CN103200474A - Micro circuit board device used for minitype loudspeaker device - Google Patents
Micro circuit board device used for minitype loudspeaker device Download PDFInfo
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- CN103200474A CN103200474A CN2012100002864A CN201210000286A CN103200474A CN 103200474 A CN103200474 A CN 103200474A CN 2012100002864 A CN2012100002864 A CN 2012100002864A CN 201210000286 A CN201210000286 A CN 201210000286A CN 103200474 A CN103200474 A CN 103200474A
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- microcircuit
- circuit board
- hole structure
- ground connection
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Abstract
The invention discloses a micro circuit board device used for a minitype loudspeaker device, wherein the micro circuit board device has an improved structure and an innovative function. The micro circuit board device comprises a base plate part, a loudspeaker signal line pad part and a double-face grounding plate part with a through hole structure. The micro circuit board device is characterized in that the base plate part is of a planar structure, the loudspeaker signal line pad part is arranged on the front side of the base plate part, at the same time, the double-face grounding plate part with the through hole structure is arranged on the front side and the back side of the base plate part, and gold-plating layers cover the signal line pad, the surface of the double-face grounding plate with the through hole structure and the inner wall of the through hole. The micro circuit board device has at least the advantages that compared with a traditional micro circuit board device, the micro circuit board device is designed to be provided with the double-face grounding plate with the through hole structure on the basis that cost is fundamentally not increased and original functions and manufacturability of the traditional micro circuit board device are guaranteed, the manufacturability of relative minitype loudspeaker products is greatly improved, manufacturing technique difficulty and production cost of the micro circuit board device are effectively reduced, and an application range is very wide.
Description
Technical field
The present invention relates to a kind of electrical signal conduction and electromagnetic shielding servicing unit, particularly a kind of microcircuit panel assembly that is applied in the Microspeaker device belongs to the electroacoustics field.
Background technology
The microcircuit panel assembly that is used for the Microspeaker device in the market generally adopts dull and stereotyped single-sided structure, the manufacturing processing of this kind microcircuit panel assembly is simple relatively, but its function singleness, if because the electromagnetic shielding purpose need be carried out ground connection processing to the Microspeaker metal shell, need add the ground connection wire rod and use resistance welded to add modes such as adhesive is bonding and assemble, technology difficulty is big, and the manufacturing cost height; And it is relatively poor that traditional microcircuit plate adds the environmental stability of ground connection wire rod mode, and the variation of ambient temperature, humidity all can cause negative effect greatly to its ground connection performance.In a word, the mode that existing microcircuit plate adds the earth connection material has technology difficulty, cost height, unsettled deficiency, has limited further developing of Related product.
Summary of the invention
The present invention is intended to propose a kind of microcircuit panel assembly of Microspeaker device, it has kept function and the characteristics of traditional microcircuit plate design and has done reasonable optimizing and innovation, greatly improved the manufacturability of Related product, reduced its manufacturing cost effectively, and, have very great help for the enhancing of product environmental stability.
For achieving the above object, the present invention has adopted following technical scheme:
A kind of microcircuit panel assembly that is used for Microspeaker with structure-improved and new function, it comprises substrate portion, loudspeaker signal wire bonding disc portion is formed with two-sided ground connection disc portion three parts that have through-hole structure.It is characterized in that: described substrate portion is a planar structure, is equipped with described loudspeaker signal wire bonding disc portion in its front, simultaneously, also is equipped with the two-sided ground connection disc portion of described band through-hole structure at described substrate tow sides.
Further, the two-sided ground connection panel surface of described holding wire pad and band through-hole structure and through-hole wall all have Gold plated Layer to cover, guaranteeing the solderability of described holding wire pad, and the two sides of the two-sided ground connection dish of described band through-hole structure is the integral body of a conducting at circuit.
Described microcircuit panel assembly on manufacturing process flow by punching, plating, etching again operation such as die-cut make.
In use, described holding wire pad is connected with conducting respectively with the signal line group of the magnetic induction coil of Microspeaker device, and the two-sided ground connection dish reverse side of described band through-hole structure is connected with the metal shell conducting of Microspeaker device.
