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CN104916574B - 一种柔性oled脱膜装置 - Google Patents

一种柔性oled脱膜装置 Download PDF

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CN104916574B
CN104916574B CN201510192320.6A CN201510192320A CN104916574B CN 104916574 B CN104916574 B CN 104916574B CN 201510192320 A CN201510192320 A CN 201510192320A CN 104916574 B CN104916574 B CN 104916574B
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oled
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CN104916574A (zh
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向欣
任海
禹浩荣
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Sichuan CCO Display Technology Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68381—Details of chemical or physical process used for separating the auxiliary support from a device or wafer

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Abstract

本发明公开了一种柔性OLED脱膜装置，包括主机台，主机台的上平面设有可移动的基板吸附基台；所述基板吸附基台用于吸附OLED基板；所述主机台包括OLED基板放置区域和OLED基板激光照射区域；所述OLED基板放置区域的上部设有悬挂机台；所述激光照射区域的上部设有激光发生器，激光发生器通过其设有的线阵激光源对激光照射区域内的OLED基板进行激光照射；所述悬挂机台的下表面设有真空吸盘，所述真空吸盘与悬挂机台之间通过气缸连接。由于OLED基板放置区域的上部设有悬挂机台，使OLED基板12的刚性衬底和柔性OLED膜发生剥离，得到柔性OLED基板，该装置具有准确、快速的把刚性衬底与柔性衬底分离的效果。

Description

一种柔性OLED脱膜装置
技术领域
本发明属于OLED显示制造技术领域，尤其涉及一种柔性OLED脱膜装置。
背景技术
OLED柔性器件的应用越来越广泛，从各种大型曲面显示装置到微型智能应用端，如智能手表、腕带等，都已经开始广泛的被采用。相较于传统的平板显示屏，柔性OLED应用特性显然更加优越，其市场的拓展空间也非常广阔。
现在最为成熟的柔性OLED制造工艺是在刚性衬底(如玻璃基板)上制作柔性衬底(高分子聚合物)再在柔性衬底之上制作OLED电极及发光结构。而在完成所有的制造工序后，需要把刚性衬底与柔性衬底分离，即实现柔性OLED的脱膜。
发明内容
本发明所要解决的技术问题是，需要准确，快速的把刚性衬底与柔性衬底分离。
为解决上述技术问题，本发明的技术方案是：提供一种柔性OLED脱膜装置，包括主机台，主机台的上平面设有可移动的基板吸附基台；所述基板吸附基台用于吸附OLED基板；
所述主机台包括OLED基板放置区域和OLED基板激光照射区域；所述OLED基板放置区域的上部设有悬挂机台；所述激光照射区域的上部设有激光发生器，激光发生器通过其设有的线阵激光源对激光照射区域内的OLED基板进行激光照射；
所述悬挂机台的下表面设有真空吸盘，所述真空吸盘与悬挂机台之间通过气缸连接。
进一步的，还包括自动机械手、基板卡匣和传输带，所述自动机械手设置在主机台的前端，所述传输带与主机台水平平行；基板卡匣设置在自动机械手的一旁。
进一步的，所述主机台和基板吸附基台之间通过滑轨耦合。
进一步的，所述基板吸附基台的表面开有密集小孔为真空吸附基台。
进一步的，所述基板卡匣4的下部设有卡匣基座11。
本发明的有益效果：由于OLED基板放置区域的上部设有悬挂机台，使OLED基板12的刚性衬底和柔性OLED膜发生剥离，得到柔性OLED基板，该装置具有准确、快速的把刚性衬底与柔性衬底分离的效果。
附图说明
图1为本方案结构俯视图；
图2为本方案结构侧视图；
其中，1、主机台，2、基板吸附基台，3、自动机械手，4、基板卡匣，5、激光发生器，6、线阵激光源，7、悬挂机台，8、气缸，9、真空吸盘，10、传输带，11、卡匣基座，12、OLED基板。
具体实施方式
下面结合附图和具体的实施例对本发明作进一步的阐述。
如图1和2所示，一种柔性OLED脱膜装置，包括主机台1，主机台1的上平面设有可移动的基板吸附基台2；所述基板吸附基台2用于吸附OLED基板12。
主机台1包括基板放置区域和基板激光照射区域；所述基板放置区域的上部设有悬挂机台7；所述激光照射区域的上部设有激光发生器5，激光发生器5通过其设有的线阵激光源6对激光照射区域内的OLED基板12进行激光照射；主机台1和基板吸附基台2之间通过滑轨耦合，基板吸附基台2为表面开有密集小孔的真空吸附基台，基板吸附基台2吸附住OLED基板12沿滑轨从基板放置区域进入到基板激光照射区域，OLED基板12在基板激光照射区域沿滑轨位置往复运行。
悬挂机台7的下表面设有真空吸盘9，所述真空吸盘9与悬挂机台7之间通过气缸8连接，气缸8可以控制真空吸盘9在垂直方向上往复运动，真空吸盘9附住上表面的柔性面板，气缸向上小幅收起吸附板的同时下部基台吸附住的刚性衬底快速启动运行小段距离，使得刚性衬底和柔性OLED膜发生剥离。
柔性OLED脱膜装置还包括自动机械手3、基板卡匣4和传输带10，所述自动机械手3设置在主机台1的前端，基板卡匣4设置在自动机械手3的一旁，自动机械手3将OLED基板12从基板卡匣4中取出放在到吸附OLED基板12上。传输带10与主机台1水平平行，悬挂机台7运行至传输10带上方将脱模完成的OLED基板12放在传输带10上后复位。
工作时，生产操作人员把装有OLED基板12的基板卡匣4放置在位置固定的卡匣基座11上；自动机械手3从基板卡匣4中分层抽出未进行脱模处理的OLED基板12放在基板吸附基台2上，主机台1真空开启，将放在基板吸附基台2上的未进行脱模处理的OLED基板12固定。再激光打开后，基板吸附基台2运载未进行脱模处理的OLED基板12进入激光照射区域，激光发生器5通过其设有的线阵激光源6对激光照射区域内的OLED基板12进行激光照射。基板吸附基台2带动未进行脱模处理的OLED基板12沿滑轨在激光照射区域往复运行，使激光充分照射OLED基板12全部位置，激光照射是为了让柔性衬底与刚性衬底之间获取能量使得二者之间粘附力减弱，激光输出的功率恒定的，如果想要使得柔性衬底与刚性衬底能被顺利剥离，就需要对其反复来进行照射，在达到工艺设定的激光照射要求后基板吸附基台2带动OLED基板12复位。(至于反复的次数要根据具体衬底的材料和激光功率来判定，一个实际测试结果，一个经验值。)
此时悬挂机台7运行至基板放置区被激光照射均匀后的OLED基板12上方，气缸8推动真空吸盘9向下并在真空吸盘9接触到OLED基板12上表面后停止。此时吸盘真空开启真空吸盘9吸附住OLED基板12上表面的柔性面板，气缸向8上小幅收起真空吸盘9的同时，OLED基板12的下部基板吸附基台2吸附住OLED基板12的刚性衬底快速启动向下运行小段距离，使得OLED基板12的刚性衬底和柔性OLED膜发生剥离，得到柔性OLED基板。此后气缸8再向上收回一段距离，悬挂机台7运行至传输带10上方并将柔性OLED基板放在传输带10上然后复位，等待下个激光照射均匀后的OLED基板12到位的指令，传输带10将柔性OLED基板输送到下个工位。与此同时，基板吸附基台2真空破除，自动机械手3拾取已经脱膜的刚性衬底放入其原来在基板卡匣4中的位置。
按此运行步骤，自动机械手3再抽出其他未脱膜的OLED基板12进行以上步骤的作业，待基板卡匣中4内全部OLED基板12脱膜完成后，生产操作员再对整个基板卡匣中4进行替换，基板卡匣中4安装在卡匣基座11上。匣基座11的位置可根据生产需要进行实际调整。
本领域的普通技术人员将会意识到，这里所述的实施例是为了帮助读者理解本发明的原理，应被理解为本发明的保护范围并不局限于这样的特别陈述和实施例。本领域的普通技术人员可以根据本发明公开的这些技术启示做出各种不脱离本发明实质的其它各种具体变形和组合，这些变形和组合仍然在本发明的保护范围内。

