[go: up one dir, main page]

CN106442624A - Infrared thermal-wave imaging system based on time-space modulation mode and detection method - Google Patents

Infrared thermal-wave imaging system based on time-space modulation mode and detection method Download PDF

Info

Publication number
CN106442624A
CN106442624A CN201610820975.8A CN201610820975A CN106442624A CN 106442624 A CN106442624 A CN 106442624A CN 201610820975 A CN201610820975 A CN 201610820975A CN 106442624 A CN106442624 A CN 106442624A
Authority
CN
China
Prior art keywords
dmd
semiconductor laser
computer
infrared thermal
digital micro
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201610820975.8A
Other languages
Chinese (zh)
Inventor
刘俊岩
王飞
宋鹏
冀嘉琦
王扬
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Harbin Institute of Technology Shenzhen
Original Assignee
Harbin Institute of Technology Shenzhen
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Harbin Institute of Technology Shenzhen filed Critical Harbin Institute of Technology Shenzhen
Priority to CN201610820975.8A priority Critical patent/CN106442624A/en
Publication of CN106442624A publication Critical patent/CN106442624A/en
Pending legal-status Critical Current

Links

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N25/00Investigating or analyzing materials by the use of thermal means
    • G01N25/72Investigating presence of flaws

Landscapes

  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Investigating Or Analyzing Materials Using Thermal Means (AREA)

Abstract

一种基于时‑空调制方式的红外热波成像系统与检测方法,属于红外成像无损检测领域。计算机通过VGA控制线与DMD控制器信号连接,DMD控制器通过控制线与DMD数字显微晶片板信号连接,半导体激光器电源通过电源线与半导体激光器电连接,半导体激光器通过光纤与准直镜连接,计算机通过以太网线与红外热像仪信号连接。本发明所述的一种基于时‑空调制方式的红外热波成像系统与检测方法,对检测试件的加热均匀,在检测时对检测试件上的微裂纹敏感,且系统造价低廉。

An infrared thermal wave imaging system and detection method based on a time-space modulation method belong to the field of infrared imaging non-destructive testing. The computer is connected to the DMD controller signal through the VGA control line, the DMD controller is connected to the DMD digital microchip board signal through the control line, the power supply of the semiconductor laser is electrically connected to the semiconductor laser through the power line, and the semiconductor laser is connected to the collimator through an optical fiber. The computer is connected to the infrared thermal imaging camera through an Ethernet cable. The infrared thermal wave imaging system and detection method based on time-space modulation of the present invention can evenly heat the test piece, be sensitive to micro-cracks on the test piece during detection, and have low system cost.

Description

一种基于时-空调制方式的红外热波成像系统与检测方法An Infrared Thermal Wave Imaging System and Detection Method Based on Time-Space Modulation

技术领域technical field

本发明涉及一种基于时-空调制方式的红外热波成像系统与检测方法,属于红外成像无损检测领域。The invention relates to an infrared thermal wave imaging system and detection method based on a time-space modulation mode, belonging to the field of non-destructive detection of infrared imaging.

背景技术Background technique

当前,常见的薄层材料如复合材料、涂层材料、金属板材及树脂材料等,本身具有较好的力学性能,但在加工制造过程中,易产生裂纹、气孔及脱粘等缺陷,严重影响材料的使用性能。因此,如何保证材料良好的使用性能,及时、高效地检测出材料缺陷等问题,在整个工艺流程中显得尤为重要。红外热波无损检测技术作为一种主动式红外检测技术,由于其具有非接触、直观、探测面积大及无损伤等优点,广泛地应用于各种薄层材料缺陷检测领域。At present, common thin-layer materials such as composite materials, coating materials, metal sheets and resin materials have good mechanical properties, but in the process of manufacturing, cracks, pores and debonding are prone to defects, which seriously affect Material performance. Therefore, how to ensure the good performance of materials and detect material defects in a timely and efficient manner is particularly important in the entire process. As an active infrared detection technology, infrared thermal wave non-destructive testing technology is widely used in various thin-layer material defect detection fields due to its advantages of non-contact, intuitive, large detection area and no damage.

目前针对红外热波无损检测技术的研究主要集中在主动激励热信号加载方式及热辐射信号提取算法的相关研究领域。根据主动激励热信号加载方式的不同,主要可以分为,红外脉冲法热波无损检测技术、红外锁相法热波无损检测技术及红外热波雷达无损检测技术等。但目前以上方法都存在激励热流对试件加热不均、对微裂纹缺陷检测不敏感及仪器设备昂贵等问题。At present, the research on infrared thermal wave nondestructive testing technology mainly focuses on the related research fields of active excitation thermal signal loading method and thermal radiation signal extraction algorithm. According to the different loading methods of active excitation thermal signals, it can be mainly divided into infrared pulse method thermal wave nondestructive testing technology, infrared phase-locking method thermal wave nondestructive testing technology and infrared thermal wave radar nondestructive testing technology. However, the above methods all have problems such as uneven heating of the test piece by the excitation heat flow, insensitivity to the detection of micro-crack defects, and expensive equipment.

