CN102957075A - Method for filling up perforation - Google Patents
Method for filling up perforation Download PDFInfo
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- CN102957075A CN102957075A CN2011102781878A CN201110278187A CN102957075A CN 102957075 A CN102957075 A CN 102957075A CN 2011102781878 A CN2011102781878 A CN 2011102781878A CN 201110278187 A CN201110278187 A CN 201110278187A CN 102957075 A CN102957075 A CN 102957075A
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- perforation
- injection
- filling material
- filling
- injection rate
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- 238000000034 method Methods 0.000 title claims abstract description 52
- 238000002347 injection Methods 0.000 claims abstract description 69
- 239000007924 injection Substances 0.000 claims abstract description 69
- 239000000463 material Substances 0.000 claims abstract description 50
- 238000005530 etching Methods 0.000 claims description 2
- 230000007423 decrease Effects 0.000 claims 1
- 230000003247 decreasing effect Effects 0.000 claims 1
- 239000011347 resin Substances 0.000 claims 1
- 229920005989 resin Polymers 0.000 claims 1
- 239000007787 solid Substances 0.000 claims 1
- 239000000126 substance Substances 0.000 claims 1
- 238000005516 engineering process Methods 0.000 description 11
- 238000010586 diagram Methods 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 3
- 101001045744 Sus scrofa Hepatocyte nuclear factor 1-beta Proteins 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000003801 milling Methods 0.000 description 1
- 230000007306 turnover Effects 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
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- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
Abstract
The invention discloses a method for filling a perforation, which comprises the following steps: providing the through hole with two openings with different apertures, and injecting filling material into the through hole. The step of injecting the fill material into the perforations comprises: an injection angle is determined at least according to an injection rate, and a filling material with a specific consistency is injected into the through hole at the injection rate and the injection angle by using an injector with an injection pipe diameter. In addition, the method for filling the perforation may further include: forming a chamfer around an opening of the via hole into which the filling material is to be injected. The method for filling the through hole of the invention not only can not leave air in the through hole, but also has flat appearance after filling, thereby meeting the requirement of filling any through hole on any geometric plane, even maintaining the quality of the filled element, and being widely applied to various electronic goods and various processes for forming an antenna on a mobile device.
Description
Technical field
The present invention relates to fill up technology, espespecially a kind of method of filling up perforation.
Background technology
Present many communications electronics products, smart mobile phone (Smart Phone) for example, mobile phone (Mobile Phone), notebook computer (Notebook), panel computer (Tablet Personal Computer), personal navigation instrument (Personal Navigation Device, PND) and global positioning system (Global Position System, GPS) device waits mobile device, flexible circuit board (Flexible Printed Circuit Board is used in the manufacturing of its antenna mostly, FPCB), yet, flexible circuit board is when being pasted on non-planar surfaces, particularly at three-dimensional (Three-dimensional, hyperboloid 3D) (Hyperboloid), can produce because can't fit perfectly fully and turn over the situation of sticking up, so flexible circuit board is more suitable between two dimension (Two-dimension, 2D) the single-curved surface (Single curved surface) of (2.5D) between plane and three-dimensional (Three-dimension, 3D) space.Therefore, when antenna need be arranged on non-planar surfaces, need to make antenna with the special three-dimensional bi-curved technology that is applied to, for example radium-shine straight forming (Laser Direct Structuring, LDS) technology.
Yet, when stating three-dimensional bi-curved technology in the use, mostly can utilize perforation (through hole) to make between the common die face (inner surface) of the holder with antenna and the master mold face (outer surface) and be able to conducting, thereby so that the signal of telecommunication transmitted.See also Fig. 1, Fig. 1 is the schematic diagram of the perforation of one on the holder with antenna 100 that forms with known radium-shine straight forming technology 120.As shown in Figure 1, be positioned at the antenna 105 on the master mold face S1 of holder body 125, by boring a hole 120 and be electrically connected with contact 115 on being positioned at common die face S2.Because the restriction of technique, perforation 120 is complete closed not, so the factor of extraneous moisture or other influences antenna quality may be invaded the inside of holder 100.In addition, (for example mostly be greatly centimetre grade owing to generally having the aperture of perforation of the holder of antenna, 0.1 centimetre to several centimetres), even if so after formation has the holder of antenna, when filling up perforation to follow material, tend to residual air in the perforation, not only fail fully to fill up perforation to guarantee the antenna quality, the outward appearance of the holder with antenna is affected.
