CN106449481A - Method for improving nozzle technology of single-chip cleaning machine, and nozzle cleaning device - Google Patents
Method for improving nozzle technology of single-chip cleaning machine, and nozzle cleaning device Download PDFInfo
- Publication number
- CN106449481A CN106449481A CN201610924729.7A CN201610924729A CN106449481A CN 106449481 A CN106449481 A CN 106449481A CN 201610924729 A CN201610924729 A CN 201610924729A CN 106449481 A CN106449481 A CN 106449481A
- Authority
- CN
- China
- Prior art keywords
- nozzle
- cleaning
- single chip
- wet method
- washer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/02—Cleaning by the force of jets or sprays
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Abstract
The invention discloses a method for improving the nozzle technology of a single-chip cleaning machine, and a nozzle cleaning device. The method comprises the steps: installing one nozzle cleaning device with cleaning fluid on a wet-process single-chip cleaning machine, and carrying out the regular cleaning of a nozzle in the cleaning liquid of the nozzle cleaning device. The device comprises a cleaning groove with the cleaning liquid, and the cleaning groove can enable the nozzle to be inserted into the cleaning liquid therein, so as to clean the nozzle. The method and device can remove a pollution source stacked at the nozzle of the wet-process single-chip cleaning machine and a pollution source formed by residual medicinal liquid at the nozzle, avoid the pollution, caused by the regular quantitative spraying of the nozzle when wafer cleaning operation is not carried out or when the medicinal liquid is sprayed in advance, to the surroundings, so as to iron out the technological defect of a spraying start position of the nozzle.
Description
Technical field
The present invention relates to technical field of manufacturing semiconductors, the side of more particularly, to a kind of nozzle technique improving single chip washer
Method, nozzle cleaning.
Background technology
In technical field of manufacturing semiconductors, wet method single chip washer due to its high-quality defect removal effect, just by
Step replaces traditional slot type wet-cleaning machine.What wet method single chip washer typically adopted is all the technique of nozzles spray, and silicon chip enters
Enter process cavity rear nozzle to start to spray chemical liquid, do not have nozzle when silicon chip operation to wait in origin position, this work
As feature result in single chip washer spray liquid when the higher problem of original position defect.Due to the atmosphere of machine inside, spray
The liquid of mouth and its periphery remaining can gradually solidify or even occur crystallizing, and which forms the pollution sources of pollution silicon chip.Work as board
When operation, pollution sources are then transferred to silicon chip up, especially start spray in a flash in chemical liquid, due to nozzle
Learn the unexpected impact of liquid, the vibrations of generation make this problem become apparent from.For improving this situation, refer to Fig. 1, current is logical
Often way is that when origin position waits, chemical liquid is sprayed in timing when nozzle 1, in advance the crystallization on nozzle is disposed,
Then the pollutant 3 of nozzle 1 falls in the range of waiting area, then carries out spraying operation to silicon chip 2.Refer to Fig. 2 a-2c, separately
A kind of way is to spray a certain amount of chemical liquid in advance before nozzle 1 processes silicon chip, it is to avoid crystallization is fallen in silicon chip surface, now
The pollutant 3 of nozzle 1 falls in the range of waiting area, as shown in Figure 2 a；Then operation is carried out to silicon chip 2, such as Fig. 2 b
Shown；Finally nozzle 1 is removed from the position of silicon chip 2, as shown in Figure 2 c.Both approaches to some extent solve nozzle
The problem of upper pollution sources, but not notable for the nozzle periphery effect being all pollution sources, nozzle periphery remaining liquid is formed
Pollution source problem, current gimmick typically just only shut down artificial clean, frequently shutdown purge causes board utilization rate
Low.
Content of the invention
The technical problem to be solved is to provide a kind of method of the nozzle technique improving single chip washer, with
The pollution sources of the pollution sources at the nozzle of wet method single chip washer in solution semiconductor fabrication and nozzle periphery and residual
The pollution sources that liquid is formed, overcome the defective workmanship of the sprinkling original position of nozzle.
