目前广泛使用的ITO均为单层膜。作为减反膜,传统的1/4波长单ITO层膜仅对特定波长的小角度入射有很好的减反射效果。为了更好地满足HJT电池的减反射要求,多层减反膜应运而生。ITO acts as a conductive and anti-reflection film in HJT cells. The widely used ITO is a single-layer film. As an anti-reflection coating, the traditional 1/4 wavelength single-layer ITO film has a good anti-reflection effect only for small-angle incidents of specific wavelengths. In order to better meet the anti-reflection requirements of HJT batteries, multi-layer anti-reflection coatings came into being.

发明内容Contents of the invention

以下是对本文详细描述的主题的概述。本概述并非是为了限制权利要求的保护范围。The following is an overview of the topics described in detail in this article. This summary is not intended to limit the scope of the claims.

本申请提供了一种能够改善HJT太阳能电池性能的多层透明导电薄膜。The application provides a multilayer transparent conductive film capable of improving the performance of HJT solar cells.

具体地,本申请提供了一种多层透明导电薄膜,所述多层透明导电薄膜包括至少两层叠加的透明导电薄膜,至少两层透明导电薄膜均为ITO薄膜,所述第一层ITO薄膜的锡的掺量为10-15重量%,所述第二层ITO薄膜的锡的掺量≥5重量%且<10重量%。Specifically, the application provides a multilayer transparent conductive film, the multilayer transparent conductive film includes at least two layers of transparent conductive films, at least two layers of transparent conductive films are ITO films, and the first layer of ITO film The doping amount of tin is 10-15% by weight, and the doping amount of tin in the second layer of ITO film is ≥5% by weight and <10% by weight.

在一些实施方式中,所述多层透明导电薄膜还可以包括第三层ITO薄膜,所述第一层ITO薄膜、所述第二层ITO薄膜和所述第三层ITO薄膜按顺序设置,所述第三层ITO薄膜的锡的掺量可以≥1重量%且<5重量%,或为10-15重量%。In some embodiments, the multilayer transparent conductive film may also include a third layer of ITO film, the first layer of ITO film, the second layer of ITO film and the third layer of ITO film are arranged in sequence, so The content of tin in the third layer of ITO film can be ≥ 1% by weight and < 5% by weight, or 10-15% by weight.

在一些实施方式中,所述第一层ITO薄膜的锡的掺量可以为10重量%,所述第二层ITO薄膜的锡的掺量可以为5重量%,所述第三层ITO薄膜的锡的掺量可以为3重量%。In some embodiments, the tin content of the first layer of ITO film can be 10% by weight, the tin content of the second layer of ITO film can be 5% by weight, and the tin content of the third layer of ITO film The amount of tin added can be 3% by weight.

在一些实施方式中,所述多层透明导电薄膜还可以包括第四层ITO薄膜,所述第一层ITO薄膜、所述第二层ITO薄膜、所述第三层ITO薄膜和所述第四层ITO薄膜按顺序设置,所述第四层ITO薄膜的锡的掺量可以为10-15重量%。In some embodiments, the multilayer transparent conductive film may also include a fourth layer of ITO film, the first layer of ITO film, the second layer of ITO film, the third layer of ITO film and the fourth layer of ITO film. Layers of ITO thin films are arranged in sequence, and the doping amount of tin in the fourth layer of ITO thin films can be 10-15% by weight.

在一些实施方式中,所述第一层ITO薄膜的锡的掺量可以为10重量%,所述第二层ITO薄膜的锡的掺量可以为5重量%,所述第三层ITO薄膜的锡的掺量可以为3重量%,所述第四层ITO薄膜的锡的掺量可以为10重量%。In some embodiments, the tin content of the first layer of ITO film can be 10% by weight, the tin content of the second layer of ITO film can be 5% by weight, and the tin content of the third layer of ITO film The doping amount of tin may be 3% by weight, and the doping amount of tin in the fourth layer of ITO thin film may be 10% by weight.

在一些实施方式中,每一层ITO薄膜的厚度可以在15-50nm的范围内。In some embodiments, the thickness of each layer of ITO film can be in the range of 15-50 nm.

