CN107027274A - A kind of rack semiconductor cooling device - Google Patents

Abstract

The invention discloses a cabinet semiconductor cooling device, which comprises a cold air passage arranged at the bottom of the cabinet, a hot air passage arranged below the cold air passage, a fan, and left and right partitions arranged on the left and right sides of the cabinet; wherein, the cold air An intermediate partition is provided between the passage and the hot air passage, and a semiconducting cooling plate is provided on the intermediate partition; fans are provided at both ends of the finned heat pipe air-cooled heat exchanger on the cold air passage and the hot air passage; A ventilation passage is provided between the left partition and the left side of the cabinet, and the ventilation passage communicates with the left side of the cold air passage to form a cabinet air outlet passage; a ventilation passage is provided between the right partition and the right side of the cabinet. The ventilation channel is connected with the right side of the cold air channel to form the air intake channel of the cabinet. The invention integrates the semiconductor refrigerating sheet, the finned heat pipe air-cooled heat exchanger and the fan etc. to improve the heat dissipation efficiency and reduce the energy consumption of the air conditioner in the machine room.

Description

A cabinet semiconductor cooling device

technical field

The invention relates to a cooling device for a cabinet, in particular to a semiconductor cooling device for a cabinet.

Background technique

With the development of electronic equipment, the power density and quantity of the cabinet server in the data center are gradually increasing, and its heat dissipation is also increasing at an alarming rate. Therefore, the cooling system of the cabinet with electronic equipment as the main equipment is particularly important; in the prior art Among them, cooling fans are installed on the outside of the cabinet for heat dissipation, and air conditioners are installed in the computer room to reduce the temperature to achieve the purpose of heat dissipation, but there are still many problems:

1. Install a cooling fan on the outside of the cabinet for heat dissipation. It is difficult to completely take away the heat in the cabinet, which will cause the electronic equipment in the cabinet to be prone to failure and reduce the service life;

2. Installing an air conditioner in the computer room can only reduce the indoor temperature, but cannot take heat away from the interior of the electronic equipment, the heat dissipation effect is poor, and the energy consumption of the air conditioner is very high.

Contents of the invention

The object of the present invention is to overcome the deficiencies of the prior art and provide a semiconductor cooling device for cabinets. The cooling load of the cabinet air conditioner is reduced, energy consumption is saved, and the cooling speed of the cabinet is fast.

The purpose of the present invention is achieved through the following technical solutions:

A semiconductor cooling device for a cabinet, including a cold air passage arranged at the bottom of the cabinet, a hot air passage arranged under the cold air passage, a fan, and left and right partitions arranged on the left and right sides of the cabinet; wherein, the cold air passage and the hot air An intermediate partition is arranged between the passages, and a semiconductive refrigeration sheet is arranged on the intermediate partition, and the upper part of the semiconductive refrigeration sheet is a cold end, and the lower part is a hot end; The hot plate is provided with a lower soaking plate on the hot end; the upper soaking plate and the lower soaking plate are equipped with finned heat pipe air-cooled heat exchangers; the finned heat pipes on the cold air channel and the hot air channel Fans are provided at both ends of the air-cooled heat exchanger; a ventilation channel is provided between the left partition and the left side of the cabinet, and the ventilation channel communicates with the left side of the cold air channel to form a cabinet air outlet channel; A ventilation channel is provided between the right partition and the right side of the cabinet, and the ventilation channel is connected with the right side of the cold air channel to form a cabinet air inlet channel; the cold air channel, the cabinet air inlet channel, the cabinet internal channel and the cabinet The air outlet channels are connected in sequence to form a ventilation circulation channel.