In order to solve above-mentioned technical problem, the technical scheme is that：A kind of nozzle technique improving single chip washer
Method, comprise the following steps：By a nozzle cleaning equipped with cleaning fluid is installed additional on wet method single chip washer, will
Nozzle is put in the cleaning fluid of nozzle cleaning and is cleaned, to remove the pollution being deposited at the nozzle of wet method single chip washer
Source and the pollution sources of nozzle residual liquor formation, avoid the spray at regular time and quantity of the nozzle when not carrying out wafer cleaning operation
Spill or spray in advance the pollution to surrounding enviroment during chemical liquid, to overcome the defective workmanship of the sprinkling original position of nozzle.
Further, the method for the nozzle technique improving single chip washer that the present invention provides, the cleaning to nozzle adopts
It is timed the mode of cleaning in the cleaning fluid of nozzle cleaning.
Further, the method for the nozzle technique improving single chip washer that the present invention provides, described nozzle cleaning
Including the rinse bath carrying, in rinse bath, store cleaning fluid, nozzle cleaning is set up communication with wet method single chip washer
Connect, judge that wet method single chip washer whether there is chip；When there is no chip in wet method single chip washer, place the nozzle into spray
According to setting program, nozzle is carried out in mouth cleaning device；Need to be carried out when there being chip in wet method single chip washer
When, first the nozzle after cleaning is dried, then puts in wet method single chip washer chip is entered by dried nozzle again
Row washing and cleaning operation.
Further, the method for the nozzle technique improving single chip washer that the present invention provides, also includes nozzle and is entering
The step imported and exported using the chemical liquid that sealing sleeve pipe seals wet method single chip washer before nozzle cleaning.
Further, the method for the nozzle technique improving single chip washer that the present invention provides, also includes timing and changes spray
The step of the cleaning fluid in mouth cleaning device.
Compared with prior art, the method for the nozzle technique improving single chip washer that the present invention provides, by wet method
The nozzle cleaning installing additional on single chip washer, is carried out to nozzle, to remove the spray being deposited in wet method single chip washer
The pollution sources that pollution sources at mouth, the pollution sources of nozzle periphery and nozzle residual liquor are formed, the sprinkling overcoming nozzle rises
The defective workmanship of beginning position, thus improve the product quality of the cleaning in wet method single chip washer for the nozzle technique.With now
Some nozzle technique is compared, and present invention, avoiding the step that nozzle sprays in advance a certain amount of chemical liquid in waiting area timing
Suddenly, it is to avoid the pollution causing to surrounding enviroment for the pollutant that nozzle drops during spraying；Present invention saves nozzle
The step sprayed at regular time and quantity or in advance, save the usage amount of chemical liquid, it is to avoid wastes.The present invention is carried out clearly to nozzle
After washing, eliminate the pollution sources that the pollution sources at nozzle and residual liquor are formed.
In order to solve above-mentioned technical problem, the present invention also provides a kind of nozzle cleaning, including clear equipped with cleaning fluid
Washing trough, described rinse bath can insert the nozzle in its interior cleaning fluid and nozzle is carried out, and is deposited in wet method monolithic to remove
Pollution sources at the nozzle of cleaning machine and the pollution sources of nozzle residual liquor formation, avoid and are not carrying out wafer cleaning work
The pollution to surrounding enviroment when spraying at regular time and quantity or spraying chemical liquid in advance of nozzle during industry.
Further, the nozzle cleaning that the present invention provides, described nozzle cleaning and wet method single chip washer electricity
Road connects, and when not having chip in wet method single chip washer, nozzle enters in nozzle cleaning according to setting program to nozzle
It is carried out.
Further, the nozzle cleaning that the present invention provides, also includes the drying that the nozzle after cleaning is dried
Room.
The nozzle cleaning that the present invention provides, inserts the nozzle in its interior cleaning fluid and nozzle is carried out, to go
Except the pollution sources being deposited at the nozzle of wet method single chip washer, the pollution sources of nozzle periphery and the formation of nozzle residual liquor
Pollution sources, thus overcoming the defective workmanship of the sprinkling original position of nozzle, improve nozzle technique in wet method single chip washer
Cleaning product quality.Compared with existing nozzle technique, present invention, avoiding by nozzle in waiting area timing in advance
The step of spraying a certain amount of chemical liquid, it is to avoid the pollutant that nozzle drops during spraying causes to surrounding enviroment
Pollution；Present invention saves the step that nozzle sprays at regular time and quantity or in advance, save the usage amount of chemical liquid, it is to avoid
Waste.After the present invention is carried out to nozzle, eliminate the pollution sources that the pollution sources at nozzle and residual liquor are formed.