发明内容Contents of the invention

本发明的目的是为了提出一种基于时-空(即时间与空间)调制方式的红外热波成像系统与检测方法,以克服目前常见的红外热成像无损检测技术/系统,即脉冲法、锁相法及热波雷达法存在的加热不均、检测微裂纹时不敏感、系统造价昂贵等劣势。The purpose of the present invention is to propose an infrared thermal wave imaging system and detection method based on time-space (time and space) modulation, so as to overcome the current common infrared thermal imaging non-destructive detection technology/system, namely pulse method, lock The phase method and the thermal wave radar method have disadvantages such as uneven heating, insensitivity when detecting micro-cracks, and high system cost.

本发明提出的是一种基于DMD(Digital Micro mirror Device)数字显微晶片的时间与空间同步调制红外热波成像系统与检测方法。The invention proposes a DMD (Digital Micro mirror Device) digital microchip-based time and space synchronously modulated infrared thermal wave imaging system and detection method.

实现上述目的,本发明采取的技术方案如下:Realize above-mentioned object, the technical scheme that the present invention takes is as follows:

一种基于时-空调制方式的红外热波成像系统,其组成包括计算机、以太网线、红外热像仪、半导体激光器电源、电源线、半导体激光器、光纤、准直镜、DMD数字显微晶片板、控制线、DMD控制器及VGA控制线;An infrared thermal wave imaging system based on time-space modulation, which consists of a computer, an Ethernet cable, an infrared thermal imager, a semiconductor laser power supply, a power cord, a semiconductor laser, an optical fiber, a collimator, and a DMD digital microchip board , control line, DMD controller and VGA control line;

所述的计算机设有两个信号输出端,计算机的其中一个所述的信号输出端通过VGA控制线与DMD控制器的信号输入端连接,计算机的另一个信号输出端通过以太网线与红外热像仪的信号输入端连接,所述的DMD控制器的信号输出端通过控制线与DMD数字显微晶片板的信号输入端连接,所述的半导体激光器电源的电流输出端通过电源线与半导体激光器的电流输入端连接,所述的半导体激光器的激光发射端通过光纤与准直镜的激光接收端连接,所述的准直镜镜口对准DMD数字显微晶片板。The computer is provided with two signal output ends, one of the signal output ends of the computer is connected with the signal input end of the DMD controller through the VGA control line, and the other signal output end of the computer is connected with the infrared thermal imager through the Ethernet line. The signal input end of the instrument is connected, the signal output end of the DMD controller is connected with the signal input end of the DMD digital microchip board through the control line, and the current output end of the semiconductor laser power supply is connected with the semiconductor laser through the power line The current input end is connected, the laser emitting end of the semiconductor laser is connected with the laser receiving end of the collimating mirror through an optical fiber, and the mirror port of the collimating mirror is aligned with the DMD digital microchip board.

进一步的,所述的半导体激光器为808nm半导体激光器。Further, the semiconductor laser is an 808nm semiconductor laser.

进一步的,所述的DMD数字显微晶片板上设有若干个DMD数字显微晶片,每个DMD数字显微晶片上阵列着至少10万个微反射镜。Further, the DMD digital microchip board is provided with several DMD digital microchips, and each DMD digital microchip is arrayed with at least 100,000 micromirrors.

利用本发明的系统实现基于时-空调制方式的红外热波成像的检测方法,所述的检测方法包括如下步骤:Utilize the system of the present invention to realize the detection method based on the infrared thermal wave imaging of time-space modulation mode, described detection method comprises the following steps:

步骤一:将被检测试件进行装夹固定;Step 1: Clamp and fix the test piece to be tested;

步骤二:开启所述的基于时-空调制方式的红外热波成像系统中的计算机、红外热像仪、DMD控制器、半导体激光器和DMD数字显微晶片板;Step 2: Turn on the computer, thermal imaging camera, DMD controller, semiconductor laser and DMD digital microchip board in the infrared thermal wave imaging system based on the time-space modulation mode;

步骤三:设置所述的半导体激光器峰值功率为1W,调整所述的准直镜或DMD数字显微晶片板的位置,以实现激光光路的校准;Step 3: set the peak power of the semiconductor laser to 1W, adjust the position of the collimator or the DMD digital microchip plate to realize the calibration of the laser light path;

