CN104289463A - Spinner cleaning apparatus - Google Patents
Spinner cleaning apparatus Download PDFInfo
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- CN104289463A CN104289463A CN201410335934.0A CN201410335934A CN104289463A CN 104289463 A CN104289463 A CN 104289463A CN 201410335934 A CN201410335934 A CN 201410335934A CN 104289463 A CN104289463 A CN 104289463A
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- 238000004140 cleaning Methods 0.000 title claims abstract description 121
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 83
- 230000002093 peripheral effect Effects 0.000 claims abstract description 33
- 238000002347 injection Methods 0.000 claims abstract description 4
- 239000007924 injection Substances 0.000 claims abstract description 4
- 238000005507 spraying Methods 0.000 claims description 20
- 235000012431 wafers Nutrition 0.000 abstract description 80
- 238000005406 washing Methods 0.000 abstract description 35
- 239000007921 spray Substances 0.000 abstract description 22
- 239000003595 mist Substances 0.000 abstract description 6
- 238000005192 partition Methods 0.000 description 17
- 239000004065 semiconductor Substances 0.000 description 14
- 238000001035 drying Methods 0.000 description 10
- 230000003028 elevating effect Effects 0.000 description 5
- 238000000227 grinding Methods 0.000 description 4
- 239000000470 constituent Substances 0.000 description 3
- 238000011109 contamination Methods 0.000 description 3
- 238000003780 insertion Methods 0.000 description 3
- 230000037431 insertion Effects 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 230000001965 increasing effect Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000000149 penetrating effect Effects 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 239000000356 contaminant Substances 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/02—Cleaning by the force of jets or sprays
- B08B3/022—Cleaning travelling work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B13/00—Accessories or details of general applicability for machines or apparatus for cleaning
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B15/00—Preventing escape of dirt or fumes from the area where they are produced; Collecting or removing dirt or fumes from that area
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
- H01L21/02052—Wet cleaning only
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Cleaning By Liquid Or Steam (AREA)
Abstract
提供一种旋转清洗装置，其在旋转清洗时，能够防止清洗时被污染的喷雾和清洗水再次附着到晶片。旋转清洗装置(1)具备：保持晶片的保持工作台(10)；保持工作台旋转部(15)；清洗水喷射构件(50)；收纳保持工作台的腔(30)；从腔内将气体排出的导管(45)；风扇部件(20)，其形成为圆环形状，并覆盖从保持工作台的表面位置到腔的开口部为止的围绕保持工作台的外周空间；以及使风扇部件旋转的风扇部件旋转部(25)，风扇部件利用风扇部件旋转部进行旋转，由此在保持工作台的上部从风扇部件的圆环形状内周部向风扇部件的外周部产生空气流动，将清洗时的清洗水和喷雾排出到风扇部件的外部并导入至导管。
Provided is a spin cleaning device capable of preventing spray and cleaning water contaminated during cleaning from adhering to wafers again during spin cleaning. The rotary cleaning device (1) has: a holding table (10) for holding the wafer; a rotating part (15) of the holding table; a cleaning water injection member (50); A duct (45) for discharge; a fan part (20) formed in a ring shape and covering an outer peripheral space around the holding table from the surface position of the holding table to the opening of the cavity; and a fan part that rotates The fan part rotating part (25), the fan part is rotated by the fan part rotating part, thereby at the top of the holding table from the ring-shaped inner peripheral part of the fan part to the outer peripheral part of the fan part, the air flow is generated, and the cleaning time is reduced. Washing water and mist are discharged to the outside of the fan unit and introduced into the duct.
Description
技术领域technical field
本发明涉及通过向旋转的半导体晶片等工件供给清洗水来清洗工件的旋转清洗装置。The present invention relates to a spin cleaning device for cleaning a workpiece such as a rotating semiconductor wafer by supplying cleaning water to the workpiece.
背景技术Background technique
在半导体器件制造工序中，在大致圆板形状的半导体晶片的表面由呈格子状排列的分割预定线划分出多个区域，在该划分出的各区域形成有IC、LSI等半导体器件。然后，通过沿着分割预定线对半导体晶片进行切割来分割各区域，由此制造出一个个半导体器件。存在切割时产生的切屑等污物附着在半导体晶片的表面的情况。因此，半导体晶片在切割完成后，利用旋转清洗装置进行清洗，所述旋转清洗装置通过向旋转的半导体晶片供给清洗水来清洗半导体晶片。In the manufacturing process of semiconductor devices, the surface of a substantially disc-shaped semiconductor wafer is divided into a plurality of regions by dividing lines arranged in a grid pattern, and semiconductor devices such as ICs and LSIs are formed in each of the divided regions. Then, each region is divided by dicing the semiconductor wafer along planned dividing lines, thereby manufacturing individual semiconductor devices. Contaminants such as chips generated during dicing may adhere to the surface of the semiconductor wafer. Therefore, after the dicing is completed, the semiconductor wafer is cleaned by a spin cleaning device that cleans the semiconductor wafer by supplying cleaning water to the rotating semiconductor wafer.
然而，在利用旋转清洗装置清洗半导体晶片时，从旋转清洗装置卷起的被污染的喷雾在旋转清洗装置的腔内扩散，由此存在喷雾再次附着到半导体晶片表面的情况。因此，在以往的旋转清洗装置中，提出了如下方案，通过在腔内产生向下气流，来抑制喷雾向腔内扩散，从而抑制污物再次附着到半导体晶片(参照专利文献1)。However, when the semiconductor wafer is cleaned by the spin cleaning device, the contaminated spray rolled up from the spin cleaning device diffuses in the chamber of the spin cleaning device, whereby the spray may reattach to the surface of the semiconductor wafer. Therefore, in the conventional spin cleaning apparatus, it has been proposed to suppress the diffusion of the spray into the chamber by generating a downward airflow in the chamber, thereby suppressing the contamination from reattaching to the semiconductor wafer (see Patent Document 1).
专利文献1：日本特开2012-94659号公报Patent Document 1: Japanese Patent Laid-Open No. 2012-94659
但是，虽然利用向下气流防止了喷雾再次附着至晶片，但存在无法防止飞散的污染水被腔内壁等弹回而再次附着到晶片的问题。However, although the spray is prevented from reattaching to the wafer by the downdraft, there is a problem that the scattered contaminated water cannot be prevented from being rebounded by the chamber inner wall and the like and reattaching to the wafer.
发明内容Contents of the invention
本发明正是鉴于上述情况而完成的，其目的在于提供一种旋转清洗装置，其在旋转清洗时，能够防止清洗时的被污染的喷雾和清洗水再次附着到晶片。The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a spin cleaning device capable of preventing reattachment of contaminated spray and cleaning water during cleaning to wafers during spin cleaning.
为解决上述课题并达成目的，本发明的旋转清洗装置具有：圆盘形状的保持工作台，其保持板状物；保持工作台旋转部，其使该保持工作台以竖直方向为旋转轴线进行旋转；以及清洗水喷射构件，其朝向保持于该保持工作台的上表面的所述板状物上喷射清洗水，所述旋转清洗装置的特征在于，其具备：圆筒形状的腔，其收纳所述保持工作台，并且所述腔的上表面开口；导管，其配设于该腔的侧壁，用于从该腔内将气体排出；风扇部件，其形成为圆环形状，并在清洗时覆盖从该保持工作台的表面位置到该腔的开口部为止的围绕该保持工作台的外周空间；以及风扇部件旋转部，其使该风扇部件以竖直方向为旋转轴线进行旋转，该风扇部件利用该风扇部件旋转部进行旋转，由此在该保持工作台的上部且从该风扇部件的该圆环形状的内周部向该风扇部件的外周部产生空气流动，将清洗时的清洗水和喷雾强制排出到该风扇部件的外部并导入至该导管。In order to solve the above-mentioned problems and achieve the purpose, the rotary cleaning device of the present invention has: a disc-shaped holding table, which holds a plate-shaped object; Rotation; and a cleaning water spraying member that sprays cleaning water toward the plate-shaped object held on the upper surface of the holding table. The rotary cleaning device is characterized in that it has a cylindrical cavity that accommodates The holding table, and the upper surface of the cavity is open; the duct, which is arranged on the side wall of the cavity, is used to discharge the gas from the cavity; the fan part, which is formed in a ring shape, and is cleaned Covering the outer peripheral space around the holding table from the surface position of the holding table to the opening of the cavity; and the fan part rotating part, which makes the fan part rotate with the vertical direction as the rotation axis, the fan The parts are rotated by the fan part rotating part, thereby generating an air flow on the upper part of the holding table and from the annular inner peripheral part of the fan part to the outer peripheral part of the fan part, and the cleaning water during cleaning is and mist are forced out of the fan assembly and into the duct.