The working principle of the above cabinet semiconductor cooling device is:

When the electronic equipment in the cabinet generates a lot of heat due to long-term work, the semiconductor refrigeration sheet works, and the low temperature on the cold end is conducted to the finned heat pipe on the upper heat soaking plate through the upper soaking plate set on the cold end In the air-cooled heat exchanger, the temperature of the cold air channel is reduced; the hot end of the semiconductor refrigeration sheet conducts the high temperature on the hot end to the finned heat pipe air-cooled heat exchanger arranged on the lower soaking plate through the lower soaking plate In the middle, the temperature of the hot air channel rises; the fan set on the cold air channel works, and the cold air in the cold air channel is blown into the cabinet air inlet channel connected with the cold air channel. After the cold air passes through the inside of the cabinet, the heat is taken away. After the temperature rises, it becomes hot air. The hot air passes through the air outlet channel of the cabinet and then enters the cold air channel connected with the air outlet channel of the cabinet. After that, it turns into cold air again, and continues to enter the cabinet through the air inlet channel of the cabinet to take away the heat, so that the cycle continues; while the fan on the cold air channel is working, the fan on the hot air channel is working, and the air is passed through the air inlet of the hot air channel. The cold air is discharged from the air outlet after passing through the hot air channel, so as to realize the cooling of the hot air channel and ensure the normal operation of the semiconductor refrigeration chip.

In a preferred solution of the present invention, the inside of the cabinet is provided with several horizontal partitions along the vertical direction, and the space between two adjacent partitions constitutes a cooling channel inside the cabinet. By setting the partition board inside the cabinet, the cabinet is separated into several cooling channels, so that the cold air entering the cabinet is more uniform, and the heat inside the cabinet is fully taken away.

In a preferred solution of the present invention, an auxiliary fan is provided on the left side of each cooling channel of the cabinet. With this auxiliary fan, on the one hand, it is beneficial to speed up the cold air in the air inlet channel of the cabinet into the cooling channel, and fully take away the heat in each part of the cabinet; , back to the cold air channel to speed up the circulation.

In a preferred solution of the present invention, the right side of the hot air passage is an air inlet, the left side is an air outlet, and the air outlet is set outdoors. The air outlet of the hot air channel is set outdoors, which facilitates the independent discharge of heat to the outside, which is beneficial to reduce the cooling load of the indoor air conditioner in the computer room.

In a preferred solution of the present invention, there are multiple semiconductor cooling fins arranged on the middle partition, and they are installed equidistantly on the middle partition. By arranging multiple semiconductor cooling fins, it is beneficial to fully cool down the air-cooled heat exchanger of each finned heat pipe on the cold air channel, so that the temperature of the cold air delivered to the inside of the cabinet is lower and the heat dissipation speed is faster.

In a preferred solution of the present invention, wherein, the middle partition is composed of a heat insulation layer arranged in the middle and covering layers arranged on the upper and lower sides of the heat insulation layer; the top surface of the cold air channel and the bottom surface of the hot air channel are both provided There is insulation. By setting the middle partition as a structure composed of heat insulation layer and covering layer, the middle partition can thermally isolate the cold air passage and hot air passage by using the heat insulation layer, and at the same time, use the covering layer to provide sufficient rigidity for the entire middle partition Strength, so that it becomes the structural part of the cabinet; by setting the heat insulation layer on the top surface of the cold air channel, the cold air channel is thermally isolated from the inside of the cabinet, which is conducive to the sufficient heat dissipation of the inside of the cabinet by the circulating air flow; The heat shield prevents the heat in the hot air channel from being lost to the computer room, which will cause the temperature in the computer room to rise and increase the energy consumption of the air conditioner.

In a preferred solution of the present invention, wherein the finned heat pipe air-cooled heat exchangers of the cold air channel and the hot air channel are U-shaped finned heat pipe air-cooled heat exchangers, the bottom of the U-shaped finned heat pipe air-cooled heat exchanger It is arranged on the vapor chamber; the fan is installed in the middle of the U-shaped fin heat pipe air-cooled heat exchanger. The U-fin heat pipe air-cooled heat exchanger with such a structure is conducive to making the air in the cold air channel fully contact with the U-shaped fin heat pipe air-cooled heat exchanger, and can quickly reduce the temperature of the cold air channel; A fan is installed in the middle of the U-shaped fin heat pipe air-cooled heat exchanger, which is beneficial to transport the cold air in the cold air channel to the inside of the cabinet through the cabinet air inlet channel, avoiding the loss of cold air during the transportation process, and at the same time, it can also transfer the cold air in the hot air channel. Heat is removed more efficiently.