步骤四:通过实时观察计算机的显示器,调整所述的红外热像仪焦距,使红外热像仪对焦合理,图像成像清晰;Step 4: By observing the display of the computer in real time, adjust the focal length of the thermal imaging camera, so that the thermal imaging camera focuses reasonably and the image is clear;

步骤五:将每个所述的DMD数字显微晶片中包含的所有微反射镜调至OFF状态,增大半导体激光器功率至20W~50W,计算机控制DMD控制器,使所述的DMD控制器控制的DMD数字显微晶片板采用逐点逐行开启的方式,此时所述的DMD数字显微晶片板反射出的激光光束则对所述的被检测试件表面进行逐点或逐行扫描;或者,使DMD控制器控制的DMD数字显微晶片板上不同区域的微反射镜按不同频率进行ON或OFF状态的变换,此时则表现为DMD数字显微晶片反射出的激光光束在被检测试件表面不同位置以不同频率热流进行注入;Step 5: Turn all the micro-mirrors included in each DMD digital microchip to the OFF state, increase the power of the semiconductor laser to 20W~50W, and the computer controls the DMD controller to make the DMD controller control The DMD digital microchip board is opened point by point and line by line. At this time, the laser beam reflected by the DMD digital microchip plate scans the surface of the tested test piece point by point or line by line; Or, make the micro-mirrors in different regions of the DMD digital microchip controlled by the DMD controller switch ON or OFF states at different frequencies, and at this time it appears that the laser beam reflected by the DMD digital microchip is being detected Different positions on the surface of the specimen are injected with heat flow at different frequencies;

步骤六:在激光光束照射被检测试件表面的同时,计算机通过以太网线对红外热像仪采集的图像序列进行记录,并通过计算机的控制软件进行图像数据处理与信号提取,进而进行被检测试件表面缺陷的识别与判定,至此,完成了对被测试样件4的红外热波成像检测。Step 6: While the laser beam irradiates the surface of the test piece, the computer records the image sequence collected by the infrared thermal imager through the Ethernet cable, and performs image data processing and signal extraction through the computer control software, and then conducts the test. The identification and judgment of the surface defects of the workpiece, so far, the infrared thermal wave imaging detection of the tested sample 4 is completed.

进一步的,步骤一、步骤五和步骤六中,所述的被检测试件的表面材料若为反光度高的材料。Further, in step 1, step 5 and step 6, if the surface material of the tested test piece is a material with high light reflection.

本发明相对于现有技术的有益效果是:The beneficial effect of the present invention relative to prior art is:

(1)本发明通过计算机控制DMD数字显微晶片上不同区域的光照强度,克服了传统检测方法加热不均的影响;(1) The invention overcomes the influence of uneven heating of traditional detection methods by controlling the light intensity of different regions on the DMD digital microchip by computer;

(2)本发明通过控制DMD数字显微晶片上不同区域进行逐行扫描或多频率同时检测的方式,克服了对被检测试件裂纹缺陷检测不敏感及检测时间长等不足;(2) The present invention overcomes the shortcomings of insensitivity to detection of crack defects of the tested specimen and long detection time by controlling different areas on the DMD digital microchip to perform progressive scanning or multi-frequency simultaneous detection;

(3)本发明通过价格低廉的DMD数字显微晶片的使用替代了价格高昂的函数发生器或声光调制器的使用,降低了设备成本。(3) The present invention replaces the use of expensive function generators or acousto-optic modulators through the use of cheap DMD digital microchips, reducing equipment costs.

附图说明Description of drawings

图1为本发明的基于时-空调制方式的红外热波成像系统的结构示意图。FIG. 1 is a schematic structural diagram of an infrared thermal wave imaging system based on a space-time modulation method according to the present invention.

图中:1-计算机、2-以太网线、3-红外热像仪、4-被检测试件、5-半导体激光器电源、6-电源线、7-半导体激光器、8-光纤、9-准直镜、10-DMD数字显微晶片板、11-控制线、12-DMD控制器、13-VGA控制线。In the figure: 1-computer, 2-Ethernet cable, 3-infrared thermal imager, 4-tested sample, 5-semiconductor laser power supply, 6-power line, 7-semiconductor laser, 8-optical fiber, 9-collimation mirror, 10-DMD digital microchip board, 11-control line, 12-DMD controller, 13-VGA control line.