Summary of the invention
Therefore, technical problem to be solved by this invention is to provide a kind of method of filling up perforation, the method not only can residual air in described perforation, and the flat appearance after filling up, thereby can accord with and fill up a demand of appointing perforation on any geometrical plane, therefore can be widely used in various electronic goods.
According to embodiments of the invention, it discloses a kind of method of filling up perforation, comprises: the each other unequal described perforation of two hatch bore diameters is provided; And material for repairing injected described perforation.The step of wherein described material for repairing being injected described perforation comprises: decide injection angles according to an injection rate at least; And using the syringe with injection caliber, the described material for repairing that will have specific density injects described perforation with described injection rate and described injection angles.
The method that the present invention fills up perforation not only can residual air in described perforation and the flat appearance after filling up, thereby can be satisfied with the demand of filling up arbitrary perforation on any geometrical plane, even the quality that can keep the element of filling up (for example, fully fill up the perforation on the holder with antenna, to guarantee the antenna quality), therefore can be widely used in various electronic goods and the various technique that on mobile device, forms antenna.
Description of drawings
Fig. 1 is the schematic diagram of the perforation on the holder with antenna that forms with known radium-shine straight forming technology.
Fig. 2 is the flow chart of embodiment of the method for filling up perforation of broad sense of the present invention.
Fig. 3 is the each other profiles of unequal perforation of two hatch bore diameters.
Fig. 4 to Fig. 6 is the schematic diagram of the preferred embodiment of the present invention's method of filling up perforation.
Wherein, description of reference numerals is as follows:
100 holders
105 antennas
115 contacts
120,320,420 perforation
125,325,425 holder bodies
440 chamferings
450 veils
460 syringes
470,4701 material for repairing
Embodiment
See also Fig. 2, Fig. 2 is the flow chart of the embodiment of (generalized) of the broad sense of the present invention method of filling up perforation.At first, shown in step 21, the present invention can provide the each other unequal perforation of two hatch bore diameters.See also Fig. 3, Fig. 3 is the each other profiles of unequal perforation 320 of two hatch bore diameters.To be applied to that at present antenna is produced on technology on the mobile device as example, in general, when finishing the step of all days Wiring technology, perforation 320 be the part of dashed rectangle, and namely two hatch bore diameters can be equal to each other/symmetry (be all Φ----2).In this embodiment,---1 (be the hatch bore diameter Φ on the master mold face S1 '---1 can greater than the hatch bore diameter Φ on the common die face S2 '----2) is to provide the each other unequal/symmetrical perforation 320 of two hatch bore diameters can to utilize the mode of mould ejection formation that the hatch bore diameter on the master mold face S1 ' of holder body 325 is increased to Φ.Then, in step 22 shown in Figure 2, utilize syringe that material for repairing is injected described perforation.
The above-described each other unequal mode of two hatch bore diameters that provides is provided, for the example explanation, is not as restriction of the present invention only.In other words, also can change the hatch bore diameter on the common die face S2 ' of holder body 325, and the mode that changes hatch bore diameter is not limited to the mode of mould ejection formation, for instance, also can be equal to each other in forming device two hatch bore diameters/symmetrical antenna holder after, change hatch bore diameter in the milling machine mode again.In brief, if provide two hatch bore diameters each other unequal perforation material for repairing is injected described perforation, all follow invention of the present invention spirit and fall into category of the present invention.In addition, about the execution mode of step 22 shown in Figure 2, please further consult following explanation.