在一些实施方式中,每一层ITO薄膜的折射率n可以在1.8-2.0的范围内,禁带宽度可以在3.0-4.6eV的范围内,载流子浓度可以在(1-10)×1020cm-3的范围内,载流子迁移率可以在10-50cm2/vs的范围内。In some embodiments, the refractive index n of each layer of ITO film can be in the range of 1.8-2.0, the band gap can be in the range of 3.0-4.6eV, and the carrier concentration can be in the range of (1-10)×10 In the range of 20 cm -3 , the carrier mobility can be in the range of 10-50 cm 2 /vs.

本申请还提供了如上所述的多层透明导电薄膜的制备方法,所述方法包括:在真空条件下连续制备多层ITO薄膜,并且在一层ITO薄膜与另一层ITO薄膜的过渡过程中,维持真空状态。The present application also provides a method for preparing the multilayer transparent conductive film as described above, the method comprising: continuously preparing a multilayer ITO film under vacuum conditions, and during the transition process between one layer of ITO film and another layer of ITO film , to maintain a vacuum state.

在一些实施方式中,在真空条件下连续制备多层ITO薄膜的步骤可以为:采用磁控溅射法在真空条件下连续制备多层ITO薄膜;In some embodiments, the step of continuously preparing a multilayer ITO thin film under vacuum conditions may be: using magnetron sputtering to continuously prepare a multilayer ITO thin film under vacuum conditions;

在一些实施方式中,在真空条件下连续制备多层ITO薄膜的步骤可以为:采用磁控溅射法在真空条件下连续制备多层ITO薄膜,其中,所述磁控溅射法采用的气体可以为氧气与氩气的混合气,并且氧气与氩气的体积流量比可以为0-3:97,溅射功率可以为2-8kW,制备过程所采用的腔室的本底真空度可以控制在≥5×10-4Pa的范围内。In some embodiments, the step of continuously preparing a multilayer ITO thin film under vacuum conditions may be: using a magnetron sputtering method to continuously prepare a multilayer ITO thin film under vacuum conditions, wherein the gas used in the magnetron sputtering method It can be a mixture of oxygen and argon, and the volume flow ratio of oxygen and argon can be 0-3:97, the sputtering power can be 2-8kW, and the background vacuum degree of the chamber used in the preparation process can be controlled In the range of ≥5×10 -4 Pa.

本申请还提供了一种HJT异质结电池,所述HJT电池包括如上所述的多层透明导电薄膜。The present application also provides a HJT heterojunction battery, the HJT battery includes the above-mentioned multi-layer transparent conductive film.

在一些实施方式中,所述HJT异质结电池的一面可以包括至少两层叠加的透明导电薄膜,另一面可以包括至少三层叠加的透明导电薄膜。In some embodiments, one side of the HJT heterojunction cell may include at least two stacked transparent conductive films, and the other side may include at least three stacked transparent conductive films.

在一些实施方式中,所述HJT异质结电池还可以包括晶体硅层(1)、本征非晶硅层(2)、第一非晶硅层(3)、第二非晶硅层(4)和栅线(6,7),所述晶体硅层(1)具有第一表面和第二表面;In some embodiments, the HJT heterojunction cell can also include a crystalline silicon layer (1), an intrinsic amorphous silicon layer (2), a first amorphous silicon layer (3), a second amorphous silicon layer ( 4) and gate lines (6, 7), the crystalline silicon layer (1) has a first surface and a second surface;

所述HJT异质结电池的一面可以包括多层透明导电薄膜(5),另一面可以包括多层透明导电薄膜(5’),所述多层透明导电薄膜(5)可以设置有四层透明导电薄膜,所述多层透明导电薄膜(5’)可以设置有三层透明导电薄膜;One side of the HJT heterojunction cell can include a multilayer transparent conductive film (5), and the other side can include a multilayer transparent conductive film (5'), and the multilayer transparent conductive film (5) can be provided with four layers of transparent conductive films. A conductive film, the multi-layer transparent conductive film (5') can be provided with three layers of transparent conductive films;

所述本征非晶硅层(2)、所述第二非晶硅层(4)、所述多层透明导电薄膜(5)的第四层ITO薄膜(5-4)、第三层ITO薄膜(5-3)、第二层ITO薄膜(5-2)、第一层ITO薄膜(5-1)和所述栅线6可以按从内到外的顺序依次设置在所述晶体硅层(1)的第一表面上;The intrinsic amorphous silicon layer (2), the second amorphous silicon layer (4), the fourth layer of ITO film (5-4) of the multilayer transparent conductive film (5), the third layer of ITO The film (5-3), the second layer of ITO film (5-2), the first layer of ITO film (5-1) and the gate line 6 can be arranged on the crystalline silicon layer in sequence from inside to outside (1) on the first surface;