具体实施方式detailed description

具体实施方式一:如图1所示,一种基于时-空调制方式的红外热波成像系统,其组成包括计算机1、以太网线2、红外热像仪3、半导体激光器电源5、电源线6、半导体激光器7、光纤8、准直镜9、DMD数字显微晶片板10、控制线11、DMD控制器12及VGA控制线13;Specific embodiment one: as shown in Figure 1, an infrared thermal wave imaging system based on time-space modulation, its composition includes a computer 1, an Ethernet cable 2, an infrared thermal imager 3, a semiconductor laser power supply 5, and a power cord 6 , semiconductor laser 7, optical fiber 8, collimating mirror 9, DMD digital microchip board 10, control line 11, DMD controller 12 and VGA control line 13;

所述的计算机1设有两个信号输出端,计算机1的其中一个所述的信号输出端通过VGA控制线13与DMD控制器12的信号输入端连接,计算机1的另一个信号输出端通过以太网线2与红外热像仪3的信号输入端连接,所述的DMD控制器12的信号输出端通过控制线11与DMD数字显微晶片板10的信号输入端连接,所述的半导体激光器电源5的电流输出端通过电源线6与半导体激光器7的电流输入端连接,所述的半导体激光器7的激光发射端通过光纤8与准直镜9的激光接收端连接,所述的准直镜9镜口对准DMD数字显微晶片板10。Described computer 1 is provided with two signal output terminals, wherein one of the signal output terminals of computer 1 is connected with the signal input terminal of DMD controller 12 by VGA control line 13, and another signal output terminal of computer 1 is connected through Ethernet Network cable 2 is connected with the signal input end of infrared thermal imager 3, and the signal output end of described DMD controller 12 is connected with the signal input end of DMD digital microchip plate 10 by control line 11, and described semiconductor laser power supply 5 The current output end of the semiconductor laser is connected to the current input end of the semiconductor laser 7 through the power line 6, and the laser emitting end of the semiconductor laser 7 is connected to the laser receiving end of the collimating mirror 9 through the optical fiber 8, and the 9 mirrors of the collimating mirror The mouth is aligned with the DMD digital microchip plate 10 .

其中,红外热像仪3型号为FLIR SC 7000,响应波长为3.6~5.2μm。Among them, the model of thermal imaging camera 3 is FLIR SC 7000, and the response wavelength is 3.6~5.2μm.

具体实施方式二:如图1所示,根据具体实施方式一所述的一种基于时-空调制方式的红外热波成像系统,所述的半导体激光器7为808nm半导体激光器。Embodiment 2: As shown in FIG. 1 , according to an infrared thermal wave imaging system based on time-space modulation described in Embodiment 1, the semiconductor laser 7 is an 808nm semiconductor laser.

具体实施方式三:如图1所示,一种利用具体实施方式一或二所述的系统实现基于时-空调制方式的红外热波成像系统,所述的DMD数字显微晶片板10上设有若干个DMD数字显微晶片,每个DMD数字显微晶片上阵列着至少10万个微反射镜。Specific embodiment three: as shown in Figure 1, a kind of infrared thermal wave imaging system based on time-space modulation mode is realized by utilizing the system described in specific embodiment one or two, described DMD digital microchip plate 10 is provided with There are several DMD digital microchips, and at least 100,000 micromirrors are arrayed on each DMD digital microchip.

具体实施方式四:如图1所示,一种利用具体实施方式三所述的系统实现基于时-空调制方式的红外热波成像的检测方法,所述的检测方法包括如下步骤:Specific embodiment four: as shown in Figure 1, a kind of detection method that utilizes the system described in specific embodiment three to realize the infrared thermal wave imaging based on time-space modulation mode, described detection method comprises the following steps:

步骤一:将被检测试件4进行装夹固定;这里以被检测试件4为长方体形状为例,被检测试件4的长×宽×厚=10cm×10cm ×4 mm,被检测试件4的材料为CFRP材料(检测试件4预制有微裂纹缺陷;Step 1: Clamp and fix the tested specimen 4; here, the tested specimen 4 is a cuboid shape as an example, the length of the tested specimen 4 × width × thickness = 10cm × 10cm × 4 mm, the tested specimen The material of 4 is CFRP material (test specimen 4 is prefabricated with micro-crack defects;

步骤二:开启所述的基于时-空调制方式的红外热波成像系统中的计算机1、红外热像仪3、DMD控制器12、半导体激光器7和DMD数字显微晶片板10;Step 2: Turn on the computer 1, thermal imaging camera 3, DMD controller 12, semiconductor laser 7 and DMD digital microchip plate 10 in the infrared thermal wave imaging system based on the time-space modulation mode;

