CN105939117B - Power inverter - Google Patents
Power inverter Download PDFInfo
- Publication number
- CN105939117B CN105939117B CN201610122474.2A CN201610122474A CN105939117B CN 105939117 B CN105939117 B CN 105939117B CN 201610122474 A CN201610122474 A CN 201610122474A CN 105939117 B CN105939117 B CN 105939117B
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- Prior art keywords
- bus bar
- capacitor
- connection portion
- main
- connection part
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- 239000003990 capacitor Substances 0.000 claims abstract description 173
- 239000004065 semiconductor Substances 0.000 claims abstract description 43
- 239000011347 resin Substances 0.000 claims abstract description 29
- 229920005989 resin Polymers 0.000 claims abstract description 29
- 238000000465 moulding Methods 0.000 claims abstract description 21
- 238000006243 chemical reaction Methods 0.000 claims description 53
- 238000001514 detection method Methods 0.000 claims description 11
- 238000009499 grossing Methods 0.000 abstract description 16
- 238000010586 diagram Methods 0.000 description 8
- 238000003860 storage Methods 0.000 description 8
- 238000005192 partition Methods 0.000 description 7
- 239000002826 coolant Substances 0.000 description 6
- 230000006399 behavior Effects 0.000 description 5
- 238000001816 cooling Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000000630 rising effect Effects 0.000 description 2
- 230000015556 catabolic process Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000000644 propagated effect Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
- H02M7/00—Conversion of AC power input into DC power output; Conversion of DC power input into AC power output
- H02M7/003—Constructional details, e.g. physical layout, assembly, wiring or busbar connections
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B60—VEHICLES IN GENERAL
- B60L—PROPULSION OF ELECTRICALLY-PROPELLED VEHICLES; SUPPLYING ELECTRIC POWER FOR AUXILIARY EQUIPMENT OF ELECTRICALLY-PROPELLED VEHICLES; ELECTRODYNAMIC BRAKE SYSTEMS FOR VEHICLES IN GENERAL; MAGNETIC SUSPENSION OR LEVITATION FOR VEHICLES; MONITORING OPERATING VARIABLES OF ELECTRICALLY-PROPELLED VEHICLES; ELECTRIC SAFETY DEVICES FOR ELECTRICALLY-PROPELLED VEHICLES
- B60L2210/00—Converter types
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B60—VEHICLES IN GENERAL
- B60L—PROPULSION OF ELECTRICALLY-PROPELLED VEHICLES; SUPPLYING ELECTRIC POWER FOR AUXILIARY EQUIPMENT OF ELECTRICALLY-PROPELLED VEHICLES; ELECTRODYNAMIC BRAKE SYSTEMS FOR VEHICLES IN GENERAL; MAGNETIC SUSPENSION OR LEVITATION FOR VEHICLES; MONITORING OPERATING VARIABLES OF ELECTRICALLY-PROPELLED VEHICLES; ELECTRIC SAFETY DEVICES FOR ELECTRICALLY-PROPELLED VEHICLES
- B60L2240/00—Control parameters of input or output; Target parameters
- B60L2240/40—Drive Train control parameters
- B60L2240/52—Drive Train control parameters related to converters
- B60L2240/525—Temperature of converter or components thereof
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Inverter Devices (AREA)
Abstract
A kind of power inverter has multiple semiconductor modules, main P busbar, main N busbar, capacitor module, input P busbar and input N busbar.Input N busbar is connected to DC power supply.Main N busbar is connected to the negative terminal of semiconductor module to provide DC electric power.Capacitor N busbar, filter condenser and smoothing capacity device in capacitor module are molded by capacitor moulding resin.Capacitor N busbar is connected to the negative electrode terminal of filter condenser.Input N busbar, which has, to be connected to the first N interconnecting piece of capacitor N busbar and is connected to the 2nd N interconnecting piece of main N busbar.The main N busbar is arranged on the outside of the capacitor moulding resin.
Description
Technical Field
The present invention relates to a power conversion device or a power converter capable of converting dc power into ac power.
Background
A general power conversion apparatus has a semiconductor module, a capacitor, an input bus bar, a capacitor bus bar, and the like. The semiconductor module converts direct-current power (DC power) into alternating-current power (AC power). The capacitor smoothes the electric power. The input bus bar is connected to a direct current power source (i.e., DC power source). The capacitor is connected to the input bus bar via the capacitor bus bar. As a conventional technique, patent document 1, japanese patent laid-open No.2013-55840 uses a capacitor module having a structure in which a capacitor and a capacitor bus bar are assembled together and molded with resin (mold). The capacitor bus bar is connected to the main bus bar. The main bus bar is connected to the semiconductor module to supply power to the semiconductor device.
The power provided via the main bus bar is further provided to the input bus bar via a capacitor bus bar, which is molded in the capacitor module.