所述本征非晶硅层(2)、所述第一非晶硅层(3)、所述多层透明导电薄膜(5’)的第三层ITO薄膜(5-3’)、第二层ITO薄膜(5-2’)、第一层ITO薄膜(5-1’)和所述栅线7可以按从内到外的顺序依次设置在所述晶体硅层(1)的第二表面上。The intrinsic amorphous silicon layer (2), the first amorphous silicon layer (3), the third layer ITO film (5-3') of the multilayer transparent conductive film (5'), the second The first layer of ITO film (5-2'), the first layer of ITO film (5-1') and the gate line 7 can be sequentially arranged on the second surface of the crystalline silicon layer (1) from inside to outside superior.

在一些实施方式中,所述多层透明导电薄膜(5)的第一层ITO薄膜(5-1)的锡的掺量可以为10重量%,第二层ITO薄膜(5-2)的锡的掺量可以为5重量%,第三层ITO薄膜(5-3)的锡的掺量可以为3重量%,第四层ITO薄膜(5-4)的锡的掺量可以为10重量%;In some embodiments, the doping amount of tin in the first layer of ITO film (5-1) of the multilayer transparent conductive film (5) can be 10% by weight, and the tin in the second layer of ITO film (5-2) The dosage of tin can be 5% by weight, the dosage of tin in the third layer of ITO film (5-3) can be 3% by weight, and the dosage of tin in the fourth layer of ITO film (5-4) can be 10% by weight ;

所述多层透明导电薄膜(5’)的第一层ITO薄膜(5-1’)的锡的掺量可以为10重量%,第二层ITO薄膜(5-2’)的锡的掺量可以为5重量%,第三层ITO薄膜(5-3’)的锡的掺量可以为3重量%。The doping amount of tin in the first layer of ITO film (5-1') of the multilayer transparent conductive film (5') can be 10% by weight, and the doping amount of tin in the second layer of ITO film (5-2') It can be 5% by weight, and the tin content of the third layer of ITO thin film (5-3') can be 3% by weight.

在一些实施方式中,所述晶体硅层(1)可以为n型晶体硅层。In some embodiments, the crystalline silicon layer (1) may be an n-type crystalline silicon layer.

在一些实施方式中,所述第一非晶硅层(3)可以为p型非晶硅层,所述第二非晶硅层(4)可以为n型非晶硅层。In some embodiments, the first amorphous silicon layer (3) may be a p-type amorphous silicon layer, and the second amorphous silicon layer (4) may be an n-type amorphous silicon layer.

本申请的发明人发现,ITO薄膜的光电性能,如折射率、功函数与p型非晶硅层、n型非晶硅层的匹配,直接影响着HJT电池的性能。本申请通过逐渐改变ITO中锡的掺杂量,形成多层阶梯型的ITO减反射薄膜,改善了ITO薄膜的光电性能。相对于单层ITO,本申请的多层阶梯型的ITO薄膜的优势具体来说就是通过多层阶梯型的ITO结构进一步减少光的损失,同时通过优化的ITO薄膜与p、n型非晶硅层的功函数匹配,使与n型非晶硅层接触的ITO具有相对低的功函数,而与p型非晶硅层接触的ITO具有相对高的功函数,最终提升了HJT电池的各项性能指标。The inventors of the present application found that the photoelectric performance of the ITO film, such as the matching of the refractive index and work function with the p-type amorphous silicon layer and the n-type amorphous silicon layer, directly affects the performance of the HJT battery. The present application gradually changes the doping amount of tin in ITO to form a multi-layer stepped ITO anti-reflection film, thereby improving the photoelectric performance of the ITO film. Compared with single-layer ITO, the advantage of the multi-layer stepped ITO thin film of this application is to further reduce the loss of light through the multi-layer stepped ITO structure, and at the same time, through the optimized ITO thin film and p, n-type amorphous silicon The work function of the layer is matched, so that the ITO in contact with the n-type amorphous silicon layer has a relatively low work function, and the ITO in contact with the p-type amorphous silicon layer has a relatively high work function, which ultimately improves the performance of the HJT battery. Performance.