See also Fig. 4, Fig. 5 and Fig. 6, it fills up the schematic diagram of preferred embodiment of the method for perforation for the present invention.Fig. 4, Fig. 5 and perforation shown in Figure 6 are filled up operation and are based on step 21 shown in Figure 2 and 22.As shown in Figure 4, the each other unequal perforation 420 (being positioned on the holder body 425) of two hatch bore diameters at first is provided, in addition, (for example fill up perforation 420 better effects if for making, avoid boring a hole and 420 when filling up, produce air in wherein), the present embodiment forms chamfering (bevel) 440 in addition around perforation 420 upper opening, is wherein filling up perforation 420 o'clock, can material for repairing be injected into perforation 420 by upper opening.Note that chamfering 440 can be rounding (fillet) or bevelling (chamfer).
Next, as shown in Figure 5, material for repairing 470 can be injected into perforation 420 by perforation 420 upper opening.Because material for repairing 470 may be oozed out by the lower opening of perforation 420, therefore can utilize veil 450 to cover perforation 420 lower opening (namely, cover another opening with respect to the opening that material for repairing is injected into perforation), ooze out to prevent material for repairing 470.In addition, in the present embodiment, the step that material for repairing 470 is injected perforation 420 can comprise: decide injection angles θ according to an injection rate V at least; And using the syringe 460 with injection caliber C, the material for repairing 470 that will have specific density SC injects perforation 420 with injection rate V and injection angles θ.Definition mode θ about above-mentioned injection angles, for injecting vectorial V_IP by the injection end I on the syringe 460 and the decanting point P of the surperficial S at the upper opening place that is injected into perforation 420 formed, and decanting point P is between the normal vector V_N on the surperficial S, formed angle less than the right angle.
In addition, because the dense consistence of material for repairing 470 tools, therefore when injection caliber C was too small, syringe 460 may damage in injection process, so the ratio that injection caliber C and material for repairing 470 are injected between the aperture Φ of 420 the upper opening of boring a hole can be set as between 0.2 and 0.9.Moreover, in this embodiment, when the unit of injection rate V is milliliters/second, and the unit of specific density SC is when being thousand centipoises, the ratio of the value of the initial value of injection rate V and specific density SC can be set as between 0.0002 and 0.125 so that bore a hole 420 to fill up quality better.
In the variation example of this embodiment, the method of filling up perforation 420 can comprise in addition: in material for repairing 470 is injected the process of perforation 420, adjust injection rate V, to obtain the better quality of filling up, the step of wherein adjusting injection rate V comprises: be injected into the 420 interior injection rates of boring a hole according to material for repairing 470, adjusted injection rate V.
As shown in Figure 6, injection rate in material for repairing 470 has been injected into perforation 420 is greater than predetermined injection rate, and inject the material for repairing 470 of perforation in 420 and become when solid-state, can utilize and grind or the modes such as etching (are for example removed material for repairing 470 that at least a portion exposes to perforation 420, material for repairing 4701), so that the flat appearance after filling up satisfies commercial demand.In addition, in an execution mode, material for repairing 470 can be the resiniferous material of bag, yet in another execution mode, material for repairing 470 can be the material that comprises conductive materials.
In the process of material for repairing being injected perforation, except obtaining the better quality of filling up by adjusting injection rate, also can dynamically adjust injection angles according to described injection rate, make and fill up quality and more promote.For instance, the step of dynamically adjusting described injection angles according to described injection rate can comprise: when described injection rate promotes, increase described injection angles; And when described injection rate reduces, reduce described injection angles.In other words, in another variation example of this embodiment, when the initial value of injection rate V according to the specific density SC of material for repairing 470 after determining, injection rate V can be injected into the 420 interior injection rates of boring a hole according to material for repairing 470, adjust injection rate V, and injection angles θ also can according to the injection rate V that adjusts, dynamically adjust.Note that the above example explanation that only supplies, is not as restriction of the present invention.For instance, whether the injection rate V also visual material for repairing that is injected in the perforation 420 has the air doping wherein to adjust, or even in the process of filling up perforation 420, fills up time shorten for making, can directly suitably adjust injection rate V, and then suitably adjust injection angles θ.