However, the structure of the power conversion apparatus disclosed in the previously described patent document 1 has drawbacks. That is, since power containing a direct current component (DC component) is supplied to the capacitor bus bar, the DC component of the power generates heat energy when the DC component of the power passes through the capacitor bus bar. In addition, because the capacitor bus bars are assembled and molded in the capacitor module, the heat generated in the capacitor bus bars raises the temperature of the capacitors, sometimes damaging the capacitor module. This results in degradation of the capacitor module and reduces the lifetime of the capacitor.
Disclosure of Invention
It is therefore desirable to provide a power conversion device with high reliability, in which a temperature rise of a capacitor can be suppressed.
Exemplary embodiments provide a power conversion apparatus capable of performing power conversion of direct-current power into alternating-current power.
The power conversion device has one or more semiconductor modules, a control circuit board, a main P bus bar, a main N bus bar, a capacitor module, an input P bus bar, and an input N bus bar. Each of the semiconductor modules has a built-in semiconductor element, a positive electrode terminal, a negative electrode terminal, and a control terminal. The control circuit board is connected to the control terminal of each of the semiconductor modules. The control circuit board drives the built-in semiconductor element of the semiconductor module. The main P bus bar is connected to a positive terminal of the semiconductor module, through which direct-current power is supplied. The main N bus bar is connected to a negative terminal of the semiconductor module, through which direct-current power is supplied.
The capacitor module has a first capacitor, a capacitor P bus bar, and a capacitor N bus bar. The first capacitor, the capacitor P bus bar and the capacitor N bus bar are molded by a capacitor molding resin. A capacitor P bus bar is connected to the positive terminal of the first capacitor, and a capacitor N bus bar is connected to the negative terminal of the first capacitor.
The input P bus bar is connected to a positive terminal of a direct current power source (i.e., a DC power source).
The input N bus bar is connected to the negative terminal of the DC power source. The input N bus bar has a first N connection and a second N connection. The first N connection is connected to a capacitor N bus bar. The second N connection is connected to the main N bus bar. The main N bus bar is disposed outside the capacitor mold resin with which the first capacitor, the capacitor P bus bar, and the capacitor N bus bar are molded.
The power conversion apparatus 1 has the previously described improved structure in which the main N bus bar is connected to the input N bus bar without passing through the capacitor N bus bar, which is molded in the capacitor molding resin. That is, the main N bus bar is not molded in the capacitor molding resin. In other words, the main N bus bar is disposed outside the capacitor mold resin. This structure can prevent DC current from flowing into the capacitor module. Therefore, this structure prevents the thermal energy generated by the DC power from being propagated to the capacitor molded in the capacitor molding resin in the capacitor module. This can prevent the temperature of the capacitor in the capacitor module from rising, and can prevent deterioration and damage to the capacitor. Therefore, the present invention can provide a power conversion device having high reliability.
Drawings
Preferred, non-limiting embodiments of the present invention will be described, by way of example, with reference to the accompanying drawings, in which:
fig. 1 is a diagram showing a schematic cross section of a power conversion apparatus according to an exemplary embodiment of the present invention;
fig. 2 is a plan view illustrating an input bus bar module in the power conversion apparatus according to the exemplary embodiment illustrated in fig. 1;
fig. 3 is a plan view illustrating a bus bar electrically connected to an input bus bar module in the power conversion apparatus according to the exemplary embodiment illustrated in fig. 1;
FIG. 4 is a diagram illustrating a cross section of an input bus bar module along line IV-IV shown in FIG. 3;
fig. 5 is a front view of a semiconductor module in the power conversion apparatus according to the exemplary embodiment shown in fig. 1; and
fig. 6 is a schematic diagram showing a circuit diagram in the power conversion apparatus according to the exemplary embodiment shown in fig. 1.
Detailed Description
Hereinafter, various embodiments of the present invention will be described with reference to the accompanying drawings. In the following description of various embodiments, like reference characters or numerals designate like or equivalent parts throughout the several views.
The power conversion apparatus according to the invention is applicable to electric vehicles and hybrid vehicles.
Exemplary embodiments
A description will be given of the structure and behavior of the power conversion apparatus 1 according to an exemplary embodiment with reference to fig. 1 to 6.
Fig. 1 is a diagram showing a schematic cross section of a power conversion apparatus 1 according to an exemplary embodiment. The power conversion device 1 converts direct-current power (DC power) into alternating-current power (AC power). As shown in fig. 1, the power conversion device 1 has a plurality of semiconductor modules 10, a control circuit board 20, a main P bus bar 30P, a main N bus bar 30N, a capacitor module 40, an input P bus bar 5P, and an input N bus bar 5N.
