CN106293168B - Touch device and electrode lead setting method based on touch device - Google Patents
Touch device and electrode lead setting method based on touch device Download PDFInfo
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- CN106293168B CN106293168B CN201510246095.XA CN201510246095A CN106293168B CN 106293168 B CN106293168 B CN 106293168B CN 201510246095 A CN201510246095 A CN 201510246095A CN 106293168 B CN106293168 B CN 106293168B
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Abstract
According to the flexible circuit board electrode lead setting method based on the touch device, a peripheral area is arranged around the touch area, a touch electrode layer is arranged in the touch area, and electrode leads led out of the touch electrode layer are arranged in the peripheral area. Because the peripheral area is provided with the first binding area, the second binding area and the third binding area; and the three flexible circuit boards are respectively bound in the first binding area, the second binding area and the third binding area of the touch substrate and are respectively and electrically connected with the corresponding electrode leads. Therefore, three binding areas are arranged in the peripheral area, electrode leads of the touch electrode layer can be optimally arranged, and similarly, when a large space is not reserved on one side of the touch area where the binding areas are not arranged, the distances from the transparent conductive film to the edge of the touch area are the same, so that the whole machine design can be facilitated, and meanwhile, the difference of the routing distances of the electrode leads is reduced. In addition, a touch device is also provided.
Description
Technical Field
The present invention relates to a touch device technology, and in particular, to a space-saving electrode lead setting method based on a touch device and a touch device.
Background
At present, terminal pins of electrode leads of a driving electrode and an induction electrode of a touch screen are led to one side of an induction layer of the touch screen. If the electrode leads of the flexible circuit board to be welded are too many in the touch screen with larger size, if the electrode leads are bound at one place, a larger space is reserved in the routing area of the edge. If the leads are designed to one side, the reserved space of the side is wider, and the electrode leads can be influenced when the LCD display module is attached. That is, if a wider space is reserved or the lines are too many, the lines can remain outside the frame of the LCD display module when the LCD display module is attached, and the functional failure can be caused when the whole machine is assembled or pressed to the wiring. And the local induction quantity of the induction layer can be influenced by overlong electrode lead wires during design.
Disclosure of Invention
Based on this, it is necessary to provide a space-saving electrode lead arrangement method based on a touch device.
An electrode lead setting method based on a touch device comprises the following steps:
a peripheral area is arranged around a touch area of the touch substrate, and a touch electrode layer is arranged in the touch area;
electrode leads led out of the touch electrode layer are arranged in the peripheral area;
setting a first binding area, a second binding area and a third binding area in the peripheral area;
and binding the three flexible circuit boards to the first binding region, the second binding region and the third binding region of the touch substrate respectively and electrically connecting the three flexible circuit boards with the corresponding electrode leads respectively.
In one embodiment, the method further comprises the steps of: and setting the widths of the first binding area, the second binding area and the third binding area to be the same.
In one embodiment, the method further comprises the steps of: and arranging the first binding area along the short side edge of the touch area, and arranging the second binding area and the third binding area along the two long side edges of the touch area respectively.
In one embodiment, the first touch electrodes of the touch electrode layer are extended along a first direction, and the second touch electrodes of the touch electrode layer are extended along a second direction perpendicular to the first direction, so that the first touch electrodes and the second touch electrodes are insulated from each other.
In one embodiment, the first touch electrode is connected and bound to a flexible circuit board of a first binding area;
and respectively connecting and binding the second touch electrode to the flexible circuit board of the second binding region and the third binding region.
In addition, a touch device capable of saving space is also provided.
The utility model provides a touch device, includes a touch substrate and three flexible circuit boards, the touch substrate includes the touch district at middle part and surrounds the peripheral district in touch district, the touch substrate in be equipped with the touch electrode layer in the touch district, be equipped with in the peripheral district of touch substrate certainly the electrode lead wire that the touch electrode layer was drawn forth, the peripheral district is equipped with first binding area, second binding area and third binding area, three flexible circuit boards bind respectively in the first binding area, second binding area and the third binding area of touch substrate and respectively with corresponding electrode lead wire electric connection.