并且，在上述旋转清洗装置中，优选的是，所述风扇部件固定于所述保持工作台旋转部的外周，该保持工作台旋转部兼作为该风扇部件旋转部，该风扇部件随着该保持工作台的旋转而旋转。In addition, in the above-mentioned rotary cleaning device, it is preferable that the fan member is fixed to the outer periphery of the holding table rotating portion, and the holding table rotating portion also serves as the fan member rotating portion, and the fan member is The table rotates while rotating.
本发明的旋转清洗装置利用覆盖至开口的圆环形状的风扇部件围绕保持工作台的外周，并在清洗时进行旋转，由此强制地使晶片上表面的喷雾和清洗水排出到风扇部件的外周部并导入至导管，因此能够防止被污染的清洗水和喷雾再次附着到晶片上表面。The rotary cleaning device of the present invention surrounds the outer periphery of the holding table with a ring-shaped fan member covering the opening, and rotates during cleaning, thereby forcibly discharging the spray and cleaning water on the upper surface of the wafer to the outer periphery of the fan member. part and lead to the duct, so it is possible to prevent contaminated cleaning water and spray from adhering to the upper surface of the wafer again.
附图说明Description of drawings
图1是实施方式1的旋转清洗装置的立体图。FIG. 1 is a perspective view of a spin cleaning device according to Embodiment 1. FIG.
图2是图1所示的旋转清洗装置的竖直方向的剖视图。Fig. 2 is a vertical sectional view of the rotary cleaning device shown in Fig. 1 .
图3是实施方式2的旋转清洗装置的剖视图。FIG. 3 is a cross-sectional view of a spin washing device according to Embodiment 2. FIG.
标号说明Label description
1、70：旋转清洗装置；1. 70: Rotary cleaning device;
10：保持工作台；10: Hold the workbench;
11：保持面(上表面)；11: holding surface (upper surface);
15、71：保持工作台旋转部；15, 71: maintain the rotating part of the workbench;
16、72：保持工作台支承部；16, 72: maintain the supporting part of the workbench;
17、73：保持工作台旋转轴；17, 73: Keep the rotation axis of the workbench;
20：风扇部件；20: fan part;
21：叶片；21: blade;
25、75：风扇部件旋转部；25, 75: the rotating part of the fan part;
26：风扇部件支承部；26: Fan component support part;
27：风扇部件轴部；27: shaft part of the fan part;
30：腔；30: cavity;
33：开口部；33: opening;
34：侧壁；34: side wall;
45：导管；45: conduit;
50：清洗水喷射构件；50: cleaning water spraying components;
51：清洗水喷嘴；51: cleaning water nozzle;
60：保持工作台用马达；60: motor for maintaining the table;
61：风扇部件用马达；61: motor for fan parts;
78：马达；78: motor;
W：晶片(板状物)。W: wafer (plate-like object).
具体实施方式Detailed ways
下面，基于附图对本发明的旋转清洗装置的实施方式进行详细说明。另外，该发明不受该实施方式限定。并且，在下述实施方式的结构要素中，包括本领域技术人员能够且容易置换的结构要素、或者实质上相同的结构要素。Hereinafter, embodiments of the spin cleaning device of the present invention will be described in detail based on the drawings. In addition, this invention is not limited to this embodiment. In addition, the constituent elements of the following embodiments include constituent elements that can be easily replaced by those skilled in the art, or substantially the same constituent elements.
[实施方式1][Embodiment 1]
图1是实施方式1的旋转清洗装置的立体图。图2是图1所示的旋转清洗装置的竖直方向的剖视图。该图所示的旋转清洗装置1为在对晶片W实施规定的加工后清洗该晶片W的装置，能够配备于未图示的加工装置或者在单独的状态下使用，其中，所述晶片W是由半导体材料形成的圆形的薄的板状物。作为对晶片W实施的加工，例如可以举出：利用切削刀具的切削或激光光线照射来分割晶片W的分割加工、基于扩张的分割加工、基于激光光线照射的开孔加工、磨削加工、以及研磨加工等。FIG. 1 is a perspective view of a spin cleaning device according to Embodiment 1. FIG. Fig. 2 is a vertical sectional view of the rotary cleaning device shown in Fig. 1 . The spin cleaning device 1 shown in this figure is a device for cleaning the wafer W after performing predetermined processing on the wafer W, and can be equipped with a processing device not shown in the figure or used in a separate state. A round, thin plate of semiconducting material. Examples of processing performed on the wafer W include: cutting by a cutting tool or laser beam irradiation to divide the wafer W into division processing, division processing by expansion, drilling processing by laser beam irradiation, grinding processing, and Grinding, etc.
本实施方式1的旋转清洗装置1具备：圆盘形状的保持工作台10，其利用设于上表面的保持面11保持晶片W；保持工作台旋转部15，其使保持工作台10以竖直方向为旋转轴线进行旋转；以及清洗水喷射构件50，其朝向保持在保持工作台10的保持面11上的晶片W上喷射清洗水。并且，旋转清洗装置1具备圆筒形状的腔30，腔30收纳保持工作台10并且腔30的上表面开口，在腔30的侧壁34配设有将气体从腔30内排出的导管45。The spin cleaning device 1 according to Embodiment 1 includes: a disk-shaped holding table 10 that holds the wafer W on a holding surface 11 provided on the upper surface; and a holding table rotating unit 15 that makes the holding table 10 vertically and a cleaning water spraying member 50 that sprays cleaning water toward the wafer W held on the holding surface 11 of the holding table 10 . In addition, the spin cleaning device 1 has a cylindrical chamber 30 that accommodates and holds the table 10 and has an open upper surface.
借助保持工作台旋转部15，保持工作台10相对于腔30呈同心状地配设在腔30的内部。保持工作台10是一般公知的真空卡盘式的工作台，其在成为晶片W的保持面11的水平的上表面产生负压，使晶片W吸附保持于保持面11。并且，在保持工作台10配设有用于保持框架(省略图示)的夹紧装置12，所述框架在晶片W的加工时安装于晶片W来保持晶片W。The holding table 10 is concentrically arranged inside the chamber 30 via the holding table rotating unit 15 . The holding table 10 is a generally known vacuum chuck type table, and generates a negative pressure on the upper surface which becomes the level of the holding surface 11 of the wafer W, and sucks and holds the wafer W on the holding surface 11 . Furthermore, a clamp device 12 for holding a frame (not shown) that is attached to the wafer W and holds the wafer W during processing of the wafer W is disposed on the holding table 10 .
使保持工作台10旋转的保持工作台旋转部15具有：保持工作台支承部16，其形成为直径比保持工作台10大的圆盘形状并支承保持工作台10；保持工作台旋转轴17，其使保持工作台支承部16以竖直方向为旋转轴线进行旋转；以及保持工作台用马达60，其为保持工作台10旋转时的动力源。其中，保持工作台支承部16配设于保持工作台10的下表面侧、即保持工作台10中保持面11所在的一侧的相反侧。保持工作台10以能够与该保持工作台支承部16一体地旋转的方式与保持工作台支承部16的上表面连结。The holding table rotation part 15 that makes the holding table 10 rotate has: the holding table supporting part 16, which is formed into a disk shape with a diameter larger than the holding table 10 and supports the holding table 10; the holding table rotating shaft 17, It rotates the holding table support part 16 about the vertical direction as a rotation axis, and the holding table motor 60 is a power source when the holding table 10 rotates. Among them, the holding table support portion 16 is disposed on the lower surface side of the holding table 10 , that is, on the opposite side of the holding table 10 where the holding surface 11 is located. The holding table 10 is coupled to the upper surface of the holding table supporting portion 16 so as to be rotatable integrally with the holding table supporting portion 16 .
