CN102957075B - Method for filling up perforation - Google Patents

Abstract

The invention discloses a method for filling a perforation, which includes: providing the perforation with two openings having unequal diameters to each other, and injecting filling material into the perforation. The step of injecting the filling material into the perforation includes: determining an injection angle based on at least an injection rate, and using a syringe with an injection diameter to inject the filling material with a specific consistency at the injection rate and the injection angle. The perforation. In addition, the method of filling the through hole may further include forming a chamfer around an opening through which the filling material is to be injected into the through hole. The method of filling perforations of the present invention not only does not leave air in the perforations, but also has a smooth appearance after filling. Therefore, it can meet the needs of filling any perforations on any geometric plane, and can even maintain the quality of the filled components, so it can It is widely used in various electronic products and various processes for forming antennas on mobile devices.

Description

Ways to fill a piercing

technical field

The invention relates to filling technology, especially a method for filling perforation.

Background technique

At present, many communication electronic products, such as smart phone (Smart Phone), mobile phone (MobilePhone), notebook computer (Notebook), tablet computer (Tablet Personal Computer), personal navigation device (Personal Navigation Device, PND) and global positioning system (Global Positioning System) System, GPS) devices and other mobile devices, most of the antennas are manufactured using flexible printed circuit boards (Flexible Printed Circuit Board, FPCB). However, when flexible printed circuit boards are pasted on non-planar surfaces, especially in three-dimensional , 3D) hyperboloid (Hyperboloid), will be warped because it cannot be completely fitted, so the flexible circuit board is more suitable for use between two-dimensional (Two-dimension, 2D) plane and three-dimensional (Three-dimension, 3D) a single curved surface (Single curved surface) between (2.5D) spaces. Therefore, when the antenna needs to be placed on a non-planar surface, it is necessary to use a special process technology applied to a three-dimensional hyperboloid to manufacture the antenna, such as Laser Direct Structuring (LDS) technology.

However, when using the above-mentioned three-dimensional hyperboloid process technology, most of the throughholes are used to make the male mold surface (inner surface) and the female mold surface (outer surface) of the carrier with the antenna conduction, so Allows electrical signals to be transmitted. Please refer to FIG. 1 . FIG. 1 is a schematic diagram of a through hole 120 formed on a carrier 100 with an antenna by conventional laser direct structuring technology. It can be seen from FIG. 1 that the antenna 105 on the female die surface S1 of the carrier body 125 is electrically connected to the contact body 115 on the male die face S2 through the through hole 120 . Due to the limitations of the process, the through hole 120 is not completely closed, so external moisture or other factors affecting the quality of the antenna may invade the interior of the carrier 100 . In addition, since the perforation holes of the carrier with the antenna are mostly on the order of centimeters (for example, 0.1 cm to several centimeters), even after the carrier with the antenna is formed, when the perforation is filled with an adhesive material, the inside of the perforation is often Trapped air not only fails to fill the perforation sufficiently to ensure antenna quality, but also affects the appearance of the carrier with the antenna.

Contents of the invention

Therefore, the technical problem to be solved by the present invention is to provide a method for filling a perforation. This method not only does not leave air in the perforation, but also has a smooth appearance after filling, so it can be used to fill any perforation on any geometric plane. demand, it can be widely used in various electronic products.

According to an embodiment of the present invention, a method for filling a perforation is disclosed, comprising: providing the perforation with two openings with unequal diameters; and injecting a filling material into the perforation. Wherein the step of injecting the filling material into the perforation comprises: determining an injection angle according to at least one injection rate; Inject the perforation at the above injection angle.

The method of filling the perforation of the present invention not only does not leave air in the perforation, but also has a smooth appearance after filling, so it can meet the needs of filling any perforation on any geometric plane, and can even maintain the quality of the filled element (for example, Fully fill the perforation on the carrier with the antenna to ensure the quality of the antenna), so it can be widely used in various electronic products and various processes for forming antennas on mobile devices.

Description of drawings

FIG. 1 is a schematic diagram of a through hole formed on a carrier with an antenna by a conventional laser direct structuring technique.

FIG. 2 is a flow chart of an embodiment of a generalized method for filling a perforation of the present invention.

Fig. 3 is a cross-sectional view of two perforations with unequal apertures.

4 to 6 are schematic diagrams of preferred embodiments of the method for filling perforations of the present invention.

