CN103379738A - Method for processing surface of printed circuit board - Google Patents
Method for processing surface of printed circuit board Download PDFInfo
- Publication number
- CN103379738A CN103379738A CN2012101215675A CN201210121567A CN103379738A CN 103379738 A CN103379738 A CN 103379738A CN 2012101215675 A CN2012101215675 A CN 2012101215675A CN 201210121567 A CN201210121567 A CN 201210121567A CN 103379738 A CN103379738 A CN 103379738A
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- China
- Prior art keywords
- circuit board
- printed circuit
- pcb
- surface treatment
- treatment method
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- 238000000034 method Methods 0.000 title claims abstract description 29
- 239000010949 copper Substances 0.000 claims abstract description 20
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 19
- 229910052802 copper Inorganic materials 0.000 claims abstract description 19
- 229920000642 polymer Polymers 0.000 claims abstract description 14
- 229920006254 polymer film Polymers 0.000 claims abstract description 13
- 229920003229 poly(methyl methacrylate) Polymers 0.000 claims abstract description 8
- 239000004926 polymethyl methacrylate Substances 0.000 claims abstract description 8
- 238000003466 welding Methods 0.000 claims abstract description 7
- 238000004381 surface treatment Methods 0.000 claims description 24
- 238000000576 coating method Methods 0.000 claims description 5
- 238000007654 immersion Methods 0.000 claims description 4
- 238000004528 spin coating Methods 0.000 claims description 2
- 238000005507 spraying Methods 0.000 claims description 2
- 230000002035 prolonged effect Effects 0.000 abstract 1
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 6
- 229910000679 solder Inorganic materials 0.000 description 6
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 5
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 5
- 229910052737 gold Inorganic materials 0.000 description 5
- 239000010931 gold Substances 0.000 description 5
- 229910052709 silver Inorganic materials 0.000 description 5
- 239000004332 silver Substances 0.000 description 5
- 238000005476 soldering Methods 0.000 description 5
- 239000002904 solvent Substances 0.000 description 5
- 239000000126 substance Substances 0.000 description 4
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 239000010410 layer Substances 0.000 description 3
- 229910052759 nickel Inorganic materials 0.000 description 3
- 238000007747 plating Methods 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical group CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- HEDRZPFGACZZDS-UHFFFAOYSA-N Chloroform Chemical compound ClC(Cl)Cl HEDRZPFGACZZDS-UHFFFAOYSA-N 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000013047 polymeric layer Substances 0.000 description 2
- 230000001105 regulatory effect Effects 0.000 description 2
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 1
- 230000000740 bleeding effect Effects 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 238000010411 cooking Methods 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 239000012634 fragment Substances 0.000 description 1
- 230000009477 glass transition Effects 0.000 description 1
- 239000004519 grease Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 239000010970 precious metal Substances 0.000 description 1
- 239000011241 protective layer Substances 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 238000002791 soaking Methods 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
Images
Landscapes
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Abstract
The invention relates to a method for processing the surface of a printed circuit board. The method comprises the following steps that the surface of the printed circuit board is coated with polymethyl methacrylate solution, after the printed circuit board is dried, a polymer film is formed on the surface of the printed circuit board; before welding is carried out, the surface of the printed circuit board is irradiated through high-energy light beams so as to decompose polymer and expose a copper surface. Due to the adoption of the method, good welding performance is guaranteed, and meanwhile the printed circuit board can be roundly protected, service life of the printed circuit board can be prolonged, the cost is low, and the process is simple.
Description
Technical field
The present invention relates to the print circuit plates making technical field, particularly the surface treatment method of printed circuit board (PCB).