Brief description
Fig. 1 is a kind of structural representation of nozzle pollution substance treating method of prior art；
Fig. 2 a-2c is the structural representation of another kind of nozzle pollution substance treating method of prior art；
Fig. 3 a-3c is the structural representation of the nozzle cleaning of one embodiment of the invention；
Fig. 4 is the structural representation that is connected with the circuit of wet method single chip washer of nozzle cleaning of the present invention.
Specific embodiment
The present invention is described in detail below in conjunction with the accompanying drawings：
Embodiment one
The present embodiment one provides a kind of method of the nozzle technique improving single chip washer, comprises the following steps：By
One nozzle cleaning equipped with cleaning fluid is installed additional on wet method single chip washer, places the nozzle into the cleaning of nozzle cleaning
Clean in liquid, to remove the dirt being deposited in pollution sources and the formation of nozzle residual liquor at the nozzle of wet method single chip washer
Dye source, avoids when not carrying out wafer cleaning operation the sprinkling at regular time and quantity of nozzle or sprays in advance during chemical liquid to periphery
The pollution of environment, to overcome the defective workmanship of the sprinkling original position of nozzle.In the present embodiment one, chip is generally silicon chip, but
It is not limited to silicon chip.
Compared with existing nozzle technique, present invention, avoiding and nozzle is sprayed one at regular time and quantity or in advance in waiting area
The step of quantitative chemical liquid, it is to avoid the dirt causing to surrounding enviroment for the pollutant that nozzle drops during spraying
Dye；Present invention saves the step that nozzle sprays at regular time and quantity or in advance, save the usage amount of chemical liquid, it is to avoid wave
Take.After the present invention is carried out to nozzle, eliminate the pollution sources that the pollution sources at nozzle and residual liquor are formed.
The method of the nozzle technique improving single chip washer providing as preferably embodiment, the present embodiment one is right
The cleaning of nozzle is using being timed cleaning by the way of in the cleaning fluid of nozzle cleaning.
Refer to Fig. 3 a-3c, Fig. 4, the method for the nozzle technique improving single chip washer that the present embodiment one provides, described
Nozzle cleaning includes the rinse bath 40 carrying, and stores cleaning fluid 41 in rinse bath 40, by nozzle cleaning and wet method
Single chip washer is set up communication and is connected, and judges that wet method single chip washer whether there is chip 20；When not having in wet method single chip washer
When having chip 20, nozzle 10 is put in nozzle cleaning and according to setting program, nozzle is carried out；When wet method monolithic is clear
When having chip 10 to need to be carried out in washing machine, the nozzle 10 after cleaning is first dried by nozzle cleaning, then will again
Dried nozzle puts in wet method single chip washer and is carried out operation to chip 20.
In order to ensure that the cleaning fluid 41 that nozzle cleaning carries do not infiltrate the intersection that nozzle interior causes chemical liquid 11
Pollution, the method for the nozzle technique improving single chip washer that the present embodiment one provides, also include nozzle and enter nozzle cleaning
The step imported and exported using the chemical liquid 11 that sealing sleeve pipe seals wet method single chip washer before device.
For ensureing the clean of cleaning fluid itself, the side of the nozzle technique improving single chip washer that the present embodiment one provides
Method, also includes the step that the cleaning fluid in nozzle cleaning is changed in timing.
Embodiment two
Refer to Fig. 3 a, the present embodiment two provides a kind of nozzle cleaning, including the rinse bath 40 equipped with cleaning fluid 41,
Described rinse bath 40 can insert nozzle 10 in its interior cleaning fluid 41 and nozzle 10 is carried out, and is deposited in wet method list to remove
Pollution sources at the nozzle 10 of piece cleaning machine and the pollution sources of nozzle 10 residual liquor formation, avoid and are not carrying out chip
The pollution to surrounding enviroment when spraying at regular time and quantity or spraying chemical liquid in advance of nozzle 10 during washing and cleaning operation.