并且，保持工作台旋转轴17的上端与保持工作台支承部16中保持工作台10所在的一面侧的相反侧的面连结，并且保持工作台旋转轴17从保持工作台支承部16朝向竖直方向下方延伸。即，保持工作台旋转轴17以能够与保持工作台支承部16一体旋转的方式与保持工作台支承部16连结。保持工作台旋转轴17的下端侧与保持工作台用马达60的输出轴连结。由此，保持工作台10能够借助于由保持工作台用马达60产生的动力而与保持工作台旋转轴17和保持工作台支承部16一起旋转。And, the upper end of the holding table rotating shaft 17 is connected with the surface on the opposite side of the side where the holding table 10 is located in the holding table supporting part 16, and the holding table rotating shaft 17 is directed from the holding table supporting part 16 to the vertical direction. extend downwards. That is, the holding table rotating shaft 17 is coupled to the holding table supporting portion 16 so as to be rotatable integrally with the holding table supporting portion 16 . The lower end side of the table holding rotating shaft 17 is connected to the output shaft of the table holding motor 60 . Thereby, the holding table 10 can be rotated together with the holding table rotating shaft 17 and the holding table support part 16 by the power generated by the holding table motor 60 .
腔30在上端部分具有从侧壁34向筒的内侧方向沿水平方向形成的板状的上表面部31。上表面部31以与保持工作台10的直径大致相等的直径的圆形开口，在上表面部31中的该开口的部分设有朝向下方折回的折回部32。在该折回部32，面对圆筒形状的腔30的轴心的部分成为开口部33，开口部33成为腔30的开口部分，成为呈圆形开口的状态。The cavity 30 has a plate-shaped upper surface portion 31 formed in the horizontal direction from the side wall 34 toward the inner side of the cylinder at the upper end portion. The upper surface portion 31 is opened in a circular shape with a diameter substantially equal to that of the holding table 10 , and a folded portion 32 folded downward is provided in the opened portion of the upper surface portion 31 . In this folded portion 32 , a portion facing the axis of the cylindrical cavity 30 becomes an opening 33 , and the opening 33 becomes an opening of the cavity 30 and is in a circular opening state.
清洗水喷射构件50具有沿竖直方向延伸的轴部56，轴部56配设于腔30的上表面部31的表面侧，由此清洗水喷射构件50转动自如地安装于腔30。在轴部56连结有升降部55，升降部55能够相对于轴部56以竖直方向为轴向转动，并且能够相对于轴部56在竖直方向上相对移动。即，升降部55以相对于腔30在竖直方向上升降自如的方式配设于腔30的上端侧。Washing water spraying member 50 has shaft portion 56 extending vertically. Shaft portion 56 is disposed on the surface side of upper surface portion 31 of chamber 30 so that washing water spraying member 50 is rotatably attached to chamber 30 . The elevating portion 55 is connected to the shaft portion 56 , and the elevating portion 55 can rotate in the vertical direction relative to the shaft portion 56 and can relatively move in the vertical direction relative to the shaft portion 56 . That is, the lifter 55 is disposed on the upper end side of the chamber 30 so as to be able to move up and down in the vertical direction with respect to the chamber 30 .
配管部52从升降部55沿水平方向延伸，在其末端、即配管部52的与升降部55连接的一侧的端部的相反侧的端部，设置有清洗水喷嘴51。详细地讲，在通过使升降部55相对于轴部56转动而配管部52成为朝向腔30的轴心的方向时的腔30的轴心附近的位置，配管部52向下方弯折。清洗水喷嘴51以能够向下方喷射清洗水的方向安装在配管部52的弯折的部分的末端。The piping portion 52 extends horizontally from the elevating portion 55 , and a washing water nozzle 51 is provided at an end thereof, that is, at an end of the piping portion 52 opposite to the end connected to the elevating portion 55 . Specifically, the pipe portion 52 is bent downward at a position near the axis of the chamber 30 when the pipe portion 52 is oriented toward the axis of the chamber 30 by rotating the elevating portion 55 relative to the shaft portion 56 . The washing water nozzle 51 is attached to the end of the bent portion of the piping portion 52 in a direction capable of jetting washing water downward.
而且，在腔30内配置有风扇部件20和风扇部件旋转部25，所述风扇部件20形成为圆环形状并覆盖从保持工作台10的表面位置到腔30的开口部33为止的围绕保持工作台10的外周空间，所述风扇部件旋转部25使风扇部件20以竖直方向为旋转轴线进行旋转。Furthermore, a fan member 20 formed in an annular shape and covering the surrounding holding work from the surface position of the holding table 10 to the opening 33 of the chamber 30 is arranged in the cavity 30 , and a fan member rotating portion 25 . In the outer peripheral space of the table 10, the fan member rotating unit 25 rotates the fan member 20 with the vertical direction as the rotation axis.
其中，风扇部件20由在保持工作台10或保持工作台支承部16的周围配置的多个叶片21构成。该叶片21分别相对于保持工作台10和保持工作台支承部16的径向和周向双方倾斜，并形成为以沿竖直方向延伸的方向形成的板状的形状。多个叶片21都形成为相同的形状，并在保持工作台10和保持工作台支承部16的周向上彼此分离地配置在保持工作台10和保持工作台支承部16周围。并且，多个叶片21相对于保持工作台10和保持工作台支承部16的径向和周向双方的相对倾斜的方向和角度，都是相同的方向和相同的角度。Among them, the fan member 20 is constituted by a plurality of blades 21 arranged around the holding table 10 or the holding table support portion 16 . The blades 21 are inclined with respect to both the radial direction and the circumferential direction of the holding table 10 and the holding table support portion 16 , respectively, and are formed in a plate-like shape formed in a direction extending in the vertical direction. The plurality of blades 21 are all formed in the same shape, and are arranged around the holding table 10 and the holding table supporting portion 16 so as to be separated from each other in the circumferential direction of the holding table 10 and the holding table supporting portion 16 . Furthermore, the directions and angles of relative inclination of the plurality of blades 21 with respect to both the radial direction and the circumferential direction of the holding table 10 and the holding table support portion 16 are the same direction and the same angle.
风扇部件旋转部25具有：风扇部件轴部27，其使风扇部件支承部26以竖直方向为旋转轴线进行旋转；以及风扇部件用马达61，其为风扇部件20旋转时的动力源。The fan unit rotation unit 25 has a fan unit shaft unit 27 that rotates the fan unit support unit 26 about the vertical direction as a rotation axis, and a fan unit motor 61 that serves as a power source when the fan unit 20 rotates.
风扇部件支承部26配设于保持工作台支承部16的下表面侧、即保持工作台支承部16中的连结有保持工作台10的一面侧的相反侧，在风扇部件支承部26连结有构成风扇部件20的多个叶片21。The fan unit supporting portion 26 is arranged on the lower surface side of the holding table supporting portion 16, that is, on the opposite side of the side of the holding table supporting portion 16 to which the holding table 10 is connected. A plurality of blades 21 of the fan part 20 .
更详细地说，各叶片21的下端部与环形形状的风扇部件支承部26的外周端附近连结，由此，多个叶片21被配设成在以环形形状的轴心为中心的周向上排列的状态下相互分离。More specifically, the lower end of each blade 21 is connected to the vicinity of the outer peripheral end of the annular fan member support portion 26, whereby the plurality of blades 21 are arranged in a row in the circumferential direction centered on the axis of the annular shape. separated from each other.