本申请的其它特征和优点将在随后的说明书中阐述,并且,部分地从说明书中变得显而易见,或者通过实施本申请而了解。本申请的目的和其他优点可通过在说明书、权利要求书以及附图中所特别指出的结构来实现和获得。Additional features and advantages of the application will be set forth in the description which follows, and, in part, will be obvious from the description, or may be learned by practice of the application. The objectives and other advantages of the application will be realized and attained by the structure particularly pointed out in the written description and claims hereof as well as the appended drawings.

附图说明Description of drawings

附图用来提供对本申请技术方案的进一步理解,并且构成说明书的一部分,与本申请的实施例一起用于解释本申请的技术方案,并不构成对本申请技术方案的限制。The accompanying drawings are used to provide a further understanding of the technical solution of the present application, and constitute a part of the specification, and are used together with the embodiments of the present application to explain the technical solution of the present application, and do not constitute a limitation to the technical solution of the present application.

图1为传统HJT异质结电池的结构示意图。Figure 1 is a schematic diagram of the structure of a traditional HJT heterojunction cell.

图2为本申请实施例3的HJT异质结电池的结构示意图。FIG. 2 is a schematic structural view of the HJT heterojunction battery according to Example 3 of the present application.

具体实施方式Detailed ways

为使本申请的目的、技术方案和优点更加清楚明白,下文中将结合附图对本申请的实施例进行详细说明。需要说明的是,在不冲突的情况下,本申请中的实施例及实施例中的特征可以相互任意组合。In order to make the purpose, technical solution and advantages of the application clearer, the embodiments of the application will be described in detail below in conjunction with the accompanying drawings. It should be noted that, in the case of no conflict, the embodiments in the present application and the features in the embodiments can be combined arbitrarily with each other.

实施例1Example 1

一种多层透明导电薄膜5,包括四层叠加的ITO薄膜,依序为第一层ITO薄膜5-1、第二层ITO薄膜5-2、第三层ITO薄膜5-3、第四层ITO薄膜5-4;其中,所述第一层ITO薄膜5-1的锡的掺量为10重量%,厚度为34nm;所述第二层ITO薄膜5-2的锡的掺量为5重量%,厚度为34nm;所述第三层ITO薄膜5-3的锡的掺量为3重量%,厚度为34nm;所述第四层ITO薄膜5-4的锡的掺量为10重量%,厚度为10nm。A multi-layer transparent conductive film 5, comprising four layers of stacked ITO films, sequentially the first layer of ITO film 5-1, the second layer of ITO film 5-2, the third layer of ITO film 5-3, the fourth layer ITO thin film 5-4; Wherein, the dosing amount of the tin of described first layer ITO thin film 5-1 is 10 weight %, thickness is 34nm; The dosing amount of the tin of described second layer ITO thin film 5-2 is 5 weight % %, the thickness is 34nm; the tin content of the third layer of ITO film 5-3 is 3% by weight, and the thickness is 34nm; the tin content of the fourth layer of ITO film 5-4 is 10% by weight, The thickness is 10nm.

按照下述方法制备所述多层透明导电薄膜5:Prepare the multilayer transparent conductive film 5 according to the following method:

(1)选择衬底(已沉积两层本征非晶硅层和两层非晶硅层的晶体硅片);(1) select the substrate (a crystalline silicon wafer that has deposited two layers of intrinsic amorphous silicon layers and two layers of amorphous silicon layers);

(2)调节真空腔室的真空度为5×10-4Pa,按照2:98的体积流量比向真空腔室中通入氧气和氩气,溅射功率为4kW,采用磁控溅射法在所述衬底的第一表面沉积所述第四层ITO薄膜5-4;(2) Adjust the vacuum degree of the vacuum chamber to 5×10 -4 Pa, feed oxygen and argon into the vacuum chamber according to the volume flow ratio of 2:98, and use the magnetron sputtering method at a sputtering power of 4kW Depositing the fourth layer of ITO thin film 5-4 on the first surface of the substrate;

(3)维持真空腔室的真空度为5×10-4Pa,按照5:95的体积流量比向真空腔室中通入氧气和氩气,溅射功率为4kw,继续在真空腔室中沉积所述第三层ITO薄膜5-3;(3) Maintain the vacuum degree of the vacuum chamber at 5×10 -4 Pa, feed oxygen and argon into the vacuum chamber according to the volume flow ratio of 5:95, and the sputtering power is 4kw, continue to spray in the vacuum chamber Depositing the third layer of ITO film 5-3;