In one embodiment, the first binding area is disposed along the short side edge of the touch area, and the second binding area and the third binding area are disposed along the two long side edges of the touch area, respectively.
In one embodiment, the touch electrode layer includes a plurality of first touch electrodes extending along a first direction and a plurality of second touch electrodes extending along a second direction perpendicular to the first direction, and the first touch electrodes and the second touch electrodes are insulated from each other.
In one embodiment, the second touch electrode is respectively connected with the flexible circuit board bound to the second binding area and the third binding area;
the first touch electrode is connected with the flexible circuit board bound to the first binding area.
In one embodiment, the widths of the first binding area, the second binding area, and the third binding area are the same.
According to the electrode lead setting method based on the touch device and the touch device, the peripheral area is arranged around the touch area, the touch electrode layer is arranged in the touch area, and the electrode lead led out of the touch electrode layer is arranged in the peripheral area. Because the peripheral area is provided with the first binding area, the second binding area and the third binding area; and the three flexible circuit boards are respectively bound in the first binding area, the second binding area and the third binding area of the touch substrate and are respectively and electrically connected with the corresponding electrode leads. Therefore, three binding areas are arranged in the peripheral area, electrode leads of the touch electrode layer can be optimally arranged, and similarly, when a large space is not reserved on one side of the touch area where the binding areas are not arranged, the distances from the transparent conductive film to the edge of the touch area are the same, so that the whole machine design can be facilitated, and meanwhile, the difference of the routing distances of the electrode leads is reduced.
Drawings
FIG. 1 is a flow chart of a method for setting electrode leads based on a touch device;
fig. 2 is a schematic diagram of a touch device.
Detailed Description
In order that the invention may be readily understood, a more complete description of the invention will be rendered by reference to the appended drawings. Preferred embodiments of the present invention are shown in the drawings. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.
It will be understood that when an element is referred to as being "fixed to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and the like are used herein for illustrative purposes only.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used herein in the description of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. The term "and/or" as used herein includes any and all combinations of one or more of the associated listed items.
Fig. 1 is a flowchart of an electrode lead setting method based on a touch device.
An electrode lead setting method based on a touch device comprises the following steps:
in step S110, a peripheral area is disposed around the touch area of the touch substrate, and a touch electrode layer is disposed in the touch area.
The touch electrode layer of the touch device comprises a driving electrode and a sensing electrode. The driving electrode and the sensing electrode are connected with the flexible circuit board through electrode leads and output driving signals and sensing signals. In general, the driving electrode and the sensing electrode are very dense, and thus, the electrode leads of the driving electrode and the sensing electrode are correspondingly very large. When the electrode leads of the driving electrode and the sensing electrode are led out and connected to the flexible circuit board, a dense edge wiring area is formed at the edge of the touch area. This requires optimization of the edge space of the touch area. I.e. a peripheral zone is provided.
And step 120, arranging electrode leads led out of the touch electrode layer in the peripheral area.
In order to avoid the electrode leads of the touch electrode layer from being densely stacked in the edge area of the touch area, the space utilization rate of the touch substrate is reduced. Therefore, the electrode leads are led into the peripheral area of the touch area, and the electrode leads are correspondingly paved in the peripheral area according to the number of the electrode leads.
Step S130, a first binding area, a second binding area and a third binding area are arranged in the peripheral area.
In order to reasonably utilize the space of the peripheral area, in the embodiment, three binding areas are arranged in the peripheral area and used for correspondingly binding the flexible circuit board, and then the flexible circuit board is connected with the electrode leads, so that the purpose of setting the electrode leads is achieved.
In this embodiment, the widths of the first binding area, the second binding area, and the third binding area are set to be the same.
In this embodiment, the first binding area is disposed along the edge of the short side of the touch area, and the second binding area and the third binding area are disposed along the edges of the two long sides of the touch area, respectively.