并且，风扇部件支承部26形成为直径比开口部33的直径大，因此，叶片21从风扇部件支承部26朝向腔30的上表面部31延伸。而且，叶片21的上端位于比腔30的折回部32的下端靠上方的位置。由此，具有多个叶片21的风扇部件20包括从保持工作台10的保持面11即保持工作台10的表面位置沿竖直方向至腔30的开口部33所在的部分为止的空间在内，覆盖了在以保持工作台10的旋转轴线为中心的周向上围绕保持工作台10的外周空间，风扇部件20整体上形成为圆环形状。并且，风扇部件20的叶片21的上端位于折回部32的上方，因此，风扇部件20与支承该风扇部件20的风扇部件支承部26一起将腔30内的风扇部件20的内周侧的空间和外周侧的空间大致隔离开。Also, the fan member support portion 26 is formed to have a larger diameter than the opening portion 33 , so the blades 21 extend from the fan member support portion 26 toward the upper surface portion 31 of the chamber 30 . Furthermore, the upper end of the vane 21 is located above the lower end of the folded portion 32 of the cavity 30 . Thus, the fan unit 20 having a plurality of blades 21 includes the space from the holding surface 11 of the holding table 10, that is, the surface position of the holding table 10 to the portion where the opening 33 of the chamber 30 is located in the vertical direction, Covering the outer peripheral space surrounding the holding table 10 in the circumferential direction centered on the rotation axis of the holding table 10 , the fan member 20 is formed in a ring shape as a whole. And, the upper end of the vane 21 of the fan unit 20 is located above the folded portion 32, therefore, the fan unit 20 and the fan unit support portion 26 supporting the fan unit 20 make the space on the inner peripheral side of the fan unit 20 in the cavity 30 and The space on the outer peripheral side is roughly isolated.
设置于腔30的导管45在竖直方向上处于风扇部件20和风扇部件支承部26所在的高度，该导管45设置于腔30的侧壁34的外周面，并与腔30的内侧空间连通。该导管45延伸至对来自旋转清洗装置1的废气进行处理的处理设备(省略图示)，在导管45的中途、或者该处理设备装备有排气风扇(省略图示)，该排气风扇用于抽吸腔30内的空气而使其流入导管45。The duct 45 provided in the chamber 30 is located at the height of the fan unit 20 and the fan unit supporting portion 26 in the vertical direction, and the duct 45 is provided on the outer peripheral surface of the side wall 34 of the chamber 30 and communicates with the inner space of the chamber 30 . This duct 45 extends to the processing equipment (illustration omitted) that is processed from the exhaust gas of the rotary cleaning device 1, and in the middle of the duct 45, or the treatment equipment is equipped with an exhaust fan (illustration omitted), and the exhaust fan uses The air in the chamber 30 is sucked into the conduit 45 .
并且，风扇部件轴部27的上端与风扇部件支承部26中保持工作台10所在的一面侧的相反侧的面连结，并且风扇部件轴部27从风扇部件支承部26朝向竖直方向下方延伸。在所述风扇部件支承部26和风扇部件轴部27，在轴心附近形成有贯穿插入孔28，该贯穿插入孔28为以比保持工作台旋转轴17的直径大的直径沿竖直方向开设的孔。即，风扇部件轴部27形成为圆筒形状，其上端与风扇部件支承部26连结。从保持工作台支承部16朝向下方形成的保持工作台旋转轴17被插入于贯穿插入孔28中并沿竖直方向延伸。In addition, the upper end of the fan member shaft portion 27 is connected to the surface of the fan member support portion 26 opposite to the side where the table 10 is held, and the fan member shaft portion 27 extends vertically downward from the fan member support portion 26 . In the fan unit supporting portion 26 and the fan unit shaft portion 27, a through insertion hole 28 is formed in the vicinity of the shaft center, and the through insertion hole 28 is opened in the vertical direction with a diameter larger than the diameter of the holding table rotating shaft 17. hole. That is, the fan member shaft portion 27 is formed in a cylindrical shape, and the upper end thereof is connected to the fan member support portion 26 . The holding table rotation shaft 17 formed downward from the holding table support portion 16 is inserted into the insertion hole 28 and extends in the vertical direction.
支承风扇部件20的风扇部件支承部26借助由风扇部件用马达61产生的动力而旋转，由此能够使风扇部件20一体旋转。详细地讲，在风扇部件用马达61的输出轴连结有用于动力传递的风扇部件用驱动侧带轮62，风扇部件用马达61被设置成在风扇部件用马达61的驱动时，能够与风扇部件用马达61的输出轴一体地旋转。The fan unit support portion 26 supporting the fan unit 20 is rotated by the power generated by the fan unit motor 61 , whereby the fan unit 20 can be integrally rotated. In detail, the output shaft of the motor 61 for the fan unit is connected with the driving side pulley 62 for the fan unit for power transmission, and the motor 61 for the fan unit is arranged so that it can be connected with the fan unit when the motor 61 for the fan unit is driven. The output shaft of the motor 61 is integrally rotated.
并且，在风扇部件轴部27的下端连结有与风扇部件轴部27一体地旋转的风扇部件用从动侧带轮63。与风扇部件轴部27同样地，风扇部件用从动侧带轮63在轴心的中心附近以比保持工作台旋转轴17的直径大的直径沿竖直方向开设有孔，保持工作台旋转轴17还通过该孔而沿竖直方向延伸。Further, a fan member driven side pulley 63 that rotates integrally with the fan member shaft portion 27 is coupled to the lower end of the fan member shaft portion 27 . Like the fan member shaft portion 27, the driven side pulley 63 for the fan member has a hole in the vertical direction near the center of the axis with a diameter larger than the diameter of the holding table rotating shaft 17, and holds the table rotating shaft. 17 also extends vertically through the hole.
在所述风扇部件用驱动侧带轮62和风扇部件用从动侧带轮63缠绕有用于双方的带轮之间的动力传递的带65，由风扇部件用马达61产生的动力能够经由风扇部件用驱动侧带轮62、带65、风扇部件用从动侧带轮63传递至风扇部件轴部27。风扇部件支承部26能够借助由风扇部件用马达61产生并传递至风扇部件轴部27的动力，而与风扇部件20一体地旋转。The driving side pulley 62 for the fan unit and the driven side pulley 63 for the fan unit are wound with a belt 65 for power transmission between both pulleys, and the power generated by the motor 61 for the fan unit can pass through the fan unit. The driving side pulley 62 , the belt 65 , and the fan member driven side pulley 63 are transmitted to the fan member shaft portion 27 . The fan member support portion 26 can rotate integrally with the fan member 20 by the power generated by the fan member motor 61 and transmitted to the fan member shaft portion 27 .
并且，在腔30的内侧设置有隔壁部40，隔壁部40将配设有保持工作台10的一侧的空间和配设有保持工作台用马达60及风扇部件用马达61的一侧的空间分隔开。Also, a partition wall portion 40 is provided inside the cavity 30, and the partition wall portion 40 divides the space on the side where the table 10 is held and the space on the side where the motor 60 for holding the table and the motor 61 for the fan unit are arranged. separated.
隔壁部40形成为环形形状，其位于风扇部件支承部26的保持工作台支承部16所在的一侧的相反侧，隔壁部40的外周部分与腔30的侧壁34的内周面连结。Partition wall portion 40 is formed in an annular shape on the opposite side of fan unit support portion 26 where table support portion 16 is held, and the outer peripheral portion of partition wall portion 40 is connected to the inner peripheral surface of side wall 34 of cavity 30 .
在隔壁部40设置有孔部41，孔部41在腔30的轴心附近具有以比风扇部件轴部27的直径大的直径沿竖直方向开设的孔。孔部41形成为圆筒形状，从而在内侧具有孔，风扇部件轴部27通过孔部41的内侧的孔沿竖直方向延伸。并且，孔部41从隔壁部40向竖直方向上方突出，孔部41的上端位于风扇部件支承部26的附近下方。即，孔部41以覆盖风扇部件轴部27的周围的方式从隔壁部40设置到风扇部件支承部26的附近。The partition wall portion 40 is provided with a hole portion 41 having a vertically opened hole with a diameter larger than that of the fan member shaft portion 27 in the vicinity of the axis of the cavity 30 . The hole portion 41 is formed in a cylindrical shape so as to have a hole inside, and the fan member shaft portion 27 extends in the vertical direction through the hole inside the hole portion 41 . Further, the hole portion 41 protrudes vertically upward from the partition wall portion 40 , and the upper end of the hole portion 41 is positioned below the vicinity of the fan member support portion 26 . That is, the hole portion 41 is provided from the partition wall portion 40 to the vicinity of the fan member support portion 26 so as to cover the periphery of the fan member shaft portion 27 .