(4)维持真空腔室的真空度为5×10-4Pa,按照6:94的体积流量比向真空腔室中通入氧气和氩气,溅射功率为4kw,继续在真空腔室中沉积所述第二层ITO薄膜5-2;(4) Maintain the vacuum degree of the vacuum chamber at 5 × 10 -4 Pa, feed oxygen and argon into the vacuum chamber according to the volume flow ratio of 6:94, and the sputtering power is 4kw, continue to spray in the vacuum chamber Depositing the second layer of ITO thin film 5-2;

(5)维持真空腔室的真空度为5×10-4Pa,按照2:98的体积流量比向真空腔室中通入氧气和氩气,溅射功率为4kw,继续在真空腔室中沉积所述第一层ITO薄膜5-1。(5) Maintain the vacuum degree of the vacuum chamber at 5×10 -4 Pa, pass oxygen and argon into the vacuum chamber according to the volume flow ratio of 2:98, and the sputtering power is 4kw, continue in the vacuum chamber Deposit the first layer of ITO thin film 5-1.

整个沉积过程中不打开真空腔室,连续进行沉积,不能破空。During the entire deposition process, the vacuum chamber is not opened, and the deposition is carried out continuously, and the vacuum cannot be broken.

实施例2Example 2

一种多层透明导电薄膜5’,包括三层叠加的ITO薄膜,依序为第一层ITO薄膜5-1’、第二层ITO薄膜5-2’、第三层ITO薄膜5-3’,其中,所述第一层ITO薄膜5-1’的锡的掺量为10重量%,厚度为37nm;所述第二层ITO薄膜5-2’的锡的掺量为5重量%,厚度为37nm;所述第三层ITO薄膜5-3’的锡的掺量为3重量%,厚度为37nm。A multi-layer transparent conductive film 5', including three layers of ITO films, which are sequentially the first layer of ITO film 5-1', the second layer of ITO film 5-2', and the third layer of ITO film 5-3' , wherein, the tin doping amount of the first layer of ITO film 5-1' is 10% by weight, and the thickness is 37nm; the tin doping amount of the second layer of ITO film 5-2' is 5% by weight, and the thickness is 37nm; the doping amount of tin in the third layer of ITO thin film 5-3' is 3% by weight, and the thickness is 37nm.

按照实施例1中制备所述多层透明导电薄膜5的步骤(3)-(5)在实施例1的衬底的第二表面上继续沉积所述多层透明导电薄膜5’的第三层ITO薄膜5-3’、第二层ITO薄膜5-2’和第一层ITO薄膜5-1’。According to the step (3)-(5) of preparing described multilayer transparent conductive film 5 in embodiment 1, continue to deposit the third layer of described multilayer transparent conductive film 5 ' on the second surface of the substrate of embodiment 1 ITO thin film 5-3', second layer ITO thin film 5-2' and first layer ITO thin film 5-1'.

实施例3Example 3

一种HJT异质结电池,其结构如图2所示,包括n型晶体硅层1、本征非晶硅层2、p型非晶硅层3、n型非晶硅层4、实施例1所述的多层透明导电层薄膜5、实施例2所述的多层透明导电层薄膜5’、正面栅线6和背面栅线7,所述晶体硅层1具有第一表面和第二表面;A kind of HJT heterojunction battery, its structure as shown in Figure 2, comprises n-type crystalline silicon layer 1, intrinsic amorphous silicon layer 2, p-type amorphous silicon layer 3, n-type amorphous silicon layer 4, embodiment The multilayer transparent conductive layer film 5 described in 1, the multilayer transparent conductive layer film 5' described in Embodiment 2, the front gate line 6 and the back gate line 7, the crystalline silicon layer 1 has a first surface and a second surface;

定义n型非晶硅层4所在的一面为电池的正面,p型非晶硅层3所在的一面为电池的背面;Define that the side where the n-type amorphous silicon layer 4 is located is the front side of the battery, and the side where the p-type amorphous silicon layer 3 is located is the back side of the battery;

所述本征非晶硅层2、所述n型非晶硅层4、实施例1所述的多层透明导电层薄膜5的第四层ITO薄膜5-4、第三层ITO薄膜5-3、第二层ITO薄膜5-2和第一层ITO薄膜5-1和所述正面栅线6按从内到外的顺序依次设置在所述晶体硅层1的第一表面上;The intrinsic amorphous silicon layer 2, the n-type amorphous silicon layer 4, the fourth layer ITO film 5-4 of the multilayer transparent conductive layer film 5 described in Embodiment 1, the third layer ITO film 5- 3. The second layer of ITO film 5-2, the first layer of ITO film 5-1 and the front gate line 6 are sequentially arranged on the first surface of the crystalline silicon layer 1 in order from inside to outside;