Refer to Fig. 4, the nozzle cleaning that the present embodiment two provides, described nozzle cleaning is cleaned with wet method monolithic
Dynamo-electric road connects, and when not having chip in wet method single chip washer, nozzle 10 enters in nozzle cleaning according to setting program
Nozzle 10 is carried out.
Refer to Fig. 3 b, the nozzle cleaning that the present embodiment two provides, also include the nozzle 10 after cleaning is done
Dry hothouse 50.
Refer to Fig. 3 c, after nozzle 10 being cleaned or being dried, nozzle 10 is directed at chip 20, chemical liquid 11 is sprayed
On wafer 20, wet-cleaning operation is carried out to chip 20.
The nozzle cleaning that the present embodiment two provides, nozzle 10 is inserted in its interior cleaning fluid 41 nozzle 10 is carried out
Cleaning, to remove the pollution being deposited in pollution sources and the formation of nozzle 10 residual liquor at the nozzle 10 of wet method single chip washer
Source, avoids when not carrying out wafer cleaning operation the sprinkling at regular time and quantity of nozzle 10 or sprays in advance during chemical liquid 41 to week
The pollution of surrounding environment, overcomes the defective workmanship of the sprinkling original position of nozzle 10, improves nozzle technique clear in wet method monolithic
The product quality of the cleaning of washing machine.
The invention is not restricted to above-mentioned specific embodiment, all various changes done within the spirit and scope of the present invention
Change, all within protection scope of the present invention.
Claims (8)
1. a kind of method of the nozzle technique improving single chip washer is it is characterised in that comprise the following steps：By in wet method list
One nozzle cleaning equipped with cleaning fluid is installed additional on piece cleaning machine, places the nozzle into clear in the cleaning fluid of nozzle cleaning
Wash, to remove the pollution sources being deposited in pollution sources and the formation of nozzle residual liquor at the nozzle of wet method single chip washer, keep away
Open spraying at regular time and quantity or spraying in advance during chemical liquid to surrounding enviroment of when not carrying out wafer cleaning operation nozzle
Pollution, to overcome the defective workmanship of the sprinkling original position of nozzle.
2. as improved the method for the nozzle technique of single chip washer as claimed in claim 1 it is characterised in that clear to nozzle
Wash by the way of being timed cleaning in the cleaning fluid of nozzle cleaning.
3. the method for the nozzle technique improving single chip washer as claimed in claim 1 is it is characterised in that described nozzle cleaning
Device includes the rinse bath carrying, and stores cleaning fluid in rinse bath, and nozzle cleaning is set up with wet method single chip washer
Communication connects, and judges that wet method single chip washer whether there is chip；When there is no chip in wet method single chip washer, nozzle is put
Enter in nozzle cleaning and according to setting program, nozzle is carried out；Need to carry out clearly when there being chip in wet method single chip washer
When washing, first the nozzle after cleaning is dried, then puts in wet method single chip washer dried nozzle to chip again
It is carried out operation.
4. the method for the nozzle technique improving single chip washer as claimed in claim 1 exists it is characterised in that also including nozzle
The step imported and exported using the chemical liquid that sealing sleeve pipe seals wet method single chip washer before entering nozzle cleaning.
5. the method for the nozzle technique improving single chip washer as claimed in claim 1 is it is characterised in that also include timing more
The step changing the cleaning fluid in nozzle cleaning.
6. a kind of nozzle cleaning, including the rinse bath (40) equipped with cleaning fluid (41), described rinse bath (40) can be by nozzle
(10) insert in its interior cleaning fluid (41) and nozzle (10) is carried out, to remove the nozzle being deposited in wet method single chip washer
(10) pollution sources of the pollution sources at place and the formation of nozzle (10) residual liquor, avoid when not carrying out wafer cleaning operation
Pollution to surrounding enviroment when the sprinkling at regular time and quantity of nozzle (10) or in advance sprinkling chemical liquid.
7. nozzle cleaning as claimed in claim 6 is it is characterised in that described nozzle cleaning is cleaned with wet method monolithic
Dynamo-electric road connects, and when not having chip in wet method single chip washer, nozzle enters in nozzle cleaning according to setting program pair
Nozzle is carried out.