在隔壁部40的配设有保持工作台用马达60和风扇部件用马达61的空间侧的面，设置有轴承支承部件42。轴承支承部件42被设置成从隔壁部40朝向风扇部件轴部27的方向，轴承支承部件42在风扇部件轴部27侧的端部支承风扇部件旋转部轴承68。风扇部件旋转部轴承68是将风扇部件轴部27支承成能够旋转的轴承，轴承支承部件42支承该风扇部件轴部27用的轴承即风扇部件旋转部轴承68。A bearing support member 42 is provided on the surface of the partition wall portion 40 on the side of the space where the table holding motor 60 and the fan unit motor 61 are arranged. The bearing support member 42 is provided in a direction from the partition wall portion 40 toward the fan member shaft portion 27 , and the bearing support member 42 supports the fan member rotating portion bearing 68 at the end portion on the fan member shaft portion 27 side. The fan unit rotating portion bearing 68 is a bearing that rotatably supports the fan unit shaft portion 27 , and the bearing support member 42 supports the fan unit rotating portion bearing 68 as a bearing for supporting the fan unit shaft portion 27 .
而且，在该隔壁部40和风扇部件支承部26形成有用于将清洗水的一部分排出的排水孔。具体地说，在风扇部件支承部26中，在风扇部件支承部26的外周附近、即连结有叶片21的部分附近，形成有沿竖直方向贯通该风扇部件支承部26的孔，利用该孔形成排水孔29。并且，在隔壁部40中，在隔壁部40的外周附近形成有沿竖直方向贯通该隔壁部40的孔，并利用该孔形成排水孔43。In addition, drain holes for draining a part of the washing water are formed in the partition wall portion 40 and the fan member support portion 26 . Specifically, in the fan member support portion 26, a hole penetrating the fan member support portion 26 in the vertical direction is formed near the outer periphery of the fan member support portion 26, that is, near the portion to which the blades 21 are connected. Drain holes 29 are formed. Further, in the partition wall portion 40 , a hole penetrating the partition wall portion 40 in the vertical direction is formed in the vicinity of the outer periphery of the partition wall portion 40 , and the drain hole 43 is formed by this hole.
该实施方式1的旋转清洗装置1如上那样构成，下面，对其作用进行说明。在利用旋转清洗装置1进行晶片W的清洗时，使清洗水喷射构件50以轴部56为中心转动，使清洗水喷射构件50移动至相对于开口部33在竖直方向上不重叠的位置即退避位置。此时，通过使升降部55上升，从而在使清洗水喷射构件50整体向上方移动而使得清洗水喷嘴51位于比腔30的上表面部31靠上方的位置的状态下，使清洗水喷射构件50移动至退避位置。The spin cleaning device 1 according to Embodiment 1 is configured as described above, and its operation will be described below. When the wafer W is cleaned by the spin cleaning device 1, the cleaning water spraying member 50 is rotated around the shaft portion 56, and the cleaning water spraying member 50 is moved to a position where it does not overlap the opening 33 in the vertical direction. Retreat position. At this time, by raising the lifting portion 55, the entire washing water spraying member 50 is moved upward so that the washing water nozzle 51 is located above the upper surface portion 31 of the chamber 30, and the washing water spraying member 50 moved to retreat position.
接下来，进行加工并将清洗前的晶片W从开口部33放入腔30内，并载置于保持工作台10的保持面11上。保持工作台10通过使晶片W和保持面11之间为负压来吸附晶片W，并且，利用夹紧装置12保持对晶片W进行保持的框架，由此将晶片W保持在保持面11上。而且，使抽吸腔30内的空气的排气风扇动作而经由导管45将腔30内的空气排出到外部，由此进行清洗的准备。Next, the processed and unwashed wafer W is put into the chamber 30 through the opening 33 and placed on the holding surface 11 of the holding table 10 . The holding table 10 sucks the wafer W by applying a negative pressure between the wafer W and the holding surface 11 , and holds the wafer W on the holding surface 11 by holding the frame holding the wafer W by the clamp device 12 . Then, the air in the chamber 30 is exhausted to the outside through the duct 45 by operating the exhaust fan that sucks the air in the chamber 30 , thereby preparing for cleaning.
在该状态下，通过使保持工作台用马达60动作，使保持工作台10与保持工作台旋转轴17及保持工作台支承部16一体地旋转，使保持工作台10例如以大约800rpm的旋转速度旋转。并且，也使风扇部件用马达61动作，将由风扇部件用马达61产生的动力经由带65传递至风扇部件轴部27，使风扇部件20与风扇部件轴部27及风扇部件支承部26一体地旋转。关于此时的旋转方向，向利用倾斜的叶片21的旋转而产生从风扇部件20的内侧朝向外侧的气流的方向，以旋转轴线为中心旋转。In this state, by actuating the motor 60 for holding the table, the holding table 10 is rotated integrally with the holding table rotating shaft 17 and the holding table supporting part 16, and the holding table 10 is rotated at a rotational speed of about 800 rpm, for example. rotate. Also, the fan unit motor 61 is operated, and the power generated by the fan unit motor 61 is transmitted to the fan unit shaft portion 27 via the belt 65, so that the fan unit 20 is integrally rotated with the fan unit shaft portion 27 and the fan unit support portion 26. . The rotation direction at this time is a direction in which an air flow from the inside to the outside of the fan member 20 is generated by the rotation of the inclined blades 21 , and rotates around the rotation axis.
由此，构成风扇部件20的各叶片21产生从风扇部件20的形状即圆环形状的内侧向外侧方向流动的气流，使保持工作台10的上部的空气向风扇部件20的圆环形状的外侧流动。这样，风扇部件20利用风扇部件旋转部25进行旋转，由此在保持工作台10的上部、且从风扇部件20的圆环形状内周部36向风扇部件20的外周部37产生空气流动。Thus, each blade 21 constituting the fan member 20 generates an airflow flowing from the inside of the shape of the fan member 20, that is, the annular shape to the outer side, so that the air holding the upper part of the table 10 is directed to the outer side of the annular shape of the fan member 20. flow. Thus, the fan unit 20 is rotated by the fan unit rotation unit 25 , thereby generating an air flow on the upper portion of the holding table 10 and from the annular inner peripheral portion 36 of the fan unit 20 to the outer peripheral portion 37 of the fan unit 20 .
通过使保持工作台10和风扇部件20旋转而完成清洗晶片W的准备后，使清洗水喷射构件50以轴部56为中心转动，由此使清洗水喷嘴51位于由保持工作台10保持的晶片W的上方。进而，通过使升降部55下降，使清洗水喷嘴51靠近晶片W。After preparations for cleaning the wafer W by rotating the holding table 10 and the fan unit 20 are completed, the cleaning water injection member 50 is rotated about the shaft portion 56 so that the cleaning water nozzle 51 is positioned on the wafer held by the holding table 10. above the W. Furthermore, the washing water nozzle 51 is brought closer to the wafer W by lowering the raising and lowering unit 55 .