所述本征非晶硅层2、所述p型非晶硅层3、实施例2所述的多层透明导电层薄膜5’的第三层ITO薄膜5-3’、第二层ITO薄膜5-2’、第一层ITO薄膜5-1’和所述背面栅线7按从内到外的顺序依次设置在所述晶体硅层1的第二表面上。The intrinsic amorphous silicon layer 2, the p-type amorphous silicon layer 3, the third layer of ITO film 5-3' of the multilayer transparent conductive layer film 5' described in Embodiment 2, and the second layer of ITO film 5-2', the first layer of ITO thin film 5-1' and the back gate line 7 are sequentially arranged on the second surface of the crystalline silicon layer 1 from inside to outside.

实施例4Example 4

一种HJT异质结电池,本实施例的HJT异质结电池与实施例3的异质结电池的不同之处仅在于:A HJT heterojunction battery. The difference between the HJT heterojunction battery in this embodiment and the heterojunction battery in Example 3 is only that:

多层透明导电薄膜5不包括第三层ITO薄膜5-3;多层透明导电层薄膜5’不包括第三层ITO薄膜5-3’。The multilayer transparent conductive film 5 does not include the third layer of ITO film 5-3; the multilayer transparent conductive film 5' does not include the third layer of ITO film 5-3'.

虽然本申请所揭露的实施方式如上,但所述的内容仅为便于理解本申请而采用的实施方式,并非用以限定本申请。任何本申请所属领域内的技术人员,在不脱离本申请所揭露的精神和范围的前提下,可以在实施的形式及细节上进行任何的修改与变化,但本申请的专利保护范围,仍须以所附的权利要求书所界定的范围为准。Although the embodiments disclosed in the present application are as above, the content described is only the embodiments adopted to facilitate understanding of the present application, and is not intended to limit the present application. Anyone skilled in the field of this application can make any modifications and changes in the form and details of implementation without departing from the spirit and scope disclosed in this application, but the scope of patent protection of this application must still be The scope defined by the appended claims shall prevail.

Claims (13)