Each of the semiconductor modules 10 has a built-in semiconductor element 11. For example, each of the semiconductor modules 10 shown in fig. 6 has a pair of semiconductor elements 11. The control circuit is provided on the control circuit board 20. The control circuit is connected to the control terminal 13 of each of the semiconductor modules 10 and drives and controls the behavior of each built-in semiconductor element 11.
As shown in fig. 1, the main P bus bar 30P is connected to the positive terminal of each of the semiconductor modules 10. The main N bus bar 30N is connected to the negative terminal of each of the semiconductor modules 10. The capacitor module 40, the capacitor P bus bar 42P, and the capacitor N bus bar 42N are molded together by the capacitor molding resin 46. The capacitor P bus bar 42P is connected to the negative terminal 41P of the filter capacitor 41. The capacitor N bus bar 42N is connected to the negative terminal 41N of the smoothing capacitor 41.
The input P bus bar 5P is connected to a positive terminal 2P (see fig. 6) of the direct current power supply (DC power supply) 2. The input N bus bar 5N is connected to the negative terminal 2N of the DC power supply 2 (see fig. 6).
The input N bus bar 5N has a first N connection portion 51N and a second N connection portion 52N. The first N connection portion 51N is connected to the capacitor N bus bar 42N. The second N connection portion 52N is connected to the main N bus bar 30N. The main N bus bar 30N is provided to protrude from the capacitor mold resin 46.
A description will now be given in detail of the structure and behavior of the power conversion apparatus 1 according to an exemplary embodiment.
Fig. 6 is a schematic diagram showing a circuit diagram in the power conversion apparatus 1 according to the exemplary embodiment shown in fig. 1. The power conversion apparatus 1 has a circuit shown in fig. 6. The power conversion apparatus 1 converts DC power supplied from a DC power supply 2 into three-phase AC power. An alternating current load (AC load) is driven by the converted three-phase AC power.
As shown in fig. 1, the power conversion apparatus 1 has an upper side case 81, a lower side case 82, and a cover 83. The upper casing 81 has a top plate 81a, and the top plate 81a has a rectangular shape and four side wall plates 81 b. The side wall panels are disposed perpendicularly to the top panel 81 a. The upper case 81 has an opening portion facing the top plate 81 a. The first storage portion 8a is surrounded by a top plate 81a and a side wall plate 81 b.
In the structure of the power conversion apparatus 1 according to the exemplary embodiment shown in fig. 1, the top plate 81a is provided in the direction X and the direction Y. The direction X is perpendicular to the direction Y, and a side wall plate 81b is provided in the direction Z.
As shown in fig. 1, the bottom case 82 is provided at an opening portion of the upper case 81. The bottom side case 82 has a bulkhead 82a and four side wall plates 82 b. The partition plate 82a is provided parallel to the top plate 81 a. The side wall plate 82b is provided perpendicularly to the partition plate 82 a. The second storage portion 8b is surrounded by a partition 82a and a side wall plate 82 b.
The partition 82a has a vertical wall 82c, a first through hole 82d, and a second through hole 82 e. A vertical wall 82c is provided in a direction toward the upper case 81. The partition 82a has a first through hole 82d and a second through hole 82e formed therein to penetrate in the direction Z.
As shown in fig. 1, each of the side wall plates 82b projects toward the opposite direction to the upper side case 81 side when compared with the partition plate 82 a. The protruding end portion of each of the side wall plates 82b is covered with a cover 83. The third storage portion 8c is surrounded by a partition 82a and a side wall plate 82 b.
As shown in fig. 1, the capacitor module 40 and the reactor 60 are disposed and stored in the first storage part 8 a. The capacitor module 40 has a capacitor case 40 a. The smoothing capacitor 41, the capacitor P bus bar 42P, and the capacitor N bus bar 42N are disposed inside the capacitor case 40a, and are molded together in the capacitor case 40a by a capacitor molding resin 46. The smoothing capacitor 44, the positive electrode bus bar 45p, and the negative electrode bus bar 45n are provided in the capacitor module 40, and are molded together by the capacitor molding resin 46.
As shown in fig. 1, a plurality of semiconductor modules 10 are stored in the second storage section 8 b.
Fig. 5 is a front view of one of the semiconductor modules 10 in the power conversion apparatus 1 according to the exemplary embodiment shown in fig. 1. The semiconductor module 10 has a structure in which two devices, i.e., two built-in semiconductor elements 11, are provided. Further, the semiconductor module 10 has a positive electrode terminal 11p, a negative electrode terminal 11n, an output terminal 12, and a control terminal 13. As shown in fig. 1, the exemplary embodiment shows a plurality of semiconductor modules 10. The semiconductor modules 10 and the plurality of cooling tubes 15 are alternately arranged in the direction X. That is, the semiconductor modules 10 and the cooling pipes 15 are alternately stacked to form the integrated body 18. The laminated body 18 is pressed by the pressing member 19 to alternately adhere the semiconductor module 10 and the cooling pipe 15 together in the direction X.