Wherein, the reference signs are explained as follows:

100 loads

105 Antenna

115 Contact body

120, 320, 420 perforation

125, 325, 425 Carrier body

440 chamfer

450 cover

460 Syringes

470, 4701 Filling materials

Detailed ways

Please refer to FIG. 2 . FIG. 2 is a flowchart of an embodiment of a generalized method for filling holes of the present invention. Firstly, as shown in step 21 , the present invention provides through holes with two openings whose diameters are not equal to each other. Please refer to FIG. 3 . FIG. 3 is a cross-sectional view of a through hole 320 with two unequal apertures. Taking the process technology currently used to manufacture antennas on mobile devices as an example, generally speaking, when all antenna process steps are completed, the through hole 320 is the part of the dotted box, that is, the apertures of the two openings will be equal/symmetrical to each other (both It is Φ----2). In this embodiment, the opening diameter on the female mold surface S1' of the carrier body 325 can be increased to Φ----1 (that is, the opening diameter on the female mold surface S1' is Φ- ---1 will be larger than the opening diameter Φ----2) on the male die surface S2', so as to provide the through hole 320 with two opening diameters unequal/symmetrical to each other. Next, in step 22 shown in FIG. 2 , a syringe is used to inject a filling material into the through hole.

Please note that the above-mentioned method of providing two apertures with unequal apertures is just for illustration, and is not intended to be a limitation of the present invention. In other words, the opening aperture on the male mold surface S2' of the carrier body 325 can also be changed, and the method of changing the opening aperture is not limited to the injection molding method of the mold. After equal/symmetrical antenna mounts, the opening aperture is changed with a milling machine. In short, as long as two through holes with unequal apertures are provided to inject the filling material into the through holes, all follow the inventive spirit of the present invention and fall within the scope of the present invention. In addition, regarding the implementation of step 22 shown in FIG. 2 , please refer to the following description.

Please refer to FIG. 4 , FIG. 5 and FIG. 6 together, which are schematic diagrams of a preferred embodiment of the method for filling the perforation of the present invention. The hole filling operations shown in FIG. 4 , FIG. 5 and FIG. 6 are based on steps 21 and 22 shown in FIG. 2 . As shown in FIG. 4 , at first provide two perforations 420 (located on the carrier body 425 ) with unequal opening apertures. In addition, in order to make the effect of filling the perforations 420 better (for example, to prevent the perforations 420 from generating air in them when filling) ), this embodiment further forms a chamfer (bevel) 440 around the upper opening of the through hole 420 , wherein when filling the through hole 420 , the filling material will be injected into the through hole 420 from the upper opening. Please note that the chamfer 440 can be a fillet or a chamfer.

Next, as shown in FIG. 5 , the filling material 470 is injected into the through hole 420 from the upper opening of the through hole 420 . Since the filling material 470 may seep out from the lower opening of the perforation 420, the lower opening of the perforation 420 can be covered by the shield 450 (that is, another opening opposite to the opening where the filling material is injected into the perforation) can be shielded to prevent filling. Material 470 oozes. In addition, in this embodiment, the step of injecting the filling material 470 into the through hole 420 may include: determining the injection angle θ according to at least one injection rate V; The filling material 470 is injected into the through hole 420 at an injection rate V and an injection angle θ. Regarding the definition of the above-mentioned injection angle θ, it is an injection vector V_IP formed by the injection end I on the syringe 460 and the injection point P injected into the surface S where the upper opening of the through hole 420 is located, and the injection point P is on the surface S. Between a normal vector V_N of , the angle formed is less than a right angle.

In addition, since the filling material 470 is thick, when the injection diameter C is too small, the syringe 460 may be damaged during the injection process, so the injection diameter C and the filling material 470 are injected into the hole diameter Φ of the upper opening of the through hole 420. The ratio between can be set between 0.2 and 0.9. Furthermore, in this embodiment, when the unit of the injection rate V is ml/s and the unit of the specific consistency SC is thousand centipoise, the ratio of the initial value of the injection rate V to the magnitude of the specific consistency SC can be Set between 0.0002 and 0.125 to make the filling quality of the perforation 420 better.

In a variation of this embodiment, the method for filling the perforation 420 may further include: during the process of injecting the filling material 470 into the perforation 420, adjusting the injection rate V to obtain better filling quality, wherein the step of adjusting the injection rate V Including: adjusting the injection rate V according to the injection amount of the filling material 470 injected into the through hole 420 .

As shown in Figure 6, when the injection amount of the filling material 470 injected into the through hole 420 is greater than the predetermined injection amount, and the filling material 470 injected into the through hole 420 becomes solid, grinding or etching can be used to remove at least a part of the exposed surface. The filling material 470 (for example, filling material 4701 ) in the perforation 420 is used to make the appearance after filling smooth and meet the requirements of commercialization. In addition, in one embodiment, the filling material 470 may be a material containing resin, however, in another embodiment, the filling material 470 may be a material containing conductive substances.