In a preferred solution of the present invention, wherein, the heat insulation layer in the middle partition is provided with an installation groove for installing a semiconductor cooling chip, and the covering layer on the upper side of the middle partition is provided with a U-shaped fin heat pipe windshield. The upper opening slot of the cold heat exchanger and the upper soaking plate, the covering layer on the lower side of the middle partition is provided with the lower opening slot for installing the U-shaped fin heat pipe air-cooled heat exchanger and the lower soaking plate; the upper The vapor chamber and the lower vapor chamber are respectively attached to the cold end and the hot end of the semiconductive refrigeration sheet, and their edges extend outward beyond the edge of the semiconductive refrigeration sheet. With such a structure of the middle partition, by setting the upper opening slot and the lower opening slot, on the one hand, it is convenient to connect the upper vapor chamber and the lower vapor chamber to the semiconductor cooling fin, and on the other hand, it is also convenient to firmly connect the U-shaped fin heat pipe The air-cooled heat exchanger is installed on the upper vapor chamber and the lower vapor chamber.

In a preferred solution of the present invention, a U-shaped finned heat pipe air-cooled heat exchanger is provided in the middle of the upper vapor chamber, and a U-shaped finned heat pipe air-cooled heat exchanger is provided at both ends of the lower vapor chamber. cold heat exchanger. The U-shaped finned heat pipe air-cooled heat exchanger set in this way is conducive to fully transferring the high temperature of the hot end of the semiconductor to the U-shaped finned heat pipe heat exchanger in the hot air channel, so as to avoid the high temperature of the hot end of the semiconductor refrigeration sheet and affect the cooling effect. normal operation of the terminal.

In a preferred solution of the present invention, the extending directions between the cold air passage and the hot air passage are perpendicular to each other.

Compared with the prior art, the present invention has the following beneficial effects:

1. Combining semiconductor cooling fins, finned heat pipe air-cooled heat exchangers, and fans together to form an efficient cooling ventilation circulation channel, improve heat dissipation efficiency, and greatly reduce air-conditioning energy consumption in the computer room.

2. The installation of the device is simple, and it is convenient to install on the original cabinet.

3. The device is installed at the lower part of the cabinet, which does not occupy the space of the machine room. At the same time, the heat dissipation is independently discharged outdoors, which can reduce the cooling load of the air conditioner in the machine room.

Description of drawings

FIG. 1 is a schematic structural view of a first embodiment of a semiconductor cooling device for a cabinet of the present invention.

Fig. 2 is a schematic structural diagram of a second specific embodiment of a semiconductor cooling device for a cabinet of the present invention.

detailed description

The present invention will be further described below in conjunction with the examples and drawings, but the embodiments of the present invention are not limited thereto.

Example 1

Referring to Fig. 1, a cabinet semiconductor cooling device according to this embodiment includes a cold air channel 5 arranged at the bottom of the cabinet, a hot air channel 7 arranged below the cold air channel 5, a fan 4, and left partitions 12 arranged on the left and right sides of the cabinet and the right partition 3; wherein, an intermediate partition 17 is provided between the cold air channel 5 and the hot air channel 7, and a semiconductor refrigeration sheet 8 is provided on the intermediate partition 17, and the upper surface of the semiconductor refrigeration sheet 8 is a cold end, the following is the hot end; the cold end of the semiconductor refrigeration sheet 8 is provided with an upper soaking plate 9, and the hot end is provided with a lower soaking plate 6; the upper soaking plate 9 and the lower soaking plate 6 are Finned heat pipe air-cooled heat exchangers 10 are all provided; fans 4 are arranged at both ends of the finned heat pipe air-cooled heat exchangers 10 on the cold air channel 5 and the hot air channel 7; A ventilation channel is provided between the left side of the cabinet, and the ventilation channel communicates with the left side of the cold air channel 5 to form a cabinet air outlet channel 13; a ventilation channel is provided between the right partition 3 and the right side of the cabinet, The ventilation channel communicates with the right side of the cold air channel 5 to form the cabinet air inlet channel 1; the cold air channel 5, the cabinet air inlet channel 1, the internal channel of the cabinet and the cabinet air outlet channel 13 are sequentially connected to form a ventilation circulation channel.