1.一种多层透明导电薄膜,其特征在于,所述多层透明导电薄膜包括至少两层叠加的透明导电薄膜,至少两层透明导电薄膜均为ITO薄膜,所述第一层ITO薄膜的锡的掺量为10-15重量%,所述第二层ITO薄膜的锡的掺量≥5重量%且<10重量%。1. a multilayer transparent conductive film, it is characterized in that, described multilayer transparent conductive film comprises at least two layers of superimposed transparent conductive films, at least two layers of transparent conductive films are ITO films, the first layer of ITO films The doping amount of tin is 10-15% by weight, and the doping amount of tin in the second layer of ITO film is ≥5% by weight and <10% by weight. 2.根据权利要求1所述的多层透明导电薄膜,其特征在于,还包括第三层ITO薄膜,所述第一层ITO薄膜、所述第二层ITO薄膜和所述第三层ITO薄膜按顺序设置,所述第三层ITO薄膜的锡的掺量≥1重量%且<5重量%,或为10-15重量%。2. multilayer transparent conductive film according to claim 1, is characterized in that, also comprises the 3rd layer ITO film, described first layer ITO film, described second layer ITO film and described 3rd layer ITO film Set in sequence, the tin content of the third layer of ITO thin film is ≥1 wt% and <5 wt%, or 10-15 wt%. 3.根据权利要求2所述的多层透明导电薄膜,其特征在于,所述第一层ITO薄膜的锡的掺量为10重量%,所述第二层ITO薄膜的锡的掺量为5重量%,所述第三层ITO薄膜的锡的掺量为3重量%。3. multilayer transparent conductive film according to claim 2, is characterized in that, the dosing amount of the tin of described first layer ITO film is 10 weight %, the dosing amount of the tin of described second layer ITO film is 5. % by weight, the tin content of the third layer of ITO thin film is 3% by weight. 4.根据权利要求2所述的多层透明导电薄膜,其特征在于,还包括第四层ITO薄膜,所述第一层ITO薄膜、所述第二层ITO薄膜、所述第三层ITO薄膜和所述第四层ITO薄膜按顺序设置,所述第四层ITO薄膜的锡的掺量为10-15重量%。4. multilayer transparent conductive film according to claim 2, is characterized in that, also comprises the 4th layer ITO film, described first layer ITO film, described second layer ITO film, described 3rd layer ITO film and the fourth layer of ITO thin film are arranged sequentially, and the doping amount of tin in the fourth layer of ITO thin film is 10-15% by weight. 5.根据权利要求4所述的多层透明导电薄膜,其特征在于,所述第一层ITO薄膜的锡的掺量为10重量%,所述第二层ITO薄膜的锡的掺量为5重量%,所述第三层ITO薄膜的锡的掺量为3重量%,所述第四层ITO薄膜的锡的掺量为10重量%。5. multilayer transparent conductive film according to claim 4, is characterized in that, the dosing amount of the tin of described first layer ITO film is 10 weight %, the dosing amount of the tin of described second layer ITO film is 5. % by weight, the amount of tin in the third layer of ITO film is 3% by weight, and the amount of tin in the fourth layer of ITO film is 10% by weight. 6.根据权利要求1-5中任一项所述的多层透明导电薄膜,其特征在于,每一层ITO薄膜的厚度在15-50nm的范围内。6. The multilayer transparent conductive film according to any one of claims 1-5, characterized in that the thickness of each layer of ITO film is in the range of 15-50 nm. 7.根据权利要求1-6中任一项所述的多层透明导电薄膜,其特征在于,每一层ITO薄膜的折射率n在1.8-2.0的范围内,禁带宽度在3.0-4.6eV的范围内,载流子浓度在(1-10)×1020cm-3的范围内,载流子迁移率在10-50cm2/vs的范围内。7. The multilayer transparent conductive film according to any one of claims 1-6, characterized in that, the refractive index n of each layer of ITO film is in the range of 1.8-2.0, and the band gap is at 3.0-4.6eV In the range of , the carrier concentration is in the range of (1-10)×10 20 cm -3 , and the carrier mobility is in the range of 10-50 cm 2 /vs. 8.一种根据权利要求1-7中任一项所述的多层透明导电薄膜的制备方法,其特征在于,所述方法包括:在真空条件下连续制备多层ITO薄膜,并且在一层ITO薄膜与另一层ITO薄膜的过渡过程中,维持真空状态;8. A method for preparing the multilayer transparent conductive film according to any one of claims 1-7, wherein the method comprises: continuously preparing a multilayer ITO film under vacuum conditions, and in one layer During the transition process between the ITO film and another layer of ITO film, maintain the vacuum state; 在真空条件下连续制备多层ITO薄膜的步骤选自下述方式中的任意一种:采用磁控溅射法在真空条件下连续制备多层ITO薄膜;或者The step of continuously preparing a multilayer ITO thin film under vacuum conditions is selected from any one of the following modes: using magnetron sputtering to continuously prepare multilayer ITO thin films under vacuum conditions; or 采用磁控溅射法在真空条件下连续制备多层ITO薄膜,其中,所述磁控溅射法采用的气体为氧气与氩气的混合气,并且氧气与氩气的体积流量比为0-3:97,溅射功率为2-8kW,制备过程所采用的腔室的本底真空度控制在≥5×10-4Pa的范围内。Adopt magnetron sputtering method to prepare multilayer ITO film continuously under vacuum condition, wherein, the gas that described magnetron sputtering method adopts is the mixed gas of oxygen and argon, and the volume flow ratio of oxygen and argon is 0- 3:97, the sputtering power is 2-8kW, and the background vacuum degree of the chamber used in the preparation process is controlled within the range of ≥5×10 -4 Pa. 9.