在该状态下，通过从清洗水喷嘴51向下方喷出清洗水，从而朝向晶片W喷出清洗水。此时，在清洗水喷嘴51位于晶片W的上方的范围内，使清洗水喷射构件50一边以轴部56为中心转动一边喷出清洗水。由于在喷出清洗水时，保持工作台10仍继续旋转，因此清洗水被供给到晶片W的整个上表面，切屑和磨削屑等附着于晶片W的污物成分被清洗水冲走。In this state, the rinse water is sprayed toward the wafer W by spraying the rinse water downward from the rinse water nozzle 51 . At this time, in the range where the cleaning water nozzle 51 is located above the wafer W, the cleaning water spraying member 50 is rotated around the shaft portion 56 to spray the cleaning water. Since the holding table 10 continues to rotate while the cleaning water is sprayed, the cleaning water is supplied to the entire upper surface of the wafer W, and dirt components such as chips and grinding chips adhering to the wafer W are washed away by the cleaning water.
在晶片W的清洗时，像这样利用清洗水冲走晶片W的污物成分，因此，在腔30内虽然会产生被该污物成分污染的清洗水和喷雾，但这些清洗水和喷雾被旋转的风扇部件20所产生的气流从晶片W的上方除去。即，被污染的清洗水和喷雾从保持工作台10的上方被排出到风扇部件20的圆环形状的外侧。When cleaning the wafer W, the contamination components of the wafer W are washed away with the cleaning water in this way. Therefore, although the cleaning water and the spray contaminated by the contamination components are generated in the chamber 30, these cleaning water and the spray are rotated. The air flow generated by the fan unit 20 is removed from above the wafer W. That is, the contaminated washing water and spray are discharged from above the holding table 10 to the outside of the ring shape of the fan member 20 .
利用抽吸腔30内的空气的排气风扇，使被排出到风扇部件20的外侧的清洗水和喷雾与空气一起穿过腔30向导管45流动，从而从腔30内排出。即，风扇部件20进行旋转而使保持工作台10的上部的空气从风扇部件20的圆环形状内周部36向风扇部件20的外周部37流动，由此将清洗晶片W时的清洗水和喷雾强制排出到风扇部件20的外部，并导入至导管45。换言之，风扇部件20对位于风扇部件20的外周部37侧的空间的空气施加压缩力，排气风扇抽吸该空气，因此，被排出到风扇部件20的外周部37侧的清洗水和喷雾借助于该压缩力和抽吸力，而与位于风扇部件20的外周部37侧的空间的空气一起在腔30内流动并从导管45排出。The washing water and the mist discharged to the outside of the fan unit 20 flow together with the air through the chamber 30 to the duct 45 by the exhaust fan that sucks the air in the chamber 30 to be discharged from the chamber 30 . That is, the fan member 20 rotates to make the air holding the upper part of the table 10 flow from the annular inner peripheral portion 36 of the fan member 20 to the outer peripheral portion 37 of the fan member 20, whereby the washing water and the wafer W are cleaned. The mist is forcibly discharged to the outside of the fan unit 20 and introduced into the duct 45 . In other words, the fan member 20 applies a compressive force to the air in the space on the outer peripheral portion 37 side of the fan member 20, and the exhaust fan sucks the air, so the washing water and spray discharged to the outer peripheral portion 37 side of the fan member 20 are Due to the compressive force and the suction force, the air flows in the cavity 30 together with the air in the space on the outer peripheral portion 37 side of the fan member 20 and is discharged from the duct 45 .
经过规定的清洗时间后，来自清洗水喷射构件50的清洗水的喷射停止，但保持工作台10继续旋转，利用离心力将附着于晶片W的清洗水甩掉。此时，使保持工作台10的旋转速度上升至大约3000rpm来增大离心力，迅速甩掉清洗水以使清洗后的晶片W干燥。After a predetermined cleaning time elapses, the spraying of the cleaning water from the cleaning water spraying member 50 is stopped, but the table 10 is kept rotating to shake off the cleaning water adhering to the wafer W by centrifugal force. At this time, the rotational speed of the holding table 10 is raised to about 3000 rpm to increase the centrifugal force, and the rinse water is quickly shaken off to dry the wafer W after washing.
并且，在该干燥过程中，风扇部件20也继续旋转，但与保持工作台10不同，风扇部件20不使旋转速度上升，而是维持与清洗时的旋转速度相同的旋转速度继续旋转。由此，风扇部件20产生与清洗时同样的气流，将被晶片W的离心力甩掉的清洗水排出到风扇部件20的外部。Also, during this drying process, the fan unit 20 continues to rotate, but unlike the holding table 10, the fan unit 20 does not increase the rotation speed, but continues to rotate at the same rotation speed as that during washing. Thus, the fan unit 20 generates the same air flow as that during washing, and discharges the washing water thrown off by the centrifugal force of the wafer W to the outside of the fan unit 20 .
并且，在干燥过程中，抽吸腔30内的空气的排气风扇也继续运转，因此被排出到风扇部件20的外部的清洗水通过腔30内被导入至导管45。由此，从风扇部件20吹飞的清洗水不会返回晶片W侧而从导管45排出，从而晶片W得以干燥。Also, during the drying process, the exhaust fan that sucks the air in the chamber 30 continues to operate, so the washing water discharged to the outside of the fan unit 20 is introduced into the duct 45 through the chamber 30 . Accordingly, the washing water blown off from the fan unit 20 is discharged from the duct 45 without returning to the wafer W side, and the wafer W is dried.
并且，被污染的清洗水中，没有被风扇部件20排出到外周部37侧的清洗水流到位于保持工作台10和保持工作台旋转部15下方的风扇部件支承部26上。流到风扇部件支承部26上的清洗水被从排水孔29排出，并流向隔壁部40侧。流动到隔壁部40侧的清洗水中的一部分借助由风扇部件20和排气风扇产生的空气的流动而朝向导管45流动，并从导管45排出。并且，未从导管45排出而残留在隔壁部40上的清洗水从隔壁部40的排水孔43排出。In addition, the contaminated washing water that is not discharged to the outer peripheral portion 37 side by the fan unit 20 flows to the fan unit supporting portion 26 located below the holding table 10 and the holding table rotating portion 15 . The washing water that has flowed onto the fan unit support portion 26 is drained from the drain hole 29 and flows toward the partition wall portion 40 side. Part of the washing water flowing to the partition wall portion 40 side flows toward the duct 45 due to the flow of air generated by the fan member 20 and the exhaust fan, and is discharged from the duct 45 . Furthermore, the washing water remaining on the partition wall portion 40 without being discharged from the conduit 45 is discharged from the drain hole 43 of the partition wall portion 40 .
经过规定的干燥时间后，停止保持工作台10和风扇部件20的旋转，清洗水喷射构件50返回到退避位置。然后，解除保持工作台10对晶片W的保持，将晶片W从保持工作台10取上来并移向下一工序。After a predetermined drying time has elapsed, the rotation of the holding table 10 and the fan unit 20 is stopped, and the washing water spraying member 50 returns to the withdrawn position. Then, the holding of the wafer W by the holding table 10 is released, and the wafer W is taken up from the holding table 10 and moved to the next step.
以上的实施方式1的旋转清洗装置1设置了风扇部件20，所述风扇部件20形成为圆环形状并利用沿圆周方向排列的多个叶片21覆盖围绕保持工作台10的外周空间，利用风扇部件旋转部25使风扇部件20旋转，由此能够在保持工作台10的上部从风扇部件20的圆环形状内周部36侧向外周部37产生空气流动。由此，能够从晶片W的上方强制排出清洗时的清洗水和喷雾，并导入至导管45。其结果为，在旋转清洗中，能够防止清洗时被污染的喷雾和清洗水再次附着到晶片W。The above rotary cleaning device 1 of Embodiment 1 is provided with a fan member 20 which is formed in an annular shape and covers the outer peripheral space around the holding table 10 with a plurality of blades 21 arranged in the circumferential direction. The rotating portion 25 rotates the fan member 20 , thereby generating airflow from the annular inner peripheral portion 36 side of the fan member 20 to the outer peripheral portion 37 at the upper portion of the holding table 10 . Accordingly, the washing water and the mist during washing can be forcibly discharged from above the wafer W and introduced into the duct 45 . As a result, during the spin cleaning, the spray and cleaning water contaminated during cleaning can be prevented from adhering to the wafer W again.