In this embodiment, the plurality of first touch electrodes of the touch electrode layer extend along a first direction, and the plurality of second touch electrodes of the touch electrode layer extend along a second direction perpendicular to the first direction, so that the first touch electrodes and the second touch electrodes are insulated from each other.
Specifically, the first touch electrode is connected and bound to the flexible circuit board of the first binding area. And respectively connecting and binding the second touch electrode to the flexible circuit board of the second binding region and the third binding region.
Step S140, binding the three flexible circuit boards to the first binding region, the second binding region and the third binding region of the touch substrate respectively, and electrically connecting the three flexible circuit boards with the corresponding electrode leads respectively.
Because the electrode leads of the touch electrode layer are huge in number, the electrode leads are required to be connected to flexible circuit boards with different setting positions respectively, the situation that the setting positions of the flexible circuit boards are similar, the electrode leads are densely paved and occupy more space of the touch substrate, and the whole machine assembly of the touch device is affected is avoided.
In this embodiment, the flexible circuits are respectively bound in the three binding areas, so that the electrode leads can be respectively led to different areas, and the space waste of the touch substrate caused by laying a large number of electrode leads on the same edge is effectively avoided.
In order to maximally use the edge space of the touch device, the spaces of three sides of the touch device are kept to be the same width, namely the widths of the first binding area, the second binding area and the third binding area are the same.
According to the flexible circuit board electrode lead setting method based on the touch device, the peripheral area is arranged around the touch area, the touch electrode layer is arranged in the touch area, and the electrode lead led out by the touch electrode layer is arranged in the peripheral area. Because the peripheral area is provided with the first binding area, the second binding area and the third binding area; and the three flexible circuit boards are respectively bound in the first binding area, the second binding area and the third binding area of the touch substrate and are respectively and electrically connected with the corresponding electrode leads. Therefore, three binding areas are arranged in the peripheral area, electrode leads of the touch electrode layer can be optimally arranged, and similarly, when a large space is not reserved on one side of the touch area where the binding areas are not arranged, the distances from the transparent conductive film to the edge of the touch area are the same, so that the whole machine design can be facilitated, and meanwhile, the difference of the routing distances of the electrode leads is reduced.
Fig. 2 is a schematic diagram of a touch device.
The touch device comprises a touch substrate 101 and three flexible circuit boards (not marked), wherein the touch substrate 101 comprises a touch region 102 in the middle and a peripheral region (not marked) surrounding the touch region, a touch electrode layer (not marked) is arranged in the touch region 102 of the touch substrate 101, electrode leads led out from the touch electrode layer (not marked) are arranged in the peripheral region of the touch substrate 101, a first binding region 104, a second binding region 105 and a third binding region 106 are arranged in the peripheral region, and the three flexible circuit boards (not marked) are respectively bound in the first binding region 104, the second binding region 105 and the third binding region 106 of the touch substrate 101 and are respectively electrically connected with the corresponding electrode leads.
The first binding area 104 is disposed along the edge of the short side of the touch area 102, and the second binding area 105 and the third binding area 106 are disposed along the edges of the two long sides of the touch area 102.
The touch electrode layer (not marked) comprises a plurality of first touch electrodes (not marked) extending along a first direction and a plurality of second touch electrodes (not marked) extending along a second direction perpendicular to the first direction, and the first touch electrodes (not marked) and the second touch electrodes (not marked) are mutually insulated.
The second touch electrode (not labeled) is respectively connected to the flexible circuit boards bound to the second binding region 105 and the third binding region 106.
The first touch electrode (not labeled) is connected to the flexible circuit board bound to the first binding region 104.
The widths of the first binding area 104, the second binding area 105, and the third binding area 106 are the same.
In this embodiment, the first direction is a direction along the long side of the touch area 102, and the electrode leads led out from the first touch electrode are collected in the first binding area 104. Electrode leads led out from the second touch electrode are respectively gathered in the second binding region 105 and the third binding region.