一种HJT异质结电池,其特征在于,所述HJT电池包括根据权利要求1-8中任一项所述的多层透明导电薄膜。9. A HJT heterojunction battery, characterized in that the HJT battery comprises the multilayer transparent conductive film according to any one of claims 1-8. 10.根据权利要求9所述的HJT异质结电池,其特征在于,所述HJT异质结电池的一面包括至少两层叠加的透明导电薄膜,另一面包括至少三层叠加的透明导电薄膜。10. The HJT heterojunction battery according to claim 9, wherein one side of the HJT heterojunction battery includes at least two layers of stacked transparent conductive films, and the other side includes at least three layers of stacked transparent conductive films. 11.根据权利要求10所述的HJT异质结电池,其特征在于,所述HJT异质结电池还包括晶体硅层(1)、本征非晶硅层(2)、第一非晶硅层(3)、第二非晶硅层(4)和栅线(6,7),所述晶体硅层(1)具有第一表面和第二表面;11. The HJT heterojunction battery according to claim 10, characterized in that, the HJT heterojunction battery further comprises a crystalline silicon layer (1), an intrinsic amorphous silicon layer (2), a first amorphous silicon a layer (3), a second amorphous silicon layer (4) and gate lines (6, 7), the crystalline silicon layer (1) having a first surface and a second surface; 所述HJT异质结电池的一面包括多层透明导电薄膜(5),另一面包括多层透明导电薄膜(5’),所述多层透明导电薄膜(5)设置有四层透明导电薄膜,所述多层透明导电薄膜(5’)设置有三层透明导电薄膜;One side of the HJT heterojunction battery includes a multi-layer transparent conductive film (5), and the other side includes a multi-layer transparent conductive film (5'), and the multi-layer transparent conductive film (5) is provided with four layers of transparent conductive films, The multi-layer transparent conductive film (5') is provided with three layers of transparent conductive films; 所述本征非晶硅层(2)、所述第二非晶硅层(4)、所述多层透明导电薄膜(5)的第四层ITO薄膜(5-4)、第三层ITO薄膜(5-3)、第二层ITO薄膜(5-2)、第一层ITO薄膜(5-1)和所述栅线6按从内到外的顺序依次设置在所述晶体硅层(1)的第一表面上;The intrinsic amorphous silicon layer (2), the second amorphous silicon layer (4), the fourth layer of ITO film (5-4) of the multilayer transparent conductive film (5), the third layer of ITO The thin film (5-3), the second layer of ITO thin film (5-2), the first layer of ITO thin film (5-1) and the gate line 6 are sequentially arranged on the crystalline silicon layer ( 1) on the first surface; 所述本征非晶硅层(2)、所述第一非晶硅层(3)、所述多层透明导电薄膜(5’)的第三层ITO薄膜(5-3’)、第二层ITO薄膜(5-2’)、第一层ITO薄膜(5-1’)和所述栅线7按从内到外的顺序依次设置在所述晶体硅层(1)的第二表面上。The intrinsic amorphous silicon layer (2), the first amorphous silicon layer (3), the third layer ITO film (5-3') of the multilayer transparent conductive film (5'), the second A layer of ITO thin film (5-2'), a first layer of ITO thin film (5-1') and the gate line 7 are sequentially arranged on the second surface of the crystalline silicon layer (1) from inside to outside . 12.根据权利要求11所述的HJT异质结电池,其特征在于,所述多层透明导电薄膜(5)的第一层ITO薄膜(5-1)的锡的掺量为10重量%,第二层ITO薄膜(5-2)的锡的掺量为5重量%,第三层ITO薄膜(5-3)的锡的掺量为3重量%,第四层ITO薄膜(5-4)的锡的掺量为10重量%;12. HJT heterojunction battery according to claim 11, is characterized in that, the doping amount of the tin of the first layer ITO film (5-1) of described multilayer transparent conductive film (5) is 10 weight %, The tin content of the second layer of ITO film (5-2) is 5% by weight, the tin content of the third layer of ITO film (5-3) is 3% by weight, the fourth layer of ITO film (5-4) The dosage of tin is 10% by weight; 所述多层透明导电薄膜(5’)的第一层ITO薄膜(5-1’)的锡的掺量为10重量%,第二层ITO薄膜(5-2’)的锡的掺量为5重量%,第三层ITO薄膜(5-3’)的锡的掺量为3重量%。The dosing amount of the tin of the first layer ITO film (5-1 ') of described multilayer transparent conductive film (5 ') is 10 weight %, the dosing amount of the tin of the second layer ITO film (5-2 ') is 5% by weight, and the doping amount of tin in the third layer of ITO thin film (5-3') is 3% by weight. 13.根据权利要求11或12所述的HJT异质结电池,其特征在于,所述晶体硅层(1)为n型晶体硅层;13. The HJT heterojunction battery according to claim 11 or 12, characterized in that the crystalline silicon layer (1) is an n-type crystalline silicon layer; 所述第一非晶硅层(3)为p型非晶硅层,所述第二非晶硅层(4)为n型非晶硅层。The first amorphous silicon layer (3) is a p-type amorphous silicon layer, and the second amorphous silicon layer (4) is an n-type amorphous silicon layer.
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