步骤三:(根据被检测试件4表面材料材质及厚度)设置所述的半导体激光器7峰值功率,将激光功率设置为1W,调整所述的准直镜9或DMD数字显微晶片板10的位置,以实现激光光路的校准;Step 3: Set the peak power of the semiconductor laser 7 (according to the surface material and thickness of the test piece 4), set the laser power to 1W, and adjust the collimator 9 or the DMD digital microchip plate 10 Position, in order to realize the alignment of laser light path;

步骤四:通过实时观察计算机1的显示器,调整所述的红外热像仪3焦距,使红外热像仪3对焦合理,图像成像清晰;Step 4: By observing the display of the computer 1 in real time, adjust the focal length of the thermal imaging camera 3, so that the thermal imaging camera 3 has a reasonable focus and a clear image;

步骤五:将每个所述的DMD数字显微晶片中包含的所有微反射镜调至OFF状态,增大半导体激光器7功率至(7)功率至20W~50W(优选30W),计算机1控制DMD控制器12,使所述的DMD控制器12控制的DMD数字显微晶片板10采用逐点逐行开启的方式,此时所述的DMD数字显微晶片板10反射出的激光光束则对所述的被检测试件4表面进行逐点或逐行扫描;或者,使DMD控制器12控制的DMD数字显微晶片板10上不同区域的微反射镜按不同频率进行ON或OFF状态的变换,此时则表现为DMD数字显微晶片反射出的激光光束在被检测试件4表面不同位置以不同频率热流进行注入;Step 5: Turn all micromirrors contained in each DMD digital microchip to OFF state, increase the power of semiconductor laser 7 to (7) power to 20W~50W (preferably 30W), computer 1 controls DMD Controller 12 makes the DMD digital microchip plate 10 controlled by the DMD controller 12 adopt a point-by-point and row-by-line opening mode, and now the laser beam reflected by the DMD digital microchip plate 10 is on the The surface of the tested sample 4 described above is scanned point by point or line by line; or, the micro-mirrors in different regions on the DMD digital microchip plate 10 controlled by the DMD controller 12 are switched to ON or OFF states at different frequencies, At this time, it is shown that the laser beam reflected by the DMD digital microchip is injected at different positions on the surface of the tested specimen 4 with heat flow at different frequencies;

步骤六:在激光光束照射被检测试件4表面的同时,计算机1通过以太网线2对红外热像仪3采集的图像序列进行记录,并通过计算机1的控制软件进行图像数据处理与信号提取,进而进行被检测试件4表面缺陷的识别与判定,至此,完成了对被测试样件4的红外热波成像检测。Step 6: While the laser beam is irradiating the surface of the test piece 4, the computer 1 records the image sequence collected by the infrared thermal imager 3 through the Ethernet line 2, and performs image data processing and signal extraction through the control software of the computer 1, Further, the identification and judgment of the surface defects of the tested sample 4 are carried out, so far, the infrared thermal wave imaging detection of the tested sample 4 is completed.

本实施方式中,逐点或逐行扫描速率以及多频率即不同频率扫描中频率范围选择根据被检测试件4表面材料材质与其结构参数而定。In this embodiment, the point-by-point or line-by-line scanning rate and the multi-frequency, that is, the selection of frequency ranges in different frequency scanning are determined according to the material of the surface material of the test piece 4 and its structural parameters.

具体实施方式五:具体实施方式四所述的一种基于时-空调制方式的红外热波成像的检测方法,步骤一、步骤五和步骤六中,所述的被检测试件4的表面材料为反光度较低的试件(如黑色金属、碳纤维材料、铸铁等),若为反光度高的材料(如钛合金、铝合金、不锈钢等),则必须对其表面进行喷涂哑光漆处理,以增加其对光的吸收。Specific embodiment five: a kind of detection method based on time-space modulation infrared thermal wave imaging described in specific embodiment four, in step one, step five and step six, the surface material of the tested test piece 4 It is a test piece with low reflectivity (such as ferrous metal, carbon fiber material, cast iron, etc.), if it is a material with high reflectivity (such as titanium alloy, aluminum alloy, stainless steel, etc.), the surface must be sprayed with matte paint , to increase its light absorption.