Simultaneously, conducting connected mode between the signal line group of the magnetic induction coil of described holding wire pad and described Microspeaker device is scolding tin or resistance welded, and the conducting connected mode between the two-sided ground connection dish reverse side of described band through-hole structure and the metal shell of described Microspeaker device is the bonding or resistance welded of electroconductive binder.
Compared with prior art, the invention has the advantages that:
(1) than existing dull and stereotyped single face microcircuit panel assembly, the present invention has kept function and the characteristics of traditional microcircuit plate design and has done reasonable optimizing and innovation, has added the two-sided ground connection dish of band through-hole structure, has enriched the function of microcircuit plate;
(2) the microcircuit plate has reasonably added the two-sided ground connection dish of band through-hole structure among the present invention, has greatly reduced the technology difficulty that ground connection that Microspeaker device metal shell carries out because of electromagnetic shielding is handled, and has reduced its manufacturing cost effectively;
(3) the two-sided ground connection dish of the band through-hole structure that adds of the microcircuit panel assembly among the present invention, compare traditional ground connection wire rod and increased contact area with Microspeaker device metal shell, for Microspeaker device metal shell provides a kind of more stable implementation effectively because of the ground connection processing that electromagnetic shielding carries out, conscientiously improved the environmental stability of relevant Microspeaker device, widened its scope of application greatly, strengthened competitiveness of product, very big market popularization value has been arranged.
Description of drawings
Fig. 1 is existing dull and stereotyped single-sided structure microcircuit plate schematic diagram;
Fig. 2 is the micro-circuit board structural representation that the present invention is used for the Microspeaker device;
Fig. 3 is the circuit connection diagram that microcircuit panel assembly that the present invention is used for the Microspeaker device is applied to a kind of Microspeaker device;
Fig. 4 is the structural representation that microcircuit panel assembly that the present invention is used for the Microspeaker device is applied to a kind of Microspeaker device;
Each Reference numeral and indicated assembly thereof are respectively among the figure:
The A1-substrate, A2-holding wire pad, the two-sided ground connection dish of A3-band through-hole structure
The B1-Microspeaker, B2-magnetic induction coil signal line group, B3-metal shell
Embodiment
Below in conjunction with accompanying drawing and a preferred embodiment technical scheme of the present invention is further described.
Consult Fig. 2,3,4, present embodiment relates to a kind of microcircuit panel assembly that is applied to the Microspeaker device, it comprises substrate portion A1, loudspeaker signal wire bonding disc portion A2 forms with two-sided ground connection disc portion A3 three parts that have through-hole structure, aforesaid base plate part A 1 is a planar structure, be equipped with described loudspeaker signal wire bonding disc portion A2 in its front, simultaneously, aforesaid base plate part A 1 tow sides also are equipped with the two-sided ground connection disc portion A3 of described band through-hole structure.
Because the self structure characteristics of microcircuit plate in the present embodiment are preferred, the microcircuit plate among this embodiment on manufacture craft by punching, plating, etching again operation such as die-cut make.
Simultaneously, surface and the through-hole wall of the two-sided ground connection dish A3 of aforementioned holding wire pad A2 and band through-hole structure all have Gold plated Layer to cover, guaranteeing the solderability of described holding wire pad A2, and the two sides of the two-sided ground connection dish A3 of aforementioned band through-hole structure is the integral body of a conducting at circuit.
In the time of in being applied to Microspeaker device B1, aforementioned holding wire pad A2 is connected with the signal line group B2 difference conducting of the magnetic induction coil of Microspeaker device, and the reverse side of the two-sided ground connection dish A3 of aforementioned band through-hole structure is connected with the metal shell B3 conducting of Microspeaker device B1.Preferred conducting connects execution mode, and the conducting connected mode between the signal line group B2 of described holding wire pad A2 and the magnetic induction coil of described Microspeaker device B1 is that scolding tin is connected; Conducting connected mode between the reverse side of the two-sided ground connection dish A3 of described band through-hole structure and the metal shell B3 of described Microspeaker device B1 is that electroconductive binder is bonding.
During work, the signal of telecommunication is imported into the input of signal line group B2 of the magnetic induction coil of the Microspeaker device B1 that is connected with its conducting by the end of holding wire pad A2, after the transducing sounding is finished in Microspeaker device B1 inside, form the loop with the other end of holding wire pad A2 and spread out of.Simultaneously, the front of the two-sided ground connection dish A3 of described band through-hole structure is owing to the metal shell B3 of the reverse side that is connected with its conducting and described Microspeaker device B1 also conducting is connected the integral body that forms a conducting, can be used for the effect of playing ground connection with being connected of peripheral auxiliary circuits and then reaching effectiveness.