Claims (5)

1.一种柔性OLED脱膜装置，其特征在于：包括主机台(1)，主机台(1)的上平面设有可移动的基板吸附基台(2)；所述基板吸附基台(2)用于吸附OLED基板(12)；
所述主机台(1)包括OLED基板放置区域和OLED基板激光照射区域；所述OLED基板放置区域的上部设有悬挂机台(7)；所述激光照射区域的上部设有激光发生器(5)，激光发生器(5)通过其设有的线阵激光源(6)对激光照射区域内的OLED基板(12)进行激光照射；
所述悬挂机台(7)的下表面设有吸附盘，所述吸附盘与悬挂机台(7)之间通过气缸(8)连接；还包括自动机械手(3)、基板卡匣(4)和传输带(10)，所述自动机械手(3)设置在主机台(1)的前端，所述传输带(10)与主机台(1)水平平行；基板卡匣(4)设置在自动机械手(3)的一旁。
2.根据权利要求1所述的柔性OLED脱膜装置，其特征在于：所述主机台(1)和基板吸附基台(2)之间通过滑轨耦合。
3.根据权利要求1所述的柔性OLED脱膜装置，其特征在于：所述基板吸附基台(2)为表面开有密集小孔的真空吸附基台。
4.根据权利要求1所述的柔性OLED脱膜装置，其特征在于：所述基板卡匣(4)的下部设有卡匣基座(11)。
5.根据权利要求1所述的柔性OLED脱膜装置，其特征在于：所述吸附盘为真空吸盘(9)。
CN201510192320.6A 2015-04-22 2015-04-22 一种柔性oled脱膜装置 Expired - Fee Related CN104916574B (zh)

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CN107452898B (zh) * 2016-05-31 2019-08-23 上海微电子装备（集团）股份有限公司 一种激光剥离装置和方法
CN106098965B (zh) * 2016-06-15 2018-08-21 昆山国显光电有限公司 柔性基板剥离装置及柔性基板剥离方法
CN108539050B (zh) * 2018-03-12 2020-07-03 武汉华星光电半导体显示技术有限公司 柔性面板的分离方法
CN110556330B (zh) * 2019-09-12 2022-03-22 云谷（固安）科技有限公司 支撑衬底、剥离装置、柔性显示面板及其制备方法
KR102093949B1 (ko) * 2019-11-22 2020-03-26 주식회사 한송네오텍 플렉서블 디스플레이 제조용 일괄 필름 분리 및 검사 장치
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