In the above touch device, a peripheral region is disposed around the touch region, and a touch electrode layer (not labeled) is disposed in the touch region 102, where electrode leads led out from the touch electrode layer (not labeled) are disposed in the peripheral region. Since the peripheral area is provided with the first binding area 104, the second binding area 105 and the third binding area 106; and the three flexible circuit boards are respectively bound to the first binding region 104, the second binding region 105 and the third binding region 106 of the touch substrate 101 and are respectively electrically connected with the corresponding electrode leads. Therefore, the three binding areas are arranged in the peripheral area, so that electrode leads of the touch electrode layer (not labeled) can be optimally arranged, and similarly, when a large space is not reserved on one side of the touch area 102 where no binding area is arranged, the distances from the transparent conductive film to the edge of the touch area 102 are the same, so that the whole machine design can be facilitated, and meanwhile, the wiring distance difference of the electrode leads is reduced.
The technical features of the above-described embodiments may be arbitrarily combined, and all possible combinations of the technical features in the above-described embodiments are not described for brevity of description, however, as long as there is no contradiction between the combinations of the technical features, they should be considered as the scope of the description.
The above examples illustrate only a few embodiments of the invention, which are described in detail and are not to be construed as limiting the scope of the invention. It should be noted that it will be apparent to those skilled in the art that several variations and modifications can be made without departing from the spirit of the invention, which are all within the scope of the invention. Accordingly, the scope of protection of the present invention is to be determined by the appended claims.
Claims (2)
1. An electrode lead setting method based on a touch device comprises the following steps:
a peripheral area is arranged around a touch area of the touch substrate, and a touch electrode layer is arranged in the touch area;
extending a plurality of first touch electrodes of the touch electrode layer along a first direction, and extending a plurality of second touch electrodes of the touch electrode layer along a second direction perpendicular to the first direction, so that the first touch electrodes and the second touch electrodes are mutually insulated;
electrode leads led out of the touch electrode layer are arranged in the peripheral area;
setting a first binding area, a second binding area and a third binding area in the peripheral area;
setting the widths of the first binding area, the second binding area and the third binding area to be the same;
setting the first binding area along the short side edge of the touch area, and setting the second binding area and the third binding area along the two long side edges of the touch area respectively;
binding three flexible circuit boards to a first binding region, a second binding region and a third binding region of the touch substrate respectively, wherein the flexible circuit board of the first binding region is electrically connected with an electrode lead of the first touch electrode, and the flexible circuit board of the second binding region and the flexible circuit board of the third binding region are electrically connected with an electrode lead of the second touch electrode.
2. The utility model provides a touch device, includes a touch substrate and three flexible circuit boards, its characterized in that, the touch substrate includes the touch district in middle part and surrounds the peripheral district of touch district, the touch substrate in be equipped with the touch electrode layer in the touch district, the touch electrode layer includes a plurality of first touch electrodes that extend along first direction and a plurality of second touch electrodes that extend along the second direction perpendicular with first direction, first touch electrode with second touch electrode is mutual insulating, be equipped with in the peripheral district of touch substrate from the electrode lead wire that the touch electrode layer draws forth, the peripheral district is equipped with first binding district, second binding district and third binding district, first binding district the width of second binding district and the third binding district is the same, first binding district is along touch district minor face edge sets up, second binding district and third binding district are followed touch district both sides length limit are followed the electrode lead wire that the touch electrode of first binding district and second binding district and the flexible circuit board set up the flexible circuit lead wire.