The coolant supply portion 16 supplies the coolant to the cooling pipe 15 in order. The coolant is discharged from the cooling pipe 15 to the outside of the power conversion device 1 via the coolant outlet portion 17. The coolant supply portion 16 and the coolant outlet portion 17 are provided in the direction Y. As previously mentioned, this direction Y is perpendicular to the direction X and the direction Z, respectively. Direction Y is omitted from fig. 1.
Fig. 3 is a plan view illustrating a bus bar electrically connected to the input bus bar module 5 in the power conversion apparatus 1 according to the exemplary embodiment illustrated in fig. 1. As shown in fig. 1 and 3, the power conversion device 1 according to the exemplary embodiment has a capacitor P bus bar 42P, a capacitor N bus bar 42N, an input P bus bar 5P, an input N bus bar 5N, a detection bus bar 70, a main P bus bar 30P, a main N bus bar 30N, a positive electrode bus bar 45P, and a negative electrode bus bar 45N.
As shown in fig. 1, the capacitor P bus bar 42P is connected to the positive electrode terminal 41P of the filter capacitor 41. The capacitor P bus bar 42P has a capacitor P connection portion 43P. The capacitor N bus bar 42N is connected to the negative electrode terminal 41N of the filter capacitor 41. The capacitor N bus bar 42N has a capacitor N connection portion 43N.
As shown in fig. 1, the input P bus bar 5P has an input P connection portion 50P, a reactor connection portion 51P, a second P connection portion 52P, and a control circuit P connection portion 53P. As shown in fig. 6, the input P connection portion 50P of the input P bus bar 5P is connected to the positive electrode 2P of the DC power supply 2. The reactor connection 51p is connected to the reactor 60. The second P connection portion 52P is connected to the capacitor P connection portion 43P. The control circuit P connection portion 53P is connected to the control circuit board 20.
Further, the input N bus bar 5N has a power supply N connection portion 50N, a first N connection portion 51N, a second N connection portion 52N, and a control circuit N connection portion 53N. As shown in fig. 6, the power supply N connection portion 50N of the input N bus bar 5N is connected to the negative terminal 2N of the DC power supply 2. The first N connection portion 51N is connected to the capacitor N connection portion 43N. The second N connection portion 52N is connected to the main N bus bar connection portion 31N provided in the main bus bar 30N. The control circuit N connection portion 53N is connected to the control circuit board 20.
The detection bus bar 70 has a first P connection portion 71P and a control circuit connection portion 72. The first P-connection portion 71P is connected to the main P-bus bar connection portion 31P of the main P-bus bar 30P. The control circuit connection part 72 is connected to the control circuit board 20.
As shown in fig. 1, the main N bus bar 30N is connected to each of the negative terminals 11N (see fig. 5) of the semiconductor modules 11. Further, the main N-bus bar 30N is connected to the input N-bus bar 5N at a main N-bus bar connection portion 31N. The entire main N bus bar 30N is not molded by the capacitor molding resin 46.
As shown in fig. 1, the main P bus bar 30P is connected to the positive electrode terminal 11P (see fig. 5) of each of the semiconductor modules 10 and is also connected to the input P bus bar 5P at a main P bus bar connection portion 31P of the main P bus bar 30P. The main N bus bar 30N and the main P bus bar connection part 31P of the main P bus bar 30P are disposed outside the capacitor mold resin 46.
As shown in fig. 1, the positive electrode bus bar 45p is connected to the positive electrode terminal 44p of the smoothing capacitor 44. The positive electrode bus bar 45p has a positive electrode bus bar connection portion 46 p. The positive bus bar connection portion 46P and the main P bus bar connection portion 31P are connected to the input N bus bar 5N.
The negative electrode bus bar 45n is connected to the negative electrode terminal 44n of the smoothing capacitor 44. The negative electrode bus bar 45n has a negative electrode bus bar connection portion 46 n. The negative bus bar connection portion 46N and the main N bus bar connection portion 31N are connected to the input N bus bar 5N.
As shown in fig. 1, the third storage portion 8c accommodates the control board 20. The drive circuit drives each of the semiconductor modules 10. The driving circuit is provided on the control board 20. The control circuit P connection section 53P, the control circuit N connection section 53N, the control circuit connection section 72, and the plurality of control terminals 13 are connected to the control board 20.
The control circuit P connection portion 53P, the control circuit N connection portion 53N, and the control circuit connection portion 72 protrude into the inside of the third storage portion 8c via the first through hole 82 d. The control terminal 13 projects into the inside of the third storage portion 8c via the second through hole 82 e.