工作原理:DMD数字显微晶片如今被广泛地应用于投影设备。每个DMD数字显微晶片的边长一般为0.55~0.95英寸(晶片为正方形),在每个DMD数字显微晶片上阵列有几十万到几百万个微反射镜。每个微反射镜都能将激光光线从两个方向反射出去,实际反射方向则视底层记忆晶胞的状态而定;当记忆晶胞处于ON状态时,微反射镜会以其中轴为基准顺时针旋转至+12°,记忆晶胞处于OFF状态,微反射镜会以其中轴为基准轴逆时针旋转至-12°。只要结合DMD数字显微晶片板10以及适当光源和投影光学系统,微反射镜就会把入射光反射进入或是离开红外热像仪3的透光孔,使得ON状态的微反射镜看起来非常明亮,OFF状态的微反射镜看起来就很黑暗。因此可以借助DMD数字显微晶片板10充当多个声光调制器的作用。时-空调制热波无损检测方法基于光热辐射测量(Photothermal radiometry,PTR)原理,采用计算机1控制DMD控制器12,使DMD数字显微晶片中每个微反射镜按指定信号规律变化,激光光源经过DMD数字显微晶片中处于ON状态的微反射镜照射到被检测试件4表面,规律变化的激光照射到被检测试件4后,由于存在光热效应,被检测试件4出现温度涨落与红外辐射,光热辐射信号与被检测试件4光热特性参数和结构相关,信号被红外热像仪3接收,进而通过信号处理算法提取被检测试件4光热特性达到对被检测试件4表面缺陷的判定。How it works: DMD digital microchips are now widely used in projection equipment. The side length of each DMD digital microchip is generally 0.55~0.95 inches (the chip is square), and there are hundreds of thousands to several million microreflectors arrayed on each DMD digital microchip. Each micro-mirror can reflect the laser light from two directions, and the actual reflection direction depends on the state of the underlying memory cell; when the memory cell is in the ON state, the micro-mirror will follow its axis When the hour hand rotates to +12°, the memory cell is in the OFF state, and the micro-mirror will rotate counterclockwise to -12° with its central axis as the reference axis. As long as the DMD digital microchip plate 10 is combined with an appropriate light source and projection optics, the microreflector will reflect incident light into or leave the light transmission hole of the infrared thermal imager 3, making the microreflector in the ON state look very Bright, off-state micromirrors look dark. The DMD digital microchip plate 10 can thus act as a plurality of acousto-optic modulators. The time-air-conditioning thermal wave nondestructive testing method is based on the principle of photothermal radiometry (PTR), using computer 1 to control the DMD controller 12, so that each micro-mirror in the DMD digital microchip changes according to the specified signal law, and the laser The light source irradiates the surface of the test piece 4 through the micro-mirror in the ON state of the DMD digital microchip. After the regularly changing laser light irradiates the test piece 4, due to the photothermal effect, the temperature of the test piece 4 rises. Falling and infrared radiation, the photothermal radiation signal is related to the photothermal characteristic parameters and structure of the tested test piece 4, the signal is received by the infrared thermal imager 3, and then the photothermal characteristics of the tested test piece 4 are extracted through the signal processing algorithm to achieve the detection Determination of surface defects of specimen 4.

Claims (5)

