CN104597978B - Electronic device and circuit module thereof - Google Patents

Abstract

The present invention relates to an electronic device and its circuit module. The circuit module is electrically connected to a circuit substrate device. The circuit substrate device includes a power output end. The circuit module includes a substrate, a boost circuit and a plasma tube. The substrate has at least one through hole. The substrate is connected to the circuit substrate device in a direction opposite to the thickness side. The boost circuit is arranged on the substrate, which includes at least one conductive circuit and a plurality of electronic components electrically connected to the conductive circuit. The conductive circuit includes a power input end and two power output ends that can be electrically connected to the power output end. The electronic components are inserted into the through hole. The opposite ends of the plasma tube have electrodes electrically connected to the power output end. The electronic device includes a circuit module and a circuit substrate device electrically connected to the circuit module. The circuit substrate device is connected to the substrate of the circuit module in a direction opposite to the thickness side. When the present invention is inserted into a motherboard, it is not easy to occupy space, and more electronic devices can be inserted into the motherboard.

Description

Electronic device and its circuit module

technical field

The invention relates to an electronic device and its circuit module.

Background technique

The circuit module of a general electronic device includes a circuit substrate, a plurality of electronic components and a connection port. Several electronic components are directly welded on the circuit substrate, and the connection port is electrically connected to the circuit substrate and can be assembled on the computer motherboard. , when the circuit module is connected to the motherboard, the power of the motherboard can be transmitted for use by the circuit module. The circuit module disclosed in Taiwan Patent M456042 belongs to this category.

However, the electronic components of this type of circuit module are directly glued on the circuit substrate, and some of the electronic components are inevitably thicker. When they are arranged on the substrate, the circuit module will be too thick; in addition, each The distance between the slots of the mainboard has specific specifications, so the inserted electronic device must meet its thickness limit. If the circuit module is covered with other shells, and then the circuit module is plugged into the mainboard, It will take up a lot of space, causing some slots to be idle. Therefore, it is necessary to provide a novel and progressive electronic device and its circuit module to solve the above problems.

Contents of the invention

The main purpose of the present invention is to provide an electronic device and its circuit module, the substrate of the circuit module has at least one through hole, and at least one electronic component is penetrated through the through hole, so that the overall thickness can be reduced, and When it is plugged into the motherboard, it is less likely to occupy space, so that more electronic devices can be plugged into the motherboard.

To achieve the above object, the present invention adopts the following technical solutions:

A circuit module, the circuit module is electrically connected to a circuit substrate device, the circuit substrate device includes a power output terminal, the circuit module includes a substrate, a boost circuit and a plasma tube; the substrate There is at least one through hole, and the substrate is used for bonding with the circuit substrate device in a direction in which the thickness side faces; the boost circuit is arranged on the substrate, and the boost circuit includes at least one conductive circuit and a plurality of conductive circuits electrically connected to the at least one conductive circuit. Connected electronic components, the at least one conductive line includes a power input end and two power output ends for electrical connection with the power output end, at least one of the electronic components passes through the through hole; the opposite of the plasma tube Both ends have two electrodes electrically connected to the two power supply output ends.

further,

Each electrode includes a hollow electrode cap cylinder located inside the plasma tube, and the two electrode cap cylinders are arranged coaxially.

The power input end is electrically connected to a memory, a display card, a network card or a printed circuit board provided with the power output end.

The plurality of electronic components includes a plurality of passive components and at least one transformer, the plurality of passive components are electrically connected to form a low-voltage step-up circuit electrically connected to the input end of the power supply, and the at least one transformer forms a low-voltage booster circuit electrically connected to the The high-voltage boost circuit between the low-voltage boost circuit and the output terminals of the two power supplies.

The plurality of electronic components also includes a processing unit, and the processing unit includes a frequency conversion circuit electrically connected to the power input terminal and the low-voltage booster circuit.

In order to achieve the above object, the present invention also provides an electronic device, which includes a circuit module as described above, and also includes a circuit substrate device electrically connected to the circuit module, and the circuit substrate device and the circuit module The substrates are bonded with the thickness sides facing each other.

further,

The circuit substrate device also includes an electrical socket for electrical insertion with an electrical socket of a computer motherboard, and the electrical socket is arranged on a side of the circuit substrate device opposite to the circuit module.

At least one bridging member is also connected between the circuit substrate device and the substrate of the circuit module. It is connected to the circuit substrate device and the substrate of the circuit module.

The electronic device also includes two heat sinks, and the two heat sinks are respectively covered on opposite sides of the electronic device.

The electronic device also includes at least one shell, which is embedded in parallel with one of the heat sinks on one side of the electronic device.

The advantages of the present invention are:

The circuit module of the present invention has at least one through hole, and at least one electronic component is inserted through the through hole, so that the overall thickness can be reduced, and when it is inserted into the main board, it is less likely to occupy space, and more electronic devices can be used. Can be plugged into the motherboard.

Description of drawings

FIG. 1 is a perspective view of an electronic device according to a preferred embodiment of the present invention.

FIG. 2 is an exploded view of an electronic device according to a preferred embodiment of the present invention.