Referring to FIG. 1 , the inside of the cabinet is provided with several horizontal partitions 2 along the vertical direction, and the space between two adjacent partitions 2 constitutes a cooling channel inside the cabinet. By arranging the partition plate 2 inside the cabinet, the cabinet is separated into several cooling passages, so that the cold air entering the cabinet is more uniform, and the heat inside the cabinet is fully taken away.

Referring to FIG. 1 , an auxiliary fan 11 is provided on the left side of each cooling channel of the cabinet. The auxiliary fan 11 is provided, on the one hand, it is beneficial to bring the cold air in the air inlet channel 1 of the cabinet into the cooling channel, and fully take away the heat in each part of the cabinet; The wind channel 13 returns to the cold air channel 5 to speed up the circulation.

Referring to FIG. 1 , the right side of the hot air channel 7 is an air inlet, and the left side is an air outlet, and the air outlet is arranged outdoors. The air outlet of the hot air channel 7 is arranged outdoors, which facilitates the independent discharge of heat to the outside, and is beneficial to reduce the cooling load of the indoor air conditioner in the computer room.

Referring to FIG. 1 , there are multiple peltiers 8 arranged on the middle partition 17 , and they are installed on the middle partition 17 equidistantly. By arranging a plurality of semiconductor cooling fins 8, it is beneficial to fully cool down the temperature of each finned heat pipe air-cooled heat exchanger 10 on the cold air channel 5, so that the temperature of the cold air delivered to the inside of the cabinet is lower and the heat dissipation speed is faster.

Referring to Fig. 1, the working principle of a cabinet semiconductor cooling device in this embodiment is:

When the electronic equipment in the cabinet generates a large amount of heat due to long-term work, the semiconductor refrigeration sheet 8 works, and conducts the low temperature on the cold end to the upper soaking plate 9 arranged on the cold end through the upper soaking plate 9 arranged on the cold end. In the finned heat pipe air-cooled heat exchanger 10, the temperature of the cold air channel 5 is reduced; In the finned heat pipe air-cooled heat exchanger 10, the temperature of the hot air passage 7 is increased; the fan 4 arranged on the cold air passage 5 works, and the cold wind in the cold air passage 5 is blown to the cabinet air inlet passage communicated with the cold air passage 5 In 1, after the cold air passes through the inside of the cabinet, it takes away the heat, and becomes hot air after the temperature rises. After passing through the cold air channel 5 of the fin heat pipe air-cooled heat exchanger 10 with a lower temperature, it becomes cold air again, and continues to enter the cabinet through the cabinet air inlet channel 1 to take away the heat, so that it circulates continuously; in the cold air channel While the fan 4 on 5 is working, the fan 4 of the hot air passage 7 is working, and the cold air is introduced from the air inlet of the hot air passage 7, and is discharged from the air outlet after passing through the hot air passage 7, so as to realize the cooling of the hot air passage 7 and ensure that the semiconductor refrigeration sheet 8 normal work.