1. a kind of infrared thermal wave imaging system based on Space Time modulation system it is characterised in that:Its composition includes computer(1)、 Ethernet line(2), thermal infrared imager(3), power source of semiconductor laser(5), power line(6), semiconductor laser(7), optical fiber (8), collimating mirror(9), DMD digital micro-analysis chip plate(10), control line(11), DMD controller(12)And VGA control line(13);
Described computer(1)It is provided with two signal output parts, computer(1)One of described signal output part pass through VGA control line(13)With DMD controller(12)Signal input part connect, computer(1)Another signal output part pass through Ethernet line(2)With thermal infrared imager(3)Signal input part connect, described DMD controller(12)Signal output part lead to Cross control line(11)With DMD digital micro-analysis chip plate(10)Signal input part connect, described power source of semiconductor laser(5) Current output terminal pass through power line(6)With semiconductor laser(7)Current input terminal connect, described semiconductor laser (7)Laser emission end pass through optical fiber(8)With collimating mirror(9)Laser pick-off end connect, described collimating mirror(9)Jing Kou is aligned DMD digital micro-analysis chip plate(10).
2. a kind of infrared thermal wave imaging system based on Space Time modulation system according to claim 1 it is characterised in that: Described semiconductor laser(7)For 808nm semiconductor laser.
3. a kind of infrared thermal wave imaging system based on Space Time modulation system according to claim 1 and 2, its feature exists In:Described DMD digital micro-analysis chip plate(10)It is provided with several DMD digital micro-analysis chips, each DMD digital micro-analysis chip Upper array at least 100,000 micro-reflectors.
4. the system described in a kind of utilization claim 3 realizes the detection side of the infrared thermal wave imaging based on Space Time modulation system Method it is characterised in that:Described detection method comprises the steps:
Step one:By tested test block(4)Carry out clamping to fix;
Step 2:Open the computer in the described infrared thermal wave imaging system based on Space Time modulation system(1), infrared heat As instrument(3), DMD controller(12), semiconductor laser(7)With DMD digital micro-analysis chip plate(10);
Step 3:The described semiconductor laser of setting(7)Peak power is 1W, the described collimating mirror of adjustment(9)Or DMD numeral Micro- chip plate(10)Position, to realize the calibration of laser optical path;
Step 4:By Real Time Observation computer(1)Display, the described thermal infrared imager of adjustment(3)Focal length, makes infrared heat As instrument(3)Focusing is reasonable, image imaging clearly;
Step 5:The all micro-reflectors comprising in each described DMD digital micro-analysis chip are adjusted to OFF state, increase half Conductor laser(7)Power is to 20W ~ 50W, computer(1)Control DMD controller(12), make described DMD controller(12)Control The DMD digital micro-analysis chip plate of system(10)By the way of pointwise is opened line by line, now described DMD digital micro-analysis chip plate (10)The laser beam reflecting is then to described tested test block(4)Surface carries out pointwise or progressive scan;Or, make DMD Controller(12)The DMD digital micro-analysis chip plate controlling(10)The micro-reflector of upper zones of different by different frequency carry out ON or The conversion of OFF state, now then shows as laser beam that DMD digital micro-analysis chip reflects in tested test block(4)Surface Diverse location is injected with different frequency hot-fluid;
Step 6:Irradiate tested test block in laser beam(4)While surface, computer(1)By ethernet line(2)To red Outer thermal imaging system(3)The image sequence of collection is recorded, and passes through computer(1)Control software carry out image real time transfer with Signal extraction, and then carry out tested test block(4)The identification of surface defect and judgement, so far, complete to tested exemplar 4 Infrared thermal wave image checking.
5. the detection method of the infrared thermal wave imaging based on Space Time modulation system according to claim 4, its feature exists In:In step one, step 5 and step 6, described tested test block(4)Surfacing be the low material of reflectance.
CN201610820975.8A 2016-09-13 2016-09-13 Infrared thermal-wave imaging system based on time-space modulation mode and detection method Pending CN106442624A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201610820975.8A CN106442624A (en) 2016-09-13 2016-09-13 Infrared thermal-wave imaging system based on time-space modulation mode and detection method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201610820975.8A CN106442624A (en) 2016-09-13 2016-09-13 Infrared thermal-wave imaging system based on time-space modulation mode and detection method

Publications (1)

Publication Number Publication Date
CN106442624A true CN106442624A (en) 2017-02-22

Family

ID=58168788

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201610820975.8A Pending CN106442624A (en) 2016-09-13 2016-09-13 Infrared thermal-wave imaging system based on time-space modulation mode and detection method

Country Status (1)

Country Link
CN (1) CN106442624A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108831844A (en) * 2018-06-26 2018-11-16 长江存储科技有限责任公司 Detect the method and system of wafer defect
CN109211976A (en) * 2018-08-07 2019-01-15 哈尔滨商业大学 Semi-conductor silicon chip surface/sub-surface micro-cracks damage chirp beam splitting laser excitation infrared thermal wave detection device and method
CN109254012A (en) * 2018-10-09 2019-01-22 中北大学 A kind of cracks of metal surface detection device and method based on semiconductor laser
CN115290654A (en) * 2022-07-13 2022-11-04 哈尔滨工业大学 Movable infrared thermal wave imaging detection device and method for pipeline inner surface shallow surface defects

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101655601A (en) * 2008-08-22 2010-02-24 麦克奥迪实业集团有限公司 Light microscope imaging method and system based on DMD structure
CN101943609A (en) * 2009-12-01 2011-01-12 哈尔滨新光光电科技有限公司 Infrared scene generation method for superposing double-set DMD display images on object surface
CN102768472A (en) * 2012-06-30 2012-11-07 南京大学 Method and device for realizing liquid crystal arbitrary orientation control through numerical control micromirror array photoetching
CN103926274A (en) * 2014-04-22 2014-07-16 哈尔滨工业大学 Infrared thermal wave radar imaging nondestructive testing method and system for defects of carbon fiber reinforced plastic (CFRP) plywood
CN104035193A (en) * 2013-03-06 2014-09-10 徐熙平 Tri-propellant total internal reflection prism for infrared target simulators
CN104267570A (en) * 2010-09-07 2015-01-07 大日本印刷株式会社 Projection type image display device
CN104887174A (en) * 2015-06-23 2015-09-09 哈尔滨工业大学 Dental tissue early caries differential photo-thermal imaging detection system and method
CN105738414A (en) * 2016-02-27 2016-07-06 哈尔滨工业大学 Heat wave imaging detection device and method based on non-refrigeration type infrared camera