In the process of injecting the filling material into the perforation, in addition to adjusting the injection rate to obtain better filling quality, the injection angle can also be dynamically adjusted according to the injection rate to further improve the filling quality. For example, dynamically adjusting the injection angle according to the injection rate may include: increasing the injection angle when the injection rate increases; and decreasing the injection angle when the injection rate decreases. In other words, in another variation of this embodiment, after the initial value of the injection rate V is determined according to the specific consistency SC of the filling material 470, the injection rate V can be based on the injection volume of the filling material 470 injected into the through hole 420 , to adjust the injection rate V, and the injection angle θ can also be dynamically adjusted according to the adjusted injection rate V. Please note that the above are examples only, and are not intended to limit the present invention. For example, the injection rate V can also be adjusted depending on whether the filling material injected into the through hole 420 is doped with air, or even in the process of filling the through hole 420, in order to shorten the filling time, it can be directly and appropriately adjusted The injection rate V, and then adjust the injection angle θ appropriately.

In addition, it can be known from the above-mentioned embodiments that the method for filling the perforation of the present invention can also be applied to the perforation on the non-planar surface, and the filling material can be injected from the male die surface or the female die surface to fill the perforation hole. Therefore, the method for filling the perforation of the present invention can be applied to the process of forming an antenna on a mobile device, wherein the mobile device can be a smart phone (Smart Phone), a mobile phone, a notebook computer (Notebook), a personal navigator (PND), Global Positioning System (GPS) device or tablet PC (TabletPC), in addition, the process of forming the antenna can be laser direct structuring (Laser Direct Structuring, LDS) technology, or other related methods that can form the antenna on the carrier with a three-dimensional surface craft technology.

Based on the above, the method of filling the perforation of the present invention not only does not leave air in the perforation, but also has a smooth appearance after filling, so it can meet the needs of filling any perforation on any geometric plane, and can even maintain the quality of the filled components (For example, fully filling the perforation on the carrier with the antenna to ensure the quality of the antenna), so it can be widely used in various electronic products and various processes for forming antennas on mobile devices.

The above descriptions are only preferred embodiments of the present invention, and all equivalent changes and modifications made according to the claims of the present invention shall fall within the scope of the present invention.

Claims (17)

1. fill up a method for perforation, it is characterized in that, comprise:

There is provided both ends open aperture unequal described perforation; And

Material for repairing is injected described perforation;

The step wherein described material for repairing being injected described perforation comprises:

At least decide injection angles according to an injection rate; And

Use the syringe with injection caliber, the described material for repairing with specific density is injected described perforation with described injection rate and described injection angles;

Wherein said injection angles is close to the injection vector that the decanting point on the surface at the opening place of described injection end is formed in the injection end of described syringe and described perforation, and between the normal vector of described decanting point on described surface, the angle being less than right angle formed.

2. the method for claim 1, is characterized in that, described injection caliber and described material for repairing are injected into the ratio in the aperture of the opening of described perforation between 0.2 and 0.9.

3. the method for claim 1, it is characterized in that, when the unit of described injection rate is milliliters/second, and when the unit of described density is thousand centipoise, the ratio of the initial value of described injection rate and the value of described specific density is between 0.0002 and 0.125.

4. the method for claim 1, is characterized in that, comprises:

In described material for repairing being injected the process of described perforation, adjust described injection rate.

5. method as claimed in claim 4, it is characterized in that, the step adjusting described injection rate comprises:

Be injected into the injection rate in described perforation according to described material for repairing, adjust described injection rate.

6. method as claimed in claim 4, is characterized in that, comprise:

In described material for repairing being injected the process of described perforation, carry out injection angles described in dynamic conditioning according to described injection rate.

7. method as claimed in claim 6, is characterized in that, carry out the step of injection angles described in dynamic conditioning comprise according to described injection rate:

When described injection rate promotes, increase described injection angles; And

When described injection rate reduces, reduce described injection angles.

8. the method for claim 1, is characterized in that, comprises:

Formed chamfering in described material for repairing for be injected into described perforation opening around.

9. the method for claim 1, is characterized in that, comprises:

Cover another opening relative to the opening described material for repairing being injected into described perforation.

10. the method for claim 1, is characterized in that, comprises:

When the described material for repairing injection rate be injected in described perforation is greater than predetermined injection rate, and the described material for repairing injected in described perforation when becoming solid-state, to grind or the mode such as etching removes the described material for repairing exposing to described perforation at least partially.

11. the method for claim 1, is characterized in that, described perforation is positioned at non-planar surfaces.

12. the method for claim 1, is characterized in that, described material for repairing comprises resin.

13. the method for claim 1, is characterized in that, described material for repairing comprises conductive materials.

14. the method for claim 1, is characterized in that, are applied to technique mobile device being formed antenna.

15. methods as claimed in claim 14, is characterized in that, described mobile device is smart mobile phone, mobile phone, notebook computer, personal navigation instrument, global positioning system apparatus or panel computer.

16. methods as claimed in claim 14, is characterized in that, described technique is the technology be formed in by described dwi hastasana in the holder of tool three-dimensional surface.

17. methods as claimed in claim 14, is characterized in that, described technique is radium-shine straight forming technology.