并且，能够使风扇部件20与保持工作台10独立地旋转，因此在晶片W的清洗时和干燥时，能够使保持工作台10和风扇部件20分别以与所需相应的适当的转速旋转。例如，在晶片W的清洗过程中，即使在使保持工作台10的旋转速度阶段性地变化的情况下，也能够使风扇部件20的旋转速度恒定，从而能够使由风扇部件20产生的向外侧方向的抽吸力恒定。其结果为，能够防止清洗时被污染的喷雾和清洗水再次附着到晶片W，并且能够提高晶片W的清洗性能和干燥性能。Furthermore, since the fan unit 20 and the holding table 10 can be rotated independently, the holding table 10 and the fan unit 20 can be rotated at appropriate rotation speeds as required during cleaning and drying of the wafer W. For example, even when the rotational speed of the holding table 10 is changed stepwise during the cleaning process of the wafer W, the rotational speed of the fan member 20 can be kept constant, so that the outward movement generated by the fan member 20 can be suppressed. The suction force in the direction is constant. As a result, it is possible to prevent the spray and cleaning water contaminated during cleaning from adhering to the wafer W again, and to improve the cleaning performance and drying performance of the wafer W.
[实施方式2][Embodiment 2]
实施方式2的旋转清洗装置70是与实施方式1的旋转清洗装置1大致相同的结构，但在保持工作台兼作为风扇部件旋转部这一点上具有特征。其他结构与实施方式1相同，因此省略其说明并标以相同的标号。The spin cleaning device 70 of Embodiment 2 has substantially the same configuration as the spin cleaning device 1 of Embodiment 1, but is characterized in that the holding table also serves as a fan member rotating unit. The other configurations are the same as those in Embodiment 1, so descriptions thereof are omitted and the same reference numerals are used.
图3是实施方式2的旋转清洗装置的剖视图。与实施方式1的旋转清洗装置1同样地，本实施方式2的旋转清洗装置70具备：保持工作台10，其保持晶片W；保持工作台旋转部71，其使保持工作台10旋转；以及清洗水喷射构件50，其朝向晶片W上喷射清洗水，旋转清洗装置70还具备腔30，腔30收纳保持工作台10并在侧壁34配设有导管45。其中，保持工作台旋转部71具有：保持工作台支承部72，其支承保持工作台10；保持工作台旋转轴73，其使保持工作台支承部72以竖直方向为旋转轴线进行旋转；以及马达78，其为保持工作台10旋转时的动力源。FIG. 3 is a cross-sectional view of a spin washing device according to Embodiment 2. FIG. Similar to the spin cleaning device 1 of Embodiment 1, the spin cleaning device 70 of Embodiment 2 includes: a holding table 10 that holds a wafer W; a holding table rotating unit 71 that rotates the holding table 10; The water spraying member 50 sprays cleaning water toward the wafer W, and the spin cleaning device 70 further includes a chamber 30 that accommodates the holding table 10 and has a duct 45 disposed on the side wall 34 . Wherein, the holding table rotation part 71 has: holding table supporting part 72, which supports and holds working table 10; holding table rotating shaft 73, which makes holding table supporting part 72 rotate with the vertical direction as the axis of rotation; and The motor 78 is a power source for keeping the table 10 rotating.
并且，与实施方式1的旋转清洗装置1同样地，本实施方式2的旋转清洗装置70具备由在保持工作台10的周围配置的多个叶片21构成的风扇部件20。该风扇部件20与实施方式1的旋转清洗装置1不同，该风扇部件20连结并支承于保持工作台旋转部71所具有的保持工作台支承部72。即，风扇部件20固定于保持工作台支承部72的外周，保持工作台旋转部71兼用作使风扇部件20以竖直方向为旋转轴线进行旋转的风扇部件旋转部75。因此，风扇部件20随着保持工作台10的旋转而旋转。详细地讲，对于构成风扇部件20的多个叶片21，各叶片21的下端部与保持工作台支承部72中连结有保持工作台10的面即上表面连结。Further, like the spin cleaning device 1 of the first embodiment, the spin cleaning device 70 of the second embodiment includes a fan member 20 composed of a plurality of blades 21 arranged around the holding table 10 . This fan member 20 is different from the rotary cleaning device 1 of Embodiment 1 in that the fan member 20 is connected to and supported by the holding table support portion 72 included in the holding table rotating portion 71 . That is, the fan member 20 is fixed to the outer periphery of the holding table support portion 72 , and the holding table rotating portion 71 also serves as a fan member rotating portion 75 that rotates the fan member 20 about the vertical direction as a rotation axis. Therefore, the fan unit 20 rotates with the rotation of the holding table 10 . Specifically, for the plurality of blades 21 constituting the fan unit 20 , the lower end portion of each blade 21 is connected to the upper surface of the holding table support portion 72 , which is the surface to which the holding table 10 is connected.
并且，保持工作台支承部72形成为直径比腔30的开口部33的直径大，因此，叶片21从保持工作台支承部72朝向腔30的上表面部31延伸。而且，叶片21的上端位于比腔30的折回部32的下端靠上方的位置。由此，具有多个叶片21的风扇部件20包括从保持工作台10的保持面11即保持工作台10的表面位置沿竖直方向至腔30的开口部33所在的部分为止的空间在内，覆盖了在以保持工作台10的旋转轴线为中心的周向上围绕保持工作台10的外周空间，风扇部件20整体上形成为圆环形状。Furthermore, since the holding table support portion 72 is formed to have a larger diameter than the opening portion 33 of the cavity 30 , the blades 21 extend from the holding table support portion 72 toward the upper surface portion 31 of the cavity 30 . Furthermore, the upper end of the vane 21 is located above the lower end of the folded portion 32 of the cavity 30 . Thus, the fan unit 20 having a plurality of blades 21 includes the space from the holding surface 11 of the holding table 10, that is, the surface position of the holding table 10 to the portion where the opening 33 of the chamber 30 is located in the vertical direction, Covering the outer peripheral space surrounding the holding table 10 in the circumferential direction centered on the rotation axis of the holding table 10 , the fan member 20 is formed in a ring shape as a whole.
并且，风扇部件20的叶片21的上端位于比折回部32的下端靠上方的位置，因此，风扇部件20与支承该风扇部件20的保持工作台支承部72一起将腔30内的风扇部件20的内周侧的空间和外周侧的空间大致隔离开。And, the upper end of the blade 21 of the fan unit 20 is positioned above the lower end of the folded portion 32. Therefore, the fan unit 20 holds the fan unit 20 in the cavity 30 together with the holding table support portion 72 supporting the fan unit 20. The space on the inner peripheral side is substantially separated from the space on the outer peripheral side.
该实施方式2的旋转清洗装置70如上那样构成，下面，对其作用进行说明。在利用旋转清洗装置70进行晶片W的清洗时，在利用保持工作台10的保持面11保持清洗前的晶片W的状态下，使抽吸腔30内的空气的排气风扇动作而经由导管45将腔30内的空气排出到外部，由此进行清洗的准备。The spin cleaning device 70 according to Embodiment 2 is configured as above, and its operation will be described below. When the wafer W is cleaned by the spin cleaning device 70 , the wafer W before cleaning is held on the holding surface 11 of the holding table 10 , and the exhaust fan that sucks the air in the chamber 30 is operated to blow the air through the duct 45 . The air in the chamber 30 is exhausted to the outside, thereby preparing for cleaning.
在该状态下，通过使马达78动作，使保持工作台10与保持工作台旋转轴73及保持工作台支承部72一体地旋转，使保持工作台10例如以大约800rpm的旋转速度旋转。并且，通过保持工作台支承部72这样旋转，风扇部件20也旋转。即，风扇部件20与保持工作台10一体地旋转。在保持工作台10旋转时，风扇部件20也与保持工作台10一起旋转，由此风扇部件20在保持工作台10的上部且从风扇部件20的圆环形状内周部36向风扇部件20的外周部37产生空气流动。In this state, by operating the motor 78, the holding table 10 is rotated integrally with the holding table rotating shaft 73 and the holding table supporting portion 72, and the holding table 10 is rotated at a rotation speed of, for example, about 800 rpm. And, by holding the table support portion 72 to rotate in this way, the fan member 20 also rotates. That is, the fan unit 20 rotates integrally with the holding table 10 . When the holding table 10 rotates, the fan assembly 20 also rotates together with the holding table 10, so that the fan assembly 20 is on the top of the holding table 10 and from the annular shape inner peripheral portion 36 of the fan assembly 20 to the fan assembly 20. The outer peripheral portion 37 generates air flow.