Example 2

The difference between this embodiment and embodiment 1 is:

Referring to Fig. 2, described middle dividing plate 17 is made of the heat insulation layer 15 that is arranged in the middle and the cover layer 18 that is located at the upper and lower sides of heat insulation layer 15; A heat insulating layer 15 is provided. By setting the middle partition 17 to a structure composed of a heat insulating layer 15 and a cover layer 18, the middle partition 17 can be used to thermally insulate the cold air passage 5 and the hot wind passage 7 by using the heat insulation layer 15, while using the cover layer 18 for The entire middle partition 17 provides enough rigidity to make it a structural part of the cabinet; by setting the heat insulation layer 15 on the top surface of the cold air passage 5, the cold air passage 5 is thermally isolated from the inside of the cabinet, which is conducive to the circulation of the air flow. The inside of the cabinet is fully radiated; heat shields are arranged below the hot air passage 7 to prevent the heat in the hot air passage 7 from being lost to the machine room, causing the temperature in the machine room to rise and increasing the energy consumption of the air conditioner.

Referring to Fig. 2, the finned heat pipe air-cooled heat exchanger 10 of the cold air channel 5 and the hot air channel 7 is a U-shaped finned heat pipe air-cooled heat exchanger 16, and the bottom of the U-shaped finned heat pipe air-cooled heat exchanger 16 is It is arranged on the vapor chamber; the fan 4 is installed in the middle of the U-shaped fin heat pipe air-cooled heat exchanger 16 . Adopting the U-shaped fin heat pipe air-cooled heat exchanger 16 of such structure is conducive to making the air in the cold air channel 5 fully contact with the U-shaped fin heat pipe air-cooled heat exchanger 16, and can quickly reduce the temperature of the cold air channel 5; On the one hand, the fan 4 is installed in the middle of the U-shaped fin heat pipe air-cooled heat exchanger 16, which is conducive to transporting the cold air in the cold air channel 5 to the inside of the cabinet through the cabinet air inlet channel 1, avoiding the loss of the cold air during the transportation process, and at the same time , the heat in the hot air channel 7 can also be taken away more effectively.

Referring to Fig. 2, the heat insulation layer 15 in the middle partition 17 is provided with an installation groove for installing the semiconductor refrigeration sheet 8, and the covering layer 18 on the upper side of the middle partition 17 is provided with a U-shaped fin heat pipe wind. The upper opening groove of the cold heat exchanger 16 and the upper soaking plate 9, the covering layer 18 on the lower side of the middle partition plate 17 is provided with a lower opening for installing the U-shaped fin heat pipe air-cooled heat exchanger 16 and the lower soaking plate 6 Open slot; the upper vapor chamber 9 and the lower vapor chamber 6 are attached to the cold end and the hot end of the semiconductive cooling sheet 8 respectively, and their edges extend outward beyond the edge of the semiconductive cooling sheet 8 . The middle partition 17 with such a structure, by setting the upper opening groove and the lower opening groove, on the one hand, it is convenient to connect the upper soaking plate 9 and the lower soaking plate 6 with the semiconductor cooling plate 8, and on the other hand, it is also convenient to firmly connect the U Type finned heat pipe air-cooled heat exchanger 16 is installed on the upper vapor chamber 9 and the lower vapor chamber 6 .

Referring to Fig. 2, a U-shaped fin heat pipe air-cooled heat exchanger 16 is provided in the middle of the upper vapor chamber 9, and a U-shaped fin heat pipe air-cooled heat exchanger 16 is provided at both ends of the lower vapor chamber 6. Heater 16. The U-shaped fin heat pipe air-cooled heat exchanger 16 arranged in this way is conducive to fully transferring the high temperature of the semiconductor hot end to the U-shaped fin heat pipe heat exchanger of the hot air channel 7, so as to avoid the excessive temperature of the semiconductor refrigeration sheet 8 hot end , affect the normal work of the cold end.

Referring to Fig. 2, the extension directions between the cold air passage 5 and the hot air passage 7 are perpendicular to each other, which facilitates the rational arrangement of the cold air passage 5 and the hot air passage 7 according to the specific structure of the cabinet, so that the position of the air inlet and outlet of the hot air passage 7 can be flexibly arranged .

The above is a preferred embodiment of the present invention, but the embodiment of the present invention is not limited by the above content, and any other changes, modifications, substitutions, combinations, and simplifications that do not deviate from the spirit and principles of the present invention, All should be equivalent replacement methods, and all are included in the protection scope of the present invention.