FIG. 3 is an assembly diagram of a circuit module and a circuit substrate device according to a preferred embodiment of the present invention.

FIG. 4 is a block diagram showing the structural relationship of circuit modules in a preferred embodiment of the present invention.

FIG. 5 is a partially enlarged view of an electronic device according to a preferred embodiment of the present invention.

Detailed ways

The following examples only illustrate possible embodiments of the present invention, which are not intended to limit the protection scope of the present invention, and are stated in advance.

Please refer to FIGS. 1 to 4, which show a preferred embodiment of the present invention. The circuit module 1 of the present invention is electrically connected to a circuit substrate device 40. The circuit substrate device 40 includes a power output terminal 200. The circuit module Group 1 includes a substrate 10 , a boost circuit 20 and a plasma tube 30 . Furthermore, the booster circuit 20 can convert the low-voltage power input from the circuit board device into high-voltage alternating current or high-voltage pulsed direct current to supply the plasma tube 30 , so that the plasma tube 30 can generate a plurality of lightning-like light rays.

The substrate 10 has at least one through hole 100 for passing through the electronic component; the substrate 10 is used for bonding with the circuit substrate device 40 in a direction facing the thickness side. In this embodiment, the substrate 10 has a plurality of through holes 100, through which various electronic components can be inserted; it can be understood that there may be only one through hole and a plurality of electronic components penetrated therein; or, The base plate has only one through hole, and an electronic component which takes up a lot of space is inserted therein.

The booster circuit 20 is arranged on the substrate 10, and the booster circuit 20 includes at least one conductive circuit and a plurality of electronic components 202 electrically connected to the at least one conductive circuit. The power input end 201 , the two power output ends 23 , and at least one electronic component 202 pass through the through hole 100 . More specifically, the conductive circuit is embedded in the substrate 10. In this embodiment, the substrate 10 and the conductive circuit form a printed circuit board; of course, the conductive circuit can also be provided on the substrate in other forms. Furthermore, the booster circuit 20 can convert the low-voltage direct current input from the power supply input terminal 201 into a high-voltage alternating current, and supply the plasma tube 30 through the two power supply output terminals 23 for use; it is understandable that the booster circuit 20 can also convert the low-voltage Convert direct current to high voltage pulsed direct current. In this embodiment, the power input end 201 is electrically connected to the memory (circuit substrate device 40) provided with the power output end 200, so that the memory (circuit substrate device 40) and the circuit module 1 can be connected more easily. Does not take up space; of course, the power input end can also be electrically connected to a display card, network card or printed circuit board provided with a power output end.

More specifically, the plurality of electronic components 202 includes a plurality of passive components 210 and at least one transformer 220, and the plurality of passive components 210 are electrically connected to form a low-voltage booster circuit 21 electrically connected to the power input terminal 201, and the circuit board can be The direct current provided by the device 40 is converted into alternating current or pulsed direct current. At least one transformer 220 constitutes a high-voltage boost circuit 22 electrically connected between the low-voltage boost circuit 21 and the two power output terminals 23 , which can convert the low-voltage power to high-voltage power for the plasma tube 30 .

More specifically, the complex electronic components 202 also include a processing unit 24, the processing unit 24 includes a frequency conversion circuit 240 electrically connected to the power input terminal 201 and the low-voltage boost circuit 21, through the frequency conversion circuit 240, a The power supply of one frequency is converted into a power supply of a second frequency. Furthermore, by switching the frequency, the plasma tube 30 can generate light with different disturbance effects.

Two opposite ends of the plasma tube 30 have two electrodes 31 electrically connected to the two power output terminals 23 . More specifically, the plasma tube 30 has a low-pressure inert gas inside, and the inner wall of the plasma tube 30 is coated with a fluorescent substance. When a high voltage is applied, the inert gas can be dissociated and a lightning-like light can be generated. More specifically, each electrode 31 includes a hollow electrode cap tube 310 located inside the plasma tube 30, and the two electrode cap tubes 310 are coaxially arranged to emit light along the periphery of the electrode cap tube 310, so that the light It is more divergent (as shown in Figure 5), and is more aesthetically pleasing than the concentrated light produced by traditional filament electrodes.

The present invention also provides an electronic device 2, including a circuit module 1 as described above, and a circuit substrate device 40 electrically connected to the circuit module 1, the circuit substrate device 40 and the substrate of the circuit module 1 10 are bonded in the direction that the thickness sides face each other. In this embodiment, the circuit substrate device 40 is a memory. Of course, the circuit substrate device can also be a display card, a network card or a printed circuit board; of course, the substrate of the circuit module and the circuit substrate The device can also be integrally formed.

The circuit substrate device 40 also includes an electrical socket 41 for electrically plugging into an electrical slot of a computer motherboard, the electrical socket 41 is arranged on the side of the circuit substrate device 40 opposite to the circuit module 1, It can be understood that the electrical socket 41 can be a socket conforming to Peripheral Component Interconnect (PCI), Peripheral Component Interconnect Express (PCI-E) or other connection interface specifications. Data transmission between the circuit substrate device 40 and the mainboard of the computer is carried out through the electrical socket 41 .