在通过使保持工作台10和风扇部件20旋转而完成清洗晶片W的准备后，使清洗水喷射构件50动作，使清洗水喷嘴51位于晶片W的上方且靠近晶片W。在该状态下，一边使清洗水喷射构件50转动，一边从清洗水喷嘴51朝向晶片W喷出清洗水，由此利用清洗水冲洗附着于晶片W的切屑和磨削屑等污物成分。After preparations for cleaning the wafer W are completed by rotating the holding table 10 and the fan unit 20 , the cleaning water injection member 50 is operated so that the cleaning water nozzle 51 is located above the wafer W and close to the wafer W. In this state, cleaning water spraying member 50 is rotated to spray cleaning water from cleaning water nozzle 51 toward wafer W, thereby rinsing away dirt components such as swarf and grinding shavings adhering to wafer W with the cleaning water.
清洗晶片W时的被污染的清洗水和喷雾借助于旋转的风扇部件20所产生的气流而从保持工作台10的上方排出到风扇部件20的圆环形状的外侧，从而被从晶片W的上方除去。利用抽吸腔30内的空气的排气风扇，使被排出到风扇部件20外侧的清洗水和喷雾与空气一起通过腔30而流向导管45，从而从腔30内排出。Contaminated cleaning water and spray when cleaning the wafer W are discharged from the top of the holding table 10 to the outside of the ring shape of the fan part 20 by the airflow generated by the rotating fan part 20, thereby being discharged from above the wafer W. remove. The washing water and the mist discharged to the outside of the fan unit 20 together with the air pass through the chamber 30 to the duct 45 by the exhaust fan that sucks the air in the chamber 30 to be discharged from the chamber 30 .
经过规定的清洗时间后，来自清洗水喷射构件50的清洗水的喷射停止，通过使保持工作台10的旋转速度上升来增大离心力，迅速甩掉清洗水以使晶片W干燥。在该情况下，与保持工作台支承部72连结的风扇部件20的旋转速度也上升，因此由风扇部件20产生的气流也变得比清洗时强。由此，借助晶片W的离心力甩掉的清洗水被该变强的气流猛烈地排出到风扇部件20的外部。After a predetermined cleaning time elapses, the spraying of the cleaning water from the cleaning water spraying member 50 is stopped, and the centrifugal force is increased by increasing the rotation speed of the holding table 10, and the cleaning water is quickly thrown off to dry the wafer W. In this case, the rotation speed of the fan member 20 connected to the holding table support portion 72 also increases, so the airflow generated by the fan member 20 also becomes stronger than that during cleaning. As a result, the washing water thrown off by the centrifugal force of the wafer W is violently discharged to the outside of the fan unit 20 by the strengthened air flow.
被排出到风扇部件20的外部的清洗水从导管45排出，从风扇部件20吹飞的清洗水不会返回晶片W侧，因此晶片W得以干燥。经过规定的干燥时间后，停止保持工作台10和风扇部件20的旋转，清洗水喷射构件50回到退避位置，将晶片W从保持工作台10取上来并移向下一工序。The washing water discharged to the outside of the fan unit 20 is discharged from the duct 45, and the washing water blown off from the fan unit 20 does not return to the wafer W side, so the wafer W is dried. After a predetermined drying time has elapsed, the rotation of the holding table 10 and the fan unit 20 is stopped, the cleaning water spraying member 50 returns to the retreat position, and the wafer W is lifted from the holding table 10 and moved to the next step.
在以上的实施方式2的旋转清洗装置70中，风扇部件20固定于保持工作台旋转部71，保持工作台旋转部71兼用作风扇部件旋转部75，因此不用新设置用于将风扇部件20支承成能够旋转的部件或机构，就能够使风扇部件20旋转。由此，能够在不使结构复杂化的情况下，设置用于产生从晶片W的上方向外侧方向的气流的风扇部件20。其结果为，能够抑制防止被污染的喷雾和清洗水再次附着到晶片时的制造成本。In the rotary cleaning device 70 according to Embodiment 2 above, the fan member 20 is fixed to the holding table rotating part 71, and the holding table rotating part 71 also serves as the fan member rotating part 75, so there is no need to newly install the fan member 20 for supporting it. By forming a rotatable member or mechanism, the fan unit 20 can be rotated. Accordingly, the fan member 20 for generating an air flow from above the wafer W toward the outside can be provided without complicating the structure. As a result, it is possible to suppress the manufacturing cost for preventing the contaminated spray and cleaning water from reattaching to the wafer.
[变形例][modified example]
另外，在实施方式1的旋转清洗装置1中，在清洗了晶片W后的干燥时，保持工作台10的旋转速度比清洗时的旋转速度高，相对于此，以使风扇部件20的旋转速度为与清洗时的旋转速度相同的旋转速度的方式进行旋转，但在干燥时也可以使风扇部件20的旋转速度变化。例如，在干燥时，也可以使风扇部件20的旋转速度与保持工作台10的旋转速度大致相等，或者使风扇部件20的旋转速度比保持工作台10的旋转速度高。In addition, in the spin cleaning apparatus 1 according to Embodiment 1, when drying after cleaning the wafer W, the rotation speed of the holding table 10 is higher than the rotation speed during cleaning. The rotation speed of the fan member 20 may be changed at the time of drying, although the rotation speed is the same as the rotation speed at the time of washing. For example, during drying, the rotation speed of the fan member 20 may be substantially equal to the rotation speed of the holding table 10 , or the rotation speed of the fan member 20 may be higher than that of the holding table 10 .
并且，在实施方式1的旋转清洗装置1中，能够使风扇部件20的旋转速度相对于保持工作台10的旋转速度独立地变化，因此在晶片W的清洗时和干燥时，也可以与保持工作台10的旋转速度无关地，根据需要而使风扇部件20的旋转速度变化。并且，风扇部件20的旋转方向可以是相对于保持工作台10的旋转方向相同的方向以外的方向，也可以向相反方向旋转。风扇部件20根据晶片W的尺寸和清洗时的温度等设定旋转速度和旋转方向，由此能够从保持工作台10的上方更适当地排出被污染的清洗水和喷雾。In addition, in the spin cleaning apparatus 1 according to Embodiment 1, since the rotation speed of the fan member 20 can be changed independently of the rotation speed of the holding table 10, it is also possible to operate in conjunction with the holding operation during cleaning and drying of the wafer W. Regardless of the rotational speed of the stage 10, the rotational speed of the fan unit 20 is changed as necessary. Moreover, the rotation direction of the fan member 20 may be a direction other than the same direction with respect to the rotation direction of the holding table 10, and may rotate in the opposite direction. The rotation speed and rotation direction of the fan unit 20 are set according to the size of the wafer W, the temperature during cleaning, etc., so that the contaminated cleaning water and spray can be more properly discharged from above the holding table 10 .
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| JP7007141B2 (en) * | 2017-09-26 | 2022-01-24 | 芝浦メカトロニクス株式会社 | Board processing equipment |
| CN110076126A (en) * | 2019-05-30 | 2019-08-02 | 南京赛达机械制造有限公司 | A kind of aviation cleaning parts drying box |
| JP7333749B2 (en) * | 2019-12-13 | 2023-08-25 | 株式会社ディスコ | How to measure suction power |
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| Publication number | Publication date |
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| TWI664029B (en) | 2019-07-01 |
| KR20150010630A (en) | 2015-01-28 |
| TW201505727A (en) | 2015-02-16 |
| JP2015023138A (en) | 2015-02-02 |
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