Fig. 2 is a plan view illustrating the input bus bar module 5 in the power conversion apparatus 1 according to the exemplary embodiment illustrated in fig. 1.
As shown in fig. 1 and 2, the input P bus bar 5P, the input N bus bar 5N, and the detection bus bar 70 are molded by the input bus bar molding resin 54. That is, the input P bus bar 5P, the input N bus bar 5N, and the detection bus bar 70 molded together form the input bus bar module 5. Fig. 1 shows a schematic structure of the input bus bar module 5 in which the first N connection portion 51N, the second N connection portion 52N, the first P connection portion 71P, and the second P connection portion 52P are aligned in the direction Z. However, in the actual structure of the input bus bar module 5, the first N connection portion 51N, the second N connection portion 52N, the first P connection portion 71P, and the second P connection portion 52P are arranged in the direction Y, as shown in fig. 2.
As shown in fig. 2, the first N connection portion 51N, the second N connection portion 52N, the first P connection portion 71P, the second P connection portion 52P, the input N connection portion 50N, and the reactor connection portion 51P are exposed from the input bus bar module 5. In the structure of the power conversion apparatus 1 according to the exemplary embodiment, the first N connection part 51N and the second N connection part 52N are disposed close to each other, and the first P connection part 71P and the second N connection part 52N are disposed close to each other. Further, the first N connection portion 51N, the second N connection portion 52N, the first P connection portion 71P, and the second P connection portion 52P are disposed in this order along the direction Y.
As shown in fig. 2, the first N connection portion 51N, the second N connection portion 52N, the first P connection portion 71P, and the second P connection portion 52P form a belt shape. Similarly, as shown in fig. 3, the capacitor N connection portion 43N, the main N bus bar connection portion 31N, the main P bus bar connection portion 31P, the capacitor P connection portion 43P, the positive electrode bus bar connection portion 46P, and the negative electrode bus bar connection portion 46N are formed in a band shape.
The first N connection portion 51N is fastened to the capacitor N connection portion 43N by a bolt (not shown). Similarly, the second P connection portion 52P is fastened to the capacitor P connection portion 43P by a bolt (not shown).
On the other hand, the main N bus bar connection portion 31N and the negative bus bar connection portion 46N are sequentially provided, and are fastened to the second N connection portion 52N by bolts (not shown).
Similarly, the main P bus bar connection part 31P and the positive electrode bus bar connection part 46P are sequentially provided, and are fastened to the first P connection part 71P by bolts (not shown).
As shown in fig. 2 and 3, each of the first N connection portion 51N, the second N connection portion 52N, the first P connection portion 71P, and the second P connection portion 52P extends in the direction X. These portions 51n, 52n, 71p and 52p are arranged in a direction Y perpendicular to the direction X.
Fig. 4 is a diagram showing a cross section of the input bus bar module 5 along the line IV-IV shown in fig. 3. As shown in fig. 4, the power conversion apparatus according to the exemplary embodiment has a modified structure in a cross section that is perpendicular to the extending direction (i.e., direction X) and parallel to the disposing direction (i.e., direction Y).
The first N connection portion 51N is connected to the capacitor N bus bar 42N at the capacitor N connection portion 43N, and a surface 431N of the capacitor N connection portion 43N is provided at an opposite side of the first N connection portion 51N.
Similarly, the negative bus bar connection portion 46N, the main N bus bar 30N, and the second N connection portion 52N are connected at the main N bus bar connection portion 31N. A surface 461N of the negative bus bar connecting portion 46N is provided at the opposite side of the second N connecting portion 52N.
Further, the first P connection portion 71P, the main P bus bar 30P, and the positive electrode bus bar 45P are connected at the main P bus bar connection portion 31P. A surface 461P of the positive electrode bus bar connection portion 46P is provided at the opposite side of the first P connection portion 71P.
Further, the second P connection portion 52P is connected to the capacitor P bus bar 42P at the capacitor P connection portion 43P. A surface 431P of the capacitor P connection portion 43P is provided opposite to the second P connection portion 52P.
That is, as shown in fig. 4, each of the capacitor N connection parts 431N, the surface 461N of the negative electrode bus bar connection part 46N, the surface 461p of the positive electrode bus bar connection part 46p, and
the surface 431P of the capacitor P connection portion 43P is disposed on an imaginary straight line L indicated by a long-dashed double-dashed line.
As described in detail previously and shown in fig. 1 to 5, the power conversion apparatus 1 according to the exemplary embodiment is equivalent to (i.e., forms) the circuit shown in fig. 6. Fig. 6 schematically illustrates the input bus bar module 5, the capacitor module 40, the main P bus bar 30P, and the main N bus bar 30N.
A description will now be given in detail of the effects and behaviors of the power conversion apparatus 1 according to an exemplary embodiment.