8. nozzle cleaning as claimed in claim 6 is it is characterised in that also include the nozzle (10) after cleaning is done
Dry hothouse (50).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610924729.7A CN106449481A (en) | 2016-10-24 | 2016-10-24 | Method for improving nozzle technology of single-chip cleaning machine, and nozzle cleaning device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610924729.7A CN106449481A (en) | 2016-10-24 | 2016-10-24 | Method for improving nozzle technology of single-chip cleaning machine, and nozzle cleaning device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106449481A true CN106449481A (en) | 2017-02-22 |
Family
ID=58175977
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610924729.7A Pending CN106449481A (en) | 2016-10-24 | 2016-10-24 | Method for improving nozzle technology of single-chip cleaning machine, and nozzle cleaning device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106449481A (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20070232073A1 (en) * | 2006-03-29 | 2007-10-04 | Fujitsu Limited | Cleaning apparatus of semiconductor substrate and method of manufacturing semiconductor device |
| CN102891096A (en) * | 2011-07-20 | 2013-01-23 | 大日本网屏制造株式会社 | Substrate processing apparatus and substrate processing method |
| CN104056748A (en) * | 2013-03-21 | 2014-09-24 | 株式会社东芝 | Nozzle Cleaning Unit And Nozzle Cleaning Method |
| US20140352730A1 (en) * | 2013-05-31 | 2014-12-04 | Tokyo Electron Limited | Substrate processing apparatus and nozzle cleaning method |
-
2016
- 2016-10-24 CN CN201610924729.7A patent/CN106449481A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20070232073A1 (en) * | 2006-03-29 | 2007-10-04 | Fujitsu Limited | Cleaning apparatus of semiconductor substrate and method of manufacturing semiconductor device |
| CN102891096A (en) * | 2011-07-20 | 2013-01-23 | 大日本网屏制造株式会社 | Substrate processing apparatus and substrate processing method |
| CN104056748A (en) * | 2013-03-21 | 2014-09-24 | 株式会社东芝 | Nozzle Cleaning Unit And Nozzle Cleaning Method |
| US20140352730A1 (en) * | 2013-05-31 | 2014-12-04 | Tokyo Electron Limited | Substrate processing apparatus and nozzle cleaning method |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN104813438B (en) | The cleaning method and device of semi-conductor silicon chip | |
| KR101748474B1 (en) | Spraying washing device of drum washing machine, washing method thereof and the drum washing machine | |
| CN210010247U (en) | Cleaning device for wafer chuck | |
| JPS63136528A (en) | Applicator for treatment liquid | |
| CN104617018B (en) | A kind of substrate board treatment and substrate processing method using same | |
| CN102376543B (en) | Development method in semiconductor component manufacture process | |
| KR100799691B1 (en) | Cleaning method of coating device | |
| CN110544649B (en) | Batch type wet etching cleaning device and batch type wet etching cleaning method | |
| JP6275090B2 (en) | Process separation type substrate processing apparatus and processing method | |
| CN106449481A (en) | Method for improving nozzle technology of single-chip cleaning machine, and nozzle cleaning device | |
| CN105080892A (en) | Washing device and method for wafer supporting pieces | |
| CN202290646U (en) | Silicon wafer cleaning machine | |
| CN202018950U (en) | Pre-cleaning equipment for silicon chips | |
| CN105521958A (en) | Cleaning method for monocrystalline silicon wafer | |
| KR20070036865A (en) | Nozzle cleaning device | |
| JP2002050608A (en) | Semiconductor substrate cleaning/drying apparatus | |
| CN100385629C (en) | Method and device for cleaning semiconductor crystal wafer | |
| CN204892278U (en) | Photosensitive resist spouts mucilage binding to be put | |
| KR20090070735A (en) | Fluid injection device and its cleaning method | |
| CN108717251A (en) | Cleaning device and method, toning system and method | |
| CN208555334U (en) | An automatic online vacuum plasma cleaning machine | |
| CN111151489A (en) | Method for cleaning silicon wafer in spraying mode through ozone | |
| CN109244185A (en) | A kind of efficient etching method of silicon wafer | |
| JP2000340632A (en) | Chemical processing device for substrate and chemical processing method for the substrate | |
| CN204769666U (en) | Silicon chip washing unit |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20170222 |
|
| RJ01 | Rejection of invention patent application after publication |