The present invention has done reasonable optimizing and innovation than existing microcircuit panel assembly in the function that keeps traditional microcircuit plate design and the basis of characteristics, has added the two-sided ground connection dish of band through-hole structure, has enriched the function of microcircuit plate; Among the present invention the microcircuit plate has reasonably added the two-sided ground connection dish of band through-hole structure, has greatly reduced the technology difficulty that ground connection that Microspeaker device metal shell carries out because of electromagnetic shielding is handled, and has reduced its manufacturing cost effectively; The two-sided ground connection dish of the band through-hole structure that the microcircuit panel assembly among the present invention adds, compare traditional ground connection wire rod and increased contact area with Microspeaker device metal shell, for Microspeaker device metal shell provides a kind of more stable implementation effectively because of the ground connection processing that electromagnetic shielding carries out, conscientiously improved the environmental stability of relevant Microspeaker device, widened its scope of application greatly, strengthened competitiveness of product, very big market popularization value has been arranged.
More than purpose of the present invention, technical scheme and beneficial effect are further described; institute is understood that; the above only is preferred embodiment of the present invention; be not limited to the present invention; within the spirit and principles in the present invention all; any modification of making, be equal to replacement, improvement etc., all should be included within protection scope of the present invention.
Claims (7)
1. microcircuit panel assembly that is used for the Microspeaker device, it is characterized in that: described microcircuit panel assembly comprises substrate portion, loudspeaker signal wire bonding disc portion and two-sided ground connection disc portion three parts that have a through-hole structure are formed.
2. the microcircuit panel assembly for the Microspeaker device according to claim 1, it is characterized in that: described substrate portion is a planar structure, be equipped with described loudspeaker signal wire bonding disc portion in its front, simultaneously, also be equipped with the two-sided ground connection disc portion of described band through-hole structure at described substrate tow sides.
3. according to claim 1 and 2 described microcircuit panel assemblies for the Microspeaker device, it is characterized in that: two-sided ground connection panel surface and the through-hole wall of described holding wire pad and band through-hole structure all have Gold plated Layer to cover, guaranteeing the solderability of described holding wire pad, and the two sides of the two-sided ground connection dish of described band through-hole structure is the integral body of a conducting at circuit.
4. according to claim 1 and 2 and 3 described microcircuit panel assemblies for the Microspeaker device, it is characterized in that: described microcircuit panel assembly on manufacturing process flow by punching, plating, etching again operation such as die-cut make.
5. according to claim 1 and 2 and 3 described Microspeaker devices, it is characterized in that: used described microcircuit panel assembly in the described Microspeaker device, the signal line group of the magnetic induction coil of described Microspeaker device is connected with the conducting of described holding wire pad respectively, and the metal shell of described Microspeaker device is connected with the two-sided ground connection dish reverse side conducting of described band through-hole structure.
6. the microcircuit panel assembly for the Microspeaker device according to claim 5, it is characterized in that: the conducting connected mode between the signal line group of the magnetic induction coil of described holding wire pad and described Microspeaker device is scolding tin or resistance welded.