Background technology
To printed circuit board (PCB) carry out the surface-treated purpose be guarantee wiring board without the copper surface of anti-solder ink protection within certain pot-life, have good weldability.Because copper easily forms oxide in air, cause in follow-up assembling process, the adhesion variation of the upper tin of wiring board bad or scolding tin and wiring board causes tremendous influence to the performance of final electronic product, so need to process copper face.Common printed circuit board surface treatment technology has hot air leveling, organic coat, chemical nickel plating/soak gold and soak silver etc. at present, these process for treating surface have all obtained long-term application in printed circuit board (PCB) production, technical maturity, but also exist some problems, although the very high coating of solderability can be provided, make assembling have larger process conditions scope and make wiring board that longer storage period be arranged such as hot air flattening technology; But its required technological temperature is high, operating environment is poor, and is strong to the heat punching of printed circuit board (PCB), and the tin thickness on the copper face is inhomogeneous, and flatness is poor; Chemical nickel plating/soak gold and soak silver good flatness and contact can be provided, but need to use precious metal, and cost is higher, during welding, gold or silver are dispersed in the weld layer, cause easily solder joint to become fragile (chemical nickel plating/soak gold), solder joint cavity bad shortcomings such as (soaking silver); So that the adhesion variation of element and wiring board; The organic coat technical costs is low, but during follow-up soldering of electronic components, can't be washed fully by scaling powder and causes the weldability of printed circuit board (PCB) bad.Another major issue that above process for treating surface exists is that these surface treatments are only surperficial for copper, and formed gold, silver or organic coat layer just form on the copper surface, can not cover the printed circuit board (PCB) other parts, such as anti-solder ink.During actual production; often can not form continuous, complete surface treatment protective layer at the interface that copper face contacts with anti-solder ink; so that moisture and airborne acid gas etc. can be attacked this interface; thereby cause the corrosion of copper face etc.; reduce solderability and the corrosion resistance of printed circuit board (PCB), shortened the pot-life of printed circuit board (PCB).
Summary of the invention
Therefore; be necessary to provide a kind of process for treating surface of printed circuit board (PCB); its flatness is high; can carry out whole protection to printed circuit board (PCB) simultaneously; thereby can prolong the pot-life of printed circuit board (PCB); and when follow-up soldering of electronic components, be that the copper surface directly contacts with scolder, guarantee the reliability of solder joint.
The below will illustrate with embodiment a kind of surface treatment method of printed circuit board (PCB)
A kind of surface treatment method of printed circuit board (PCB), it may further comprise the steps: the solution coat of polymethyl methacrylate in printed circuit board surface, after the oven dry, is formed polymer film in printed circuit board surface; Before the welding, with high-energy light beam guiding printed circuit board surface is shone, make polymer unwinds, so that copper face exposes.
Compared with prior art, the process for treating surface of this printed circuit board (PCB) can comprehensively be protected printed circuit board (PCB) when guaranteeing good weldability, improves its pot-life, and with low cost, and technique is simple.
Description of drawings
Fig. 1 is the structural representation of the printed circuit board (PCB) that provides of the technical program embodiment.
Fig. 2 is the structural representation after Fig. 1 printed circuit board surface is carried out surface treatment.
Fig. 3 is the structural representation after Fig. 2 printed circuit board surface is carried out high energy light irradiation.
Embodiment
The surface treatment method of a kind of printed circuit board (PCB) that the technical program embodiment is provided below in conjunction with drawings and Examples is described in further detail
The surface treatment method of a kind of printed circuit board (PCB) that present embodiment provides may further comprise the steps:
The first step sees also Fig. 1 and Fig. 2, and the solution coat of polymethyl methacrylate in printed circuit board (PCB) 100 surfaces, after the oven dry, is formed polymer film 200 in printed circuit board surface;
As shown in Figure 1, in the present embodiment, printed circuit board (PCB) 100 can be the hard circuit board for need to carry out the surface-treated circuit board, multilayer circuit board, and flexible circuit board etc., in the present embodiment, printed circuit board (PCB) is the hard circuit board
Before printed circuit board (PCB) 100 is carried out surface treatment, can clean printed circuit board (PCB) by modes such as microetch, volcanic ash processing, especially reveal copper district 110, require to reveal copper district 110 without foul, grease and Cu oxide, has simultaneously certain roughness, the roughness Ra scope is 0.1 micron ~ 1.0 microns, and preferably, the roughness Ra scope is 0.2 micron ~ 0.5 micron.