Claims (10)

1. A semiconductor cooling device for a cabinet, characterized in that it comprises a cold air channel arranged at the bottom of the cabinet, a hot air channel arranged below the cold air channel, a blower fan and left and right partitions arranged on the left and right sides of the cabinet; wherein, An intermediate partition is provided between the cold air passage and the hot air passage, and a semiconductor refrigeration sheet is provided on the intermediate partition, and the top of the semiconductor refrigeration sheet is a cold end, and the bottom is a hot end; the cold end of the semiconductor refrigeration sheet There is an upper soaking plate on the end, and a lower soaking plate on the hot end; both the upper soaking plate and the lower soaking plate are equipped with finned heat pipe air-cooled heat exchangers; the cold air channel and the hot air Both ends of the finned heat pipe air-cooled heat exchanger on the channel are provided with fans; a ventilation channel is provided between the left partition and the left side of the cabinet, and the ventilation channel communicates with the left side of the cold air channel to form a A cabinet air outlet channel; a ventilation channel is provided between the right partition and the right side of the cabinet, and the ventilation channel communicates with the right side of the cold air channel to form a cabinet air intake channel; the cold air channel, the cabinet air intake channel , the internal channel of the cabinet and the air outlet channel of the cabinet are connected in sequence to form a ventilation circulation channel. 2. The cabinet semiconductor cooling device according to claim 1, characterized in that, the inside of the cabinet is provided with several horizontal partitions along the vertical direction, and the space between two adjacent partitions constitutes Cooling channels inside the cabinet. 3. The cabinet semiconductor cooling device according to claim 2, wherein an auxiliary fan is provided on the left side of each cooling channel of the cabinet. 4 . The cabinet semiconductor cooling device according to claim 1 , wherein the right side of the hot air channel is an air inlet, and the left side is an air outlet, and the air outlet is arranged outdoors. 5 . The cabinet semiconductor cooling device according to claim 1 , wherein there are multiple semiconductor cooling fins arranged on the middle partition board, and they are installed equidistantly on the middle partition board. 5 . 6. The cabinet semiconductor cooling device according to claim 1, characterized in that, the middle partition is composed of a heat insulation layer arranged in the middle and a cover layer arranged on the upper and lower sides of the heat insulation layer; Both the top surface and the bottom surface of the hot air channel are provided with a thermal insulation layer. 7. The cabinet semiconductor cooling device according to claim 1, characterized in that, the finned heat pipe air-cooled heat exchangers of the cold air channel and the hot air channel are U-shaped finned heat pipe air-cooled heat exchangers, and the U-shaped finned heat pipes are air-cooled heat exchangers. The bottom of the sheet heat pipe air-cooled heat exchanger is arranged on the vapor chamber; the fan is installed in the middle of the U-shaped fin heat pipe air-cooled heat exchanger. 8. The cabinet semiconductor cooling device according to claim 6, characterized in that, the heat insulation layer in the middle partition is provided with an installation groove for installing semiconductor refrigeration chips, and the covering layer on the upper side of the middle partition There is an upper opening slot for installing a U-shaped fin heat pipe air-cooled heat exchanger and an upper soaking plate, and the covering layer on the lower side of the middle partition is provided with a U-shaped fin heat pipe air-cooled heat exchanger and a lower soaking plate. The lower opening groove of the plate; the upper vapor chamber and the lower vapor chamber are attached to the cold end and the hot end of the semiconductive refrigeration sheet respectively, and their edges extend outward beyond the edge of the semiconductive refrigeration sheet. 9. The cabinet semiconductor cooling device according to claim 1, wherein a U-shaped finned heat pipe air-cooled heat exchanger is arranged in the middle of the upper vapor chamber, and the two ends of the lower vapor chamber are respectively There is a U-shaped finned heat pipe air-cooled heat exchanger. 10 . The cabinet semiconductor cooling device according to claim 1 , wherein the extension directions between the cold air passage and the hot air passage are perpendicular to each other. 11 .