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101655601A (en) * 2008-08-22 2010-02-24 麦克奥迪实业集团有限公司 Light microscope imaging method and system based on DMD structure
CN101943609A (en) * 2009-12-01 2011-01-12 哈尔滨新光光电科技有限公司 Infrared scene generation method for superposing double-set DMD display images on object surface
CN104267570A (en) * 2010-09-07 2015-01-07 大日本印刷株式会社 Projection type image display device
CN102768472A (en) * 2012-06-30 2012-11-07 南京大学 Method and device for realizing liquid crystal arbitrary orientation control through numerical control micromirror array photoetching
CN104035193A (en) * 2013-03-06 2014-09-10 徐熙平 Tri-propellant total internal reflection prism for infrared target simulators
CN103926274A (en) * 2014-04-22 2014-07-16 哈尔滨工业大学 Infrared thermal wave radar imaging nondestructive testing method and system for defects of carbon fiber reinforced plastic (CFRP) plywood
CN104887174A (en) * 2015-06-23 2015-09-09 哈尔滨工业大学 Dental tissue early caries differential photo-thermal imaging detection system and method
CN105738414A (en) * 2016-02-27 2016-07-06 哈尔滨工业大学 Heat wave imaging detection device and method based on non-refrigeration type infrared camera

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108831844A (en) * 2018-06-26 2018-11-16 长江存储科技有限责任公司 Detect the method and system of wafer defect
CN108831844B (en) * 2018-06-26 2019-12-06 长江存储科技有限责任公司 Method and system for detecting wafer defects
CN109211976A (en) * 2018-08-07 2019-01-15 哈尔滨商业大学 Semi-conductor silicon chip surface/sub-surface micro-cracks damage chirp beam splitting laser excitation infrared thermal wave detection device and method
CN109254012A (en) * 2018-10-09 2019-01-22 中北大学 A kind of cracks of metal surface detection device and method based on semiconductor laser
CN115290654A (en) * 2022-07-13 2022-11-04 哈尔滨工业大学 Movable infrared thermal wave imaging detection device and method for pipeline inner surface shallow surface defects
CN115290654B (en) * 2022-07-13 2023-05-05 哈尔滨工业大学 Movable infrared thermal wave imaging detection device and method

Similar Documents

Publication Publication Date Title
CN106442624A (en) Infrared thermal-wave imaging system based on time-space modulation mode and detection method
CN106404835B (en) An infrared coherent thermal wave imaging system and a detection method based on the system
RU2431823C2 (en) Method and device for nondestructive test of isolation coat
JP2021175987A (en) Device for detecting defects of individualized semiconductor device
CN111735850B (en) Scanning type circuit board solder joint insufficient solder joint automatic detection system and detection method
TWI288225B (en) Determination of irradiation parameters for inspection of a surface
US12099002B2 (en) Single-beam photothermal measurement apparatus and measurement method for absorptive defects
CN102033081A (en) Infrared lock-in thermal wave non-destructive detection method based on image sequence processing
CN109613063A (en) A device and method for detecting thermal barrier coating surface based on area array pulsed laser excitation
TWI485396B (en) Highly adaptive thermal properties measurement system and measuring method thereof
CN109444166B (en) A method for rapid imaging of surface absorption defect distribution of large-aperture optical components
CN202486043U (en) A silicon wafer micro-crack detection system
CN106896138A (en) One kind scanning thermal excitation infrared imaging detecting system and method
CN207850928U (en) A kind of laser induced breakdown spectroscopy detecting system
CN106940332A (en) A kind of Infrared Non-destructive Testing system and method based on phase code modulation system
CN108593710B (en) Thermal imaging detection system and method for surface defects of high-reflectivity material
CN110687204A (en) Method and device for laser ultrasonic testing
CN109799191B (en) Optical non-contact detection device and method for acoustic disturbance on rough surface of solid material
CN116297527A (en) Method for rapidly detecting distribution of thermosensitive defects on surface of optical element
US11397158B2 (en) Reconfigurable laser stimulated lock-in thermography for micro-crack detection
CN110057868B (en) Background-reduction differential laser infrared thermal imaging nondestructive detection system and method
CN203365364U (en) Thermal wave imaging system adopting laser asynchronous scanning
JP2003149188A (en) Remote inspection method and remote inspection device for structure
CN214200583U (en) Laser damage threshold measurement system
CN116399880A (en) Online spectrum defect detection system and detection method thereof

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
RJ01 Rejection of invention patent application after publication
RJ01 Rejection of invention patent application after publication

Application publication date: 20170222