As shown in Figure 2, on the surface of printed circuit board (PCB) 100, form 200 layers of polymer films.Particularly, the solution coat of polymethyl methacrylate in printed circuit board (PCB) 100 surfaces, is formed polymer film 200 in printed circuit board surface after the oven dry.
In the present embodiment, the polymer of employing is polymethyl methacrylate.The molecular weight ranges of polymer is 1000 to 1000000, and preferably, the molecular weight ranges of polymer is 10000 to 50000.Solvent for use is acetone, chloroform, carrene, oxolane, dimethyl formamide etc. organic solvent, can be single solvent, also can use the mixture of multi-solvents, can be according to the needs of coating process and selective solvent; The concentration range of polymer can be mass percent 1% to 50%; The method of coating can adopt the mode of immersion, also can be the variety of ways such as spin coating, spraying, roller coat, curtain are coated with, and is preferably the mode of immersion, and solution concentration is mass percent 2% to 40%, soak time 10 seconds to 5 minutes.Selected solution concentration is relevant with the final polymer film thickness that forms with soak time during immersion.It is 5 microns to 1000 microns that polymer film thickness requires, preferably, and 5 microns to 50 microns.
Be coated with the printed circuit board (PCB) of polymer solution through overbaking, form polymer film 200 in printed circuit board surface.The mode of oven dry is not limit, can adopt the modes such as baking oven baking or air cooking to realize, bake out temperature and time are relevant with the mode of selected solvent and coating, bake out temperature should be between 50 degrees centigrade to 120 degrees centigrade, be preferably 50 degrees centigrade to 80 degrees centigrade, the time of heating be 1 minute between half an hour.In the practical operation, can according to the needs of actual conditions, drying time and bake out temperature be regulated.Because the material of printed circuit board (PCB) is mainly organic material, the temperature of oven dry must not be higher than its glass transition temperature.
More than, finished the surface treatment of printed circuit board (PCB).
Second step sees also Fig. 2 and Fig. 3 for through the step of the printed circuit board (PCB) after the surface treatment at follow-up soldering of electronic components, before the welding, with high-energy light beam guiding printed circuit board surface is shone, and makes polymer unwinds, so that copper face exposes.
This high-energy light beam guiding can be ultraviolet light, laser, gamma-rays etc.In the present embodiment, select ultraviolet light irradiation.Because ultraviolet light can make polymethyl methacrylate generation decomposition reaction, polymer chain accelerates to disconnect, and forms the fragment of polymer.This polymer segments has lost the tack with printed circuit board (PCB), bleeding, blowing or inhaling under the condition of vacuum, polymer segments breaks away from from printed circuit board surface, thereby come out in the former copper surface that is covered under the polymer film, for follow-up welding fresh, non-oxidation is provided, without foul, without clean copper surfaces such as greasy dirts.
Preferably, ultraviolet wavelength is between 220 nanometer to 450 nanometers, take between 240 nanometer to 380 nanometers as excellent; Irradiation energy is 1 * 10
2Microwatt/square centimeter is to 4 * 10
5Microwatt/square centimeter is preferably 4 * 10
3Microwatt/square centimeter is to 4 * 10
5Microwatt/square centimeter; Exposure time is between 1 minute to 20 minutes.In the practical operation, can according to the needs of actual conditions, irradiation energy and exposure time be regulated.Irradiation energy is higher, and required time of decomposing copolymer is just fewer.