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201510246095.XA CN106293168B (en) | 2015-05-14 | 2015-05-14 | Touch device and electrode lead setting method based on touch device |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201510246095.XA CN106293168B (en) | 2015-05-14 | 2015-05-14 | Touch device and electrode lead setting method based on touch device |
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| CN106293168A CN106293168A (en) | 2017-01-04 |
| CN106293168B true CN106293168B (en) | 2024-03-15 |
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Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106940601B (en) * | 2017-03-13 | 2023-01-10 | 安徽精卓光显技术有限责任公司 | Touch element and manufacturing method thereof, and touch device and manufacturing method thereof |
| CN107291297A (en) * | 2017-07-05 | 2017-10-24 | 张家港康得新光电材料有限公司 | Touch sensing, its preparation method and touch control display apparatus |
| CN109426382A (en) * | 2017-08-29 | 2019-03-05 | 苏州欧菲光科技有限公司 | Touch screen |
| CN108170313B (en) * | 2017-12-29 | 2020-12-08 | 业成科技（成都）有限公司 | Touch film and manufacturing method thereof, touch panel and circuit board thereof, and wearable device |
| CN108132732A (en) * | 2018-01-31 | 2018-06-08 | 武汉华星光电半导体显示技术有限公司 | A kind of touch screen and mobile terminal |
| CN109002210B (en) * | 2018-07-16 | 2022-01-18 | 信利光电股份有限公司 | Touch screen and electronic equipment |
| CN109189257A (en) * | 2018-07-16 | 2019-01-11 | 信利光电股份有限公司 | A kind of touch screen and electronic equipment |
| CN111610879B (en) * | 2020-05-20 | 2023-03-31 | 业成科技（成都）有限公司 | Touch panel, preparation method of touch panel, touch assembly and electronic equipment |
| CN111796711A (en) * | 2020-06-02 | 2020-10-20 | 南昌欧菲显示科技有限公司 | Touch structure, touch screen and electronic equipment |
| CN114745850A (en) * | 2022-04-13 | 2022-07-12 | 业成科技（成都）有限公司 | Fingerprint identification device and manufacturing method of fingerprint identification device |
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| CN204631833U (en) * | 2015-05-14 | 2015-09-09 | 深圳欧菲光科技股份有限公司 | touch device |
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Patent Citations (4)
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| CN202795287U (en) * | 2012-04-17 | 2013-03-13 | 厦门市宝龙达光电技术有限公司 | Touch screen with narrow frame |
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Address after: 518106 oufeiguang Science Park, HUAFA section of Songbai highway, Gongming street, Guangming New District, Shenzhen City, Guangdong Province Applicant after: Ophiguang Group Co.,Ltd. Applicant after: Nanchang OFilm Tech. Co.,Ltd. Applicant after: SUZHOU OFILM TECH Co.,Ltd. Address before: 518106 oufeiguang Science Park, HUAFA section of Songbai highway, Gongming street, Guangming New District, Shenzhen City, Guangdong Province Applicant before: OFilm Tech Co.,Ltd. Applicant before: Nanchang OFilm Tech. Co.,Ltd. Applicant before: SUZHOU OFILM TECH Co.,Ltd. Address after: 518106 oufeiguang Science Park, HUAFA section of Songbai highway, Gongming street, Guangming New District, Shenzhen City, Guangdong Province Applicant after: OFilm Tech Co.,Ltd. Applicant after: Nanchang OFilm Tech. Co.,Ltd. Applicant after: SUZHOU OFILM TECH Co.,Ltd. Address before: 518106 Oufeiguang Science Park, Huafa Section of Songbai Highway, Gongming Town, Guangming New District, Shenzhen City, Guangdong Province Applicant before: Shenzhen OFilm Tech Co.,Ltd. Applicant before: Nanchang OFilm Tech. Co.,Ltd. Applicant before: SUZHOU OFILM TECH Co.,Ltd. |
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Effective date of registration: 20210223 Address after: 231323 Building 1, precision electronics industrial park, Hangbu Town, Shucheng County, Lu'an City, Anhui Province Applicant after: Anhui jingzhuo optical display technology Co.,Ltd. Address before: 518106 oufeiguang Science Park, HUAFA section of Songbai highway, Gongming street, Guangming New District, Shenzhen City, Guangdong Province Applicant before: Ophiguang Group Co.,Ltd. Applicant before: Nanchang OFilm Tech. Co.,Ltd. Applicant before: SUZHOU OFILM TECH Co.,Ltd. |
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