At least one bridging member 42 is also connected between the circuit substrate device 40 and the substrate 10 of the circuit module 1, each bridging member 42 straddles the thickness side where the circuit substrate device 40 and the substrate 10 of the circuit module 1 are joined, and each bridging member 42 The two ends of the bridges 42 are respectively fixed on the circuit substrate device 40 and the substrate 10 of the circuit module 1. It can be understood that a part of these bridges 42 can be used to transmit the power of the circuit substrate device 40 to the conductive conductor of the circuit module 1. line.

The electronic device 2 also includes two heat sinks 3, which are respectively covered on opposite sides of the electronic device 2. Furthermore, the two heat sinks 3 are respectively covered on one side of the circuit substrate device 40, so that the circuit substrate device 40 dissipates the heat generated during operation to prevent the electronic device 2 from being overheated or damaged; it is understandable that a heat sink may not be provided. The electronic device 2 also includes at least one shell 4, and the shell 4 is embedded in parallel with one of the heat sinks 3 on one side of the electronic device 2. In this embodiment, the electronic device 2 includes two shells 4, through two The case 4 and the two heat sinks 3 can cover most of the circuit module 1 and the circuit substrate device 40 therein, making them less susceptible to damage by external factors. It can be understood that the shell can be made of a heat dissipation material, so that the shell has a heat dissipation effect; in other embodiments, the heat sink and the shell can also be integrally formed components, which have decoration, protection and heat dissipation effects at the same time.

To sum up, the circuit module of the present invention has at least one through hole, and at least one electronic component is inserted through the through hole. In this way, the overall thickness can be reduced, and when it is inserted into the motherboard, it is less likely to occupy space and can More electronic devices can be plugged into the motherboard.

In summary, the overall structural design, practicability and benefits of the present invention are indeed fully in line with the needs of industrial development, and the disclosed structural invention also has an unprecedented innovative structure, so it has the meaning of "novelty". Undoubtedly, the present invention can improve the function more than the known structure, so it also has "progressiveness".

Claims (10)

1. circuit module, for being electrically connected with a circuit board device, which includes a power output end portion, It is characterized in that, which includes：

One substrate has an at least perforation, and the substrate with the circuit board device with the direction of thickness side opposite direction for being engaged；

One booster circuit is set to the substrate, including an at least conducting wire and plural number are electrically connected with an at least conducting wire Electronic component, at least a conducting wire is embedded in the substrate for this, the substrate and the print that at least a conducting wire is integrally formed Printed circuit board, the electronic component are to be electrically connected with plural pin with the mutually independent component of the printed circuit board, the electronic component To the conducting wire of the printed circuit board, which includes an electricity for being electrically connected with the power output end portion Source input end and two power output ends, at least a perforation is not closed out for this, at least one electronic component be arranged in the perforation, with The hole wall of the perforation has gap and from the opening of the perforation with respect to the two ends exposure external world；

One piasmatron, opposite end have two electrodes being electrically connected with two power output end.

2. circuit module as described in claim 1, which is characterized in that each electrode includes one inside the piasmatron and is Hollow electrode cap cylinder, two electrode cap cylinders are in coaxial arrangement.

3. circuit module as described in claim 1, which is characterized in that the power input end supply with it is defeated equipped with the power supply Memory body, display card, network card or the printed circuit board for going out end are electrically connected.

4. circuit module as described in claim 1, which is characterized in that the plural number electronic component include plural passive device and An at least transformer is electrically connected between the plural number passive device and constitutes a low pressure liter for being electrically connected the power input end Volt circuit, an at least transformer constitute a height being electrically connected between the low pressure booster circuit and two power output end Press booster circuit.

5. circuit module as claimed in claim 4, which is characterized in that the plural number electronic component further includes a processing unit, The processing unit includes the frequency changer circuit of the electric connection power input end and the low pressure booster circuit.

6. a kind of electronic device includes just like the circuit module described in any one of claim 1 to 5, which is characterized in that also The substrate of the circuit board device being electrically connected with the circuit module including one, the circuit board device and the circuit module is with thickness Spend the direction engagement of side opposite direction.

7. electronic device as claimed in claim 6, which is characterized in that the circuit board device further includes a confession and computer master The electrical insert row of the electrical grafting of electrical slot of machine plate, the electrical insert row are set to the circuit board device relative to the circuit The side of module.

8. electronic device as claimed in claim 6, which is characterized in that the circuit board device and the substrate of circuit module it Between be also associated with an at least bridgeware, each bridgeware crosses over the thickness that the circuit board device is engaged with the substrate of circuit module Side is spent, the both ends of each bridgeware are respectively and fixedly connected with the substrate in the circuit board device and circuit module.

9. electronic device as claimed in claim 6, which is characterized in that further include two cooling fins, which covers respectively In the opposite sides of the electronic device.

10. electronic device as claimed in claim 9, which is characterized in that further include an at least shells, the shells is in the electronics The side of device is parallelly halved together with a wherein cooling fin.