So far, finished the surface treatment of printed circuit board (PCB) and follow-up when soldering of electronic components, the work that this surface treatment is removed.This surface treatment method, with polymer film circuit board is covered comprehensively, not only copper face is protected, also be covered in simultaneously the other parts of printed circuit board (PCB), the polymer film that forms continuously without hole, airborne moisture and acid gas are not easy to penetrate this polymeric layer and arrive printed circuit board surface, thus for printed circuit board (PCB) is comprehensively protected, improve its pot-life, and guaranteed the not oxidized and thing that other materials are stained with in copper surface; When follow-up soldering of electronic components, this polymeric layer can be broken off by the mode of high energy light irradiation, has avoided having organic substance residues such as organic paint-on technique and causes the defectives such as the weldability of printed circuit board (PCB) is bad; In addition, the surface treatment mode of this printed circuit board (PCB) is simple, and is with low cost, is applicable to all printed circuit panel products
Be understandable that, for the person of ordinary skill of the art, can make other various corresponding changes and distortion by technical conceive according to the present invention, and all these change the protection range that all should belong to claim of the present invention with distortion.
Claims (7)
1. the surface treatment method of a printed circuit board (PCB), it may further comprise the steps:
The solution coat of polymethyl methacrylate in printed circuit board surface, after the oven dry, is formed polymer film in printed circuit board surface;
Before the welding, with high-energy light beam guiding printed circuit board surface is shone, make polymer unwinds, so that copper face exposes.
2. the surface treatment method of printed circuit board (PCB) as claimed in claim 1 is characterized in that, described polymer is polymethyl methacrylate, and molecular weight is 1000 to 1000000.
3. the surface treatment method of printed circuit board (PCB) as claimed in claim 1 is characterized in that, described coating process is that immersion, spin coating, spraying, roller coat, curtain such as are coated with at the mode.
4. the surface treatment method of printed circuit board (PCB) as claimed in claim 1 is characterized in that, formed polymer film layer thickness is 5 microns to 1000 microns.
5. the surface treatment method of printed circuit board (PCB) as claimed in claim 1 is characterized in that with high energy light printed circuit board surface being carried out irradiation.
6. the surface treatment method of printed circuit board (PCB) as claimed in claim 5 is characterized in that with ultraviolet light printed circuit board surface being carried out irradiation.
7. the surface treatment method of printed circuit board (PCB) as claimed in claim 6 is characterized in that ultraviolet wavelength is 220 nanometer to 450 nanometers.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012101215675A CN103379738A (en) | 2012-04-24 | 2012-04-24 | Method for processing surface of printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012101215675A CN103379738A (en) | 2012-04-24 | 2012-04-24 | Method for processing surface of printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103379738A true CN103379738A (en) | 2013-10-30 |
Family
ID=49464137
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012101215675A Pending CN103379738A (en) | 2012-04-24 | 2012-04-24 | Method for processing surface of printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103379738A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20190233749A1 (en) * | 2016-10-21 | 2019-08-01 | China Petroleum & Chemical Corporation | Process for Treating Gasoline |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20080311406A1 (en) * | 2005-12-06 | 2008-12-18 | Arkema France | (Ligno) Cellulose Material Board Coated with a Pmma and Pvdf-Based film |
| CN101682998A (en) * | 2007-02-19 | 2010-03-24 | 克龙比123有限公司 | Printed circuit boards |
| CN102212240A (en) * | 2010-04-02 | 2011-10-12 | 素塔电子科技(上海)有限公司 | Printed circuit board protective film and using method thereof |
-
2012
- 2012-04-24 CN CN2012101215675A patent/CN103379738A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20080311406A1 (en) * | 2005-12-06 | 2008-12-18 | Arkema France | (Ligno) Cellulose Material Board Coated with a Pmma and Pvdf-Based film |
| CN101682998A (en) * | 2007-02-19 | 2010-03-24 | 克龙比123有限公司 | Printed circuit boards |
| CN102212240A (en) * | 2010-04-02 | 2011-10-12 | 素塔电子科技(上海)有限公司 | Printed circuit board protective film and using method thereof |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20190233749A1 (en) * | 2016-10-21 | 2019-08-01 | China Petroleum & Chemical Corporation | Process for Treating Gasoline |
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| PB01 | Publication | ||
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| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
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Application publication date: 20131030 |