The power conversion apparatus 1 according to the exemplary embodiment has an improved structure in which the main N bus bar 30N is connected to the input N bus bar 5N without passing through the capacitor N bus bar 42N molded in the capacitor mold resin 46. That is, the main N bus bar 30N is not molded in the capacitor mold resin 46. This improved structure can prevent DC current from flowing into the capacitor module 40. Therefore, this structure prevents propagation of thermal energy generated by the DC power toward the smoothing capacitor 44 as the second capacitor and the filter capacitor 41 as the first capacitor molded in the capacitor mold resin 46 in the capacitor module 40. This improved structure makes it possible to prevent the temperature of the capacitors, such as the filter capacitor 41 and the smoothing capacitor in the capacitor module 40, from rising. Therefore, this structure can prevent the filter capacitor 41 and the smoothing capacitor 44 from being damaged, and provide the power conversion apparatus 1 according to the exemplary embodiment with high reliability.
Further, the power conversion apparatus 1 according to the exemplary embodiment has an improved structure in which the first N connection part 51N and the second N connection part 52N are disposed close to each other. Each of the first N connection portion 51N and the second N connection portion 52N is formed in the input N bus bar 5N and has the same potential. Therefore, there is no need to use and dispose any insulation therebetween, and it is possible to form the first N connection portion 51N and the second N connection portion 52N with a small gap. This structure makes it possible to miniaturize the entire size of the power conversion device 1 as compared with the conventional structure in which the first N connection portion 51N and the second N connection portion 52N are electrically separated by the connection member. In the structure of the power conversion device 1 according to the exemplary embodiment, the first N connection part 51N and the second N connection part 52N are formed and provided separately from each other. However, the concept of the present invention is not limited to this structure. It is also acceptable to assemble the first N connection part 51N and the second N connection part 52N together.
Further, the power conversion device 1 according to the exemplary embodiment has an improved structure in which the detection bus bar 70 having the first P connection portion 71P connected to the main P bus bar 30P is connected to the main P bus bar 30P, and the first P connection portion 71P and the second N connection portion 52N are disposed adjacent to each other. This structure makes it possible to reduce the inductance generated between the first P connection portion 71P and the second N connection portion 52N. This structure can reduce the generation of noise.
Further, in the structure of the power conversion device 1 according to the exemplary embodiment, the input P bus bar 5P, the input N bus bar 5N, and the detection bus bar 70 are molded by the input bus bar molding resin 54 and form the input bus bar module 5. This structure makes it possible to operate a single component molded by the input bus bar molding resin 54 and improve the work efficiency during production of the electric power charging device 1.
Further, the power conversion device 1 according to the exemplary embodiment has the smoothing capacitor 44 as the second capacitor, the positive electrode bus bar 45p, and the negative electrode bus bar 45 n. The positive electrode bus bar 45P is connected to the smoothing capacitor 44 and the first P-connection portion 71P. The negative electrode bus bar 45N is connected to the smoothing capacitor 44 and the second N connection portion 52N.
Further, each of the first N connection portion 51N, the second N connection portion 52N, the first P connection portion 71P, and the second P connection portion 52P extends in the same direction X, which is perpendicular to the direction Y along which these portions 51N, 52N, 71P, and 52P are disposed.
As shown in fig. 4 and as described previously, in a cross section perpendicular to the extending direction (in the first direction X) and parallel to the disposing direction (in the second direction Y), each of the surface 431N of the capacitor N connection portion 43N, the surface 461N of the negative electrode bus bar connection portion 46N, the surface 461P of the positive electrode bus bar connection portion 46P, and the surface 431P of the capacitor P connection portion 43P is disposed on a virtual straight line L indicated by a long-dashed double-dashed line.
The previously described improved structure may improve the work efficiency when each bus bar is connected to each of the first N connection part 51N, the second N connection part 52N, the first P connection part 71P, and the second P connection part 52P during the manufacturing process.
The power conversion apparatus 1 according to the exemplary embodiment has the smoothing capacitor 44 as the second capacitor and the filter capacitor 41 as the first capacitor. However, the concept of the present invention is not limited to this structure. For example, it is acceptable to use only the smoothing capacitor as the first capacitor without using the second capacitor. In this modified structure, the negative electrode bus bar connection portion 46N connected to the negative electrode bus bar 45N of this smoothing capacitor as the first capacitor is connected to the first N connection portion 51N, and the positive electrode bus bar connection portion 46P connected to the positive electrode bus bar 45P of this smoothing capacitor as the first capacitor is connected to the second P connection portion 52P. This structure does not require (i.e., has) the reactor connection part 51p and the detection bus bar 70.