7. the microcircuit panel assembly for the Microspeaker device according to claim 5 is characterized in that: the conducting connected mode between the two-sided ground connection dish reverse side of described band through-hole structure and the metal shell of described Microspeaker device is the bonding or resistance welded of electroconductive binder.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012100002864A CN103200474A (en) | 2012-01-04 | 2012-01-04 | Micro circuit board device used for minitype loudspeaker device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012100002864A CN103200474A (en) | 2012-01-04 | 2012-01-04 | Micro circuit board device used for minitype loudspeaker device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103200474A true CN103200474A (en) | 2013-07-10 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012100002864A Pending CN103200474A (en) | 2012-01-04 | 2012-01-04 | Micro circuit board device used for minitype loudspeaker device |
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Citations (9)
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| JP2001237586A (en) * | 2000-02-25 | 2001-08-31 | Matsushita Electric Ind Co Ltd | Circuit board, module incorporating circuit part, and manufacturing method thereof |
| US20020129957A1 (en) * | 2001-03-19 | 2002-09-19 | Kolb Lowell Edward | Low profile non-electrically-conductive component cover for encasing circuit board components to prevent direct contact of a conformal EMI shield |
| CN1653878A (en) * | 2002-04-23 | 2005-08-10 | 日本电气式会社 | Electromagnetically shielded circuit device and shielding method therefor |
| CN101017805A (en) * | 2006-02-10 | 2007-08-15 | 矽品精密工业股份有限公司 | Semiconductor package substrate |
| JP2010258137A (en) * | 2009-04-23 | 2010-11-11 | Panasonic Corp | High frequency module and manufacturing method thereof |
| CN201758224U (en) * | 2009-10-26 | 2011-03-09 | 番禺得意精密电子工业有限公司 | Grounding structure and the buckling base, the electric connector assembly, the electronic assembly and the electronic device thereof |
| CN102005437A (en) * | 2009-09-03 | 2011-04-06 | 采钰科技股份有限公司 | Electronic device for image sensing element, wafer-level lens group |
| CN102300148A (en) * | 2011-08-10 | 2011-12-28 | 美律电子(深圳)有限公司 | Electroacoustic transducer having sensing function |
| CN202602845U (en) * | 2012-01-04 | 2012-12-12 | 苏州恒听电子有限公司 | Micro circuit board apparatus for minitype loudspeaker device |
-
2012
- 2012-01-04 CN CN2012100002864A patent/CN103200474A/en active Pending
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001237586A (en) * | 2000-02-25 | 2001-08-31 | Matsushita Electric Ind Co Ltd | Circuit board, module incorporating circuit part, and manufacturing method thereof |
| US20020129957A1 (en) * | 2001-03-19 | 2002-09-19 | Kolb Lowell Edward | Low profile non-electrically-conductive component cover for encasing circuit board components to prevent direct contact of a conformal EMI shield |
| CN1653878A (en) * | 2002-04-23 | 2005-08-10 | 日本电气式会社 | Electromagnetically shielded circuit device and shielding method therefor |
| CN101017805A (en) * | 2006-02-10 | 2007-08-15 | 矽品精密工业股份有限公司 | Semiconductor package substrate |
| JP2010258137A (en) * | 2009-04-23 | 2010-11-11 | Panasonic Corp | High frequency module and manufacturing method thereof |
| CN102005437A (en) * | 2009-09-03 | 2011-04-06 | 采钰科技股份有限公司 | Electronic device for image sensing element, wafer-level lens group |
| CN201758224U (en) * | 2009-10-26 | 2011-03-09 | 番禺得意精密电子工业有限公司 | Grounding structure and the buckling base, the electric connector assembly, the electronic assembly and the electronic device thereof |
| CN102300148A (en) * | 2011-08-10 | 2011-12-28 | 美律电子(深圳)有限公司 | Electroacoustic transducer having sensing function |
| CN202602845U (en) * | 2012-01-04 | 2012-12-12 | 苏州恒听电子有限公司 | Micro circuit board apparatus for minitype loudspeaker device |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| DD01 | Delivery of document by public notice |
Addressee: Suzhou Hengting Electronic Co., Ltd. Document name: Notification of Passing Examination on Formalities |
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| C41 | Transfer of patent application or patent right or utility model | ||
| TA01 | Transfer of patent application right |
Effective date of registration: 20170118 Address after: The front road 215000 in Jiangsu province Suzhou city high tech Development Zone No. 299 Building 1 Applicant after: Suzhou Puliansi Electronic Technology Co., Ltd. Address before: High tech Zone Suzhou city Jiangsu province 215011 Chuk Yuen Road No. 209 Applicant before: Suzhou Hengting Electronic Co., Ltd. |
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| TA01 | Transfer of patent application right | ||
| TA01 | Transfer of patent application right |
Effective date of registration: 20170308 Address after: Song Ling Zhen Wujiang District of Suzhou City, Jiangsu province 215299 Suzhou River Road No. 18 Applicant after: Suzhou Yi Acoustic Technology Co. Ltd.. Address before: The front road 215000 in Jiangsu province Suzhou city high tech Development Zone No. 299 Building 1 Applicant before: Suzhou Puliansi Electronic Technology Co., Ltd. |
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| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20130710 |