In this modified structure, the main N bus bar 30N is connected to the input N bus bar 5N without passing through the negative electrode bus bar 45N molded by the capacitor molding resin 46. Further, since the main N bus bar 30N is not molded by the capacitor molding resin 46, this modified structure may have the same effects and behaviors of the structure of the power conversion device 1 according to the previously described exemplary embodiment.
Further, in the structure of the power conversion apparatus 1 according to the exemplary embodiment, the detection bus bar 70 is molded by the input bus bar molding resin 54. However, the concept of the present invention is not limited to this structure. For example, it is acceptable to use a test bus bar 70 that is not molded by the input bus bar molding resin 54.
As described in detail previously, the power conversion apparatus 1 and the modification thereof according to the exemplary embodiment can suppress a temperature rise of each of the capacitances. This makes it possible to provide the power conversion apparatus 1 with high reliability.
While specific embodiments of the invention have been described in detail, those skilled in the art will recognize that various modifications and substitutions to those details may be developed in light of the overall teachings of the disclosure. Accordingly, the particular arrangements disclosed are meant to be illustrative only and not limiting as to the scope of the invention which is to be given the full breadth of the claims appended and any and all equivalents thereof.
Claims (5)
1. A power conversion device (1) includes:
one or more semiconductor modules (10), each semiconductor module comprising a built-in semiconductor element (11), a positive terminal (11p), a negative terminal (11n), and a control terminal (13);
a control circuit board (20) connected to a control terminal (13) of the semiconductor module (10) and capable of driving the built-in semiconductor element (11);
a main P bus bar (30P) connected to a positive terminal (11P) of the semiconductor module (10) through which direct-current power is supplied;
a main N bus bar (30N) connected to a negative terminal (11N) of the semiconductor module (10) via which the direct-current power is supplied;
a capacitor module (40) including a first capacitor (41), a capacitor P bus bar (42P), and a capacitor N bus bar (42N), the first capacitor (41), the capacitor P bus bar (42P), and the capacitor N bus bar (42N) being molded by a capacitor molding resin (46), the capacitor P bus bar (42P) being connected to a positive terminal (41P) of the first capacitor (41), and the capacitor N bus bar being connected to a negative terminal (41N) of the first capacitor (41);
an input P bus bar (5P) connected to the positive terminal (2P) of the DC power supply (2); and
an input N bus bar (5N) connected to a negative terminal (2N) of a direct current power supply (2), the input N bus bar (5N) including a first N connection portion (51N) and a second N connection portion (52N), the first N connection portion (51N) being connected to the capacitor N bus bar (42N), the second N connection portion (52N) being connected to the main N bus bar (30N), and the main N bus bar (30N) being disposed outside the capacitor molding resin (46), the first capacitor (41), the capacitor P bus bar (42P), and the capacitor N bus bar (42N) being molded with the capacitor molding resin (46).
2. The power conversion apparatus (1) according to claim 1, wherein the first N connection section (51N) and the second N connection section (52N) are disposed adjacent to each other.
3. The power conversion apparatus (1) according to claim 1 or 2, further comprising a detection bus bar (70) connected to the main P bus bar (30P) and the control circuit board (20),
wherein the detection bus bar (70) includes a first P connection portion (71P) connected to the main P bus bar (30P), and
the first P connection portion (71P) and the second N connection portion (52N) are disposed adjacent to each other.
4. The power conversion apparatus (1) according to claim 3, wherein the input P bus bar (5P), the input N bus bar (5N), and the detection bus bar (70) are molded by an input bus bar molding resin (54) and form an input bus bar module (5).
5. The power conversion apparatus (1) according to claim 4, further comprising:
a second capacitor (44);
a positive electrode bus bar (45P) connected to the second capacitor and the first P connection portion (71P); and
a negative bus bar (45N) connected to the second capacitor and the second N connection portion (52N),
wherein each of the first N connection portion (51N), the second N connection portion (52N), the first P connection portion (71P), and the second P connection portion (52P) extends along a first direction (X) and is disposed in a second direction (Y) perpendicular to the first direction (X), and
the first N connection part (51N) is connected to the capacitor N bus bar (42N) at a capacitor N connection part (43N), and a surface (431N) of the capacitor N connection part (43N) is provided at an opposite side of the first N connection part (51N),
connecting a negative bus bar connection part (46N), the main N bus bar (30N), and the second N connection part (52N) at a main N bus bar connection part (31N), and providing a surface (461N) of the negative bus bar connection part (46N) at an opposite side of the second N connection part (52N),
connecting the first P connection part (71P), the main P bus bar (30P) and the positive bus bar (45P) at a main P bus bar connection part (31P), and providing a surface (461P) of a positive bus bar connection part (46P) at an opposite side of the first P connection part (71P),
the second P connection part (52P) is connected to the capacitor P bus bar (42P) at a capacitor P connection part (43P), and a surface (431P) of the capacitor P connection part (43P) is provided opposite to the second P connection part (52P),
wherein,
a surface (431N) of the capacitor N connection part (43N),
A surface (461n) of the negative electrode bus bar connecting portion (46n),
A surface (461p) of the positive electrode bus bar connecting part (46p), and
each of surfaces (431P) of the capacitor P connection (43P) is disposed on an imaginary straight line (L) in a cross section perpendicular to the first direction (X) and parallel to the second direction (Y).
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2015045232A JP6398800B2 (en) | 2015-03-06 | 2015-03-06 | Power converter |
| JP2015-045232 | 2015-03-06 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105939117A CN105939117A (en) | 2016-09-14 |
| CN105939117B true CN105939117B (en) | 2019-06-14 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610122474.2A Active CN105939117B (en) | 2015-03-06 | 2016-03-04 | Power inverter |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US10250155B2 (en) |
| JP (1) | JP6398800B2 (en) |
| CN (1) | CN105939117B (en) |
| DE (1) | DE102016103785A1 (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6597714B2 (en) * | 2017-05-30 | 2019-10-30 | ダイキン工業株式会社 | Power converter, refrigeration equipment |
| JP7124402B2 (en) * | 2018-04-10 | 2022-08-24 | 株式会社デンソー | power converter |
| JP2020013834A (en) * | 2018-07-13 | 2020-01-23 | 株式会社デンソー | Capacitor device |
| JP7151582B2 (en) * | 2019-03-26 | 2022-10-12 | 株式会社デンソー | power converter |
| JP7151614B2 (en) * | 2019-04-26 | 2022-10-12 | 株式会社デンソー | power converter |
| JP7234845B2 (en) * | 2019-07-26 | 2023-03-08 | 株式会社デンソー | capacitor unit |
| JP7647162B2 (en) * | 2021-02-25 | 2025-03-18 | 富士電機株式会社 | Power Conversion Equipment |
| JP2024048871A (en) * | 2022-09-28 | 2024-04-09 | 株式会社デンソー | Output potential switching circuit |
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| JP2008029094A (en) * | 2006-07-20 | 2008-02-07 | Hitachi Ltd | Power converter |
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| CN102948064A (en) * | 2010-06-21 | 2013-02-27 | 日立汽车系统株式会社 | Power conversion device |
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| EP1363026A3 (en) * | 2002-04-26 | 2004-09-01 | Denso Corporation | Invertor integrated motor for an automotive vehicle |
| JP5273457B2 (en) | 2008-11-14 | 2013-08-28 | 株式会社デンソー | Power converter and wire harness with connector for high voltage detection |
| JP5403089B2 (en) * | 2011-05-26 | 2014-01-29 | 株式会社デンソー | Power converter |
| JP5506740B2 (en) * | 2011-05-31 | 2014-05-28 | 日立オートモティブシステムズ株式会社 | Power converter |
| JP5344013B2 (en) | 2011-09-06 | 2013-11-20 | 株式会社デンソー | Power converter |
| JP5808630B2 (en) * | 2011-09-28 | 2015-11-10 | 株式会社ミツバ | SR motor control device |
| JP5747857B2 (en) * | 2012-04-06 | 2015-07-15 | 株式会社デンソー | Power converter |
| JP5700022B2 (en) * | 2012-10-29 | 2015-04-15 | 株式会社デンソー | Power converter |
| JP5821890B2 (en) * | 2013-04-17 | 2015-11-24 | トヨタ自動車株式会社 | Power converter |
| US10122313B2 (en) * | 2015-01-19 | 2018-11-06 | Hitachi Automotive Systems, Ltd. | Power conversion device |
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2015
- 2015-03-06 JP JP2015045232A patent/JP6398800B2/en active Active
-
2016
- 2016-03-02 US US15/058,490 patent/US10250155B2/en active Active
- 2016-03-03 DE DE102016103785.0A patent/DE102016103785A1/en active Pending
- 2016-03-04 CN CN201610122474.2A patent/CN105939117B/en active Active
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| JP2008029094A (en) * | 2006-07-20 | 2008-02-07 | Hitachi Ltd | Power converter |
| CN102835013A (en) * | 2010-04-01 | 2012-12-19 | 日立汽车系统株式会社 | Power conversion device |
| CN102948064A (en) * | 2010-06-21 | 2013-02-27 | 日立汽车系统株式会社 | Power conversion device |
Also Published As
| Publication number | Publication date |
|---|---|
| US10250155B2 (en) | 2019-04-02 |
| JP2016165202A (en) | 2016-09-08 |
| JP6398800B2 (en) | 2018-10-03 |
| CN105939117A (en) | 2016-09-14 |
| US20160261207A1 (en) | 2016-09-08 |
| DE102016103785A1 (en) | 2016-09-08 |
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