In addition, by above-mentioned a plurality of embodiment as can be known, the method that the present invention fills up perforation also can be applicable to be positioned at the perforation of non-planar surfaces, and can inject material for repairing to fill up perforation by common die face or master mold face.Therefore, the method that the present invention fills up perforation can be applicable to form at mobile device the technique of antenna, wherein said mobile device can be smart mobile phone (Smart Phone), mobile phone, notebook computer (Notebook), personal navigation instrument (PND), global positioning system (GPS) device or panel computer (Tablet PC), in addition, the technique that forms antenna can be radium-shine straight forming (Laser Direct Structuring, LDS) technology, or other can be formed in dwi hastasana the related process technology on the holder of tool three-dimensional surface.
Comprehensively above-mentioned, the method that the present invention fills up perforation not only can residual air in described perforation and the flat appearance after filling up, thereby can be satisfied with the demand of filling up arbitrary perforation on any geometrical plane, even the quality that can keep the element of filling up (for example, fully fill up the perforation on the holder with antenna, to guarantee the antenna quality), therefore can be widely used in various electronic goods and the various technique that on mobile device, forms antenna.
The above only is the preferred embodiments of the present invention, and all equalizations of doing according to claim of the present invention change and modify, and all should belong to covering scope of the present invention.
Claims (18)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW100129830A TWI454320B (en) | 2011-08-19 | 2011-08-19 | Method of filling throught hole |
| TW100129830 | 2011-08-19 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102957075A true CN102957075A (en) | 2013-03-06 |
| CN102957075B CN102957075B (en) | 2015-05-13 |
Family
ID=47765510
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201110278187.8A Active CN102957075B (en) | 2011-08-19 | 2011-09-19 | Method for filling up perforation |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN102957075B (en) |
| TW (1) | TWI454320B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105665229A (en) * | 2016-03-08 | 2016-06-15 | 广东欧珀移动通信有限公司 | Brushing method and device |
Citations (4)
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|---|---|---|---|---|
| CN1627562A (en) * | 2003-12-09 | 2005-06-15 | 国际商业机器公司 | Apparatus and methods for constructing antennas using vias as radiating elements formed in a substrate |
| JP2007192587A (en) * | 2006-01-17 | 2007-08-02 | Seiko Instruments Inc | Wiring board for dynamic quantity sensor, manufacturing method of the wiring board for dynamic quantity sensor, and dynamic quantity sensor |
| CN101681818A (en) * | 2007-05-25 | 2010-03-24 | Esi电子科技工业公司 | Be used to pass the technology that metallic packaging forms the conductive contact of isolating |
| CN101686620A (en) * | 2008-09-24 | 2010-03-31 | 比亚迪股份有限公司 | Through-hole dust proofing method and electronic product shell adopting same |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03260296A (en) * | 1990-03-09 | 1991-11-20 | Kyoritsu Kagaku Sangyo Kk | Filling up method of hole of connection box for segment |
| JP3708005B2 (en) * | 2000-08-09 | 2005-10-19 | 日本無線株式会社 | Hole filling method for printed wiring boards |
| TW507347B (en) * | 2001-09-13 | 2002-10-21 | Via Tech Inc | Method for filling plating through hole on package substrate and mechanism thereof |
| JP3976564B2 (en) * | 2001-12-20 | 2007-09-19 | 日本リーロナール有限会社 | Via filling method |
| TWI255675B (en) * | 2004-10-13 | 2006-05-21 | Nan Ya Printed Circuit Board C | Hole plugging method for printed circuit boards |
| JP5147779B2 (en) * | 2009-04-16 | 2013-02-20 | 新光電気工業株式会社 | Wiring board manufacturing method and semiconductor package manufacturing method |
| CN102064130B (en) * | 2009-11-12 | 2013-03-13 | 上海华虹Nec电子有限公司 | Method for forming SDMOS contact hole shape beneficial for filling metal |
-
2011
- 2011-08-19 TW TW100129830A patent/TWI454320B/en active
- 2011-09-19 CN CN201110278187.8A patent/CN102957075B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1627562A (en) * | 2003-12-09 | 2005-06-15 | 国际商业机器公司 | Apparatus and methods for constructing antennas using vias as radiating elements formed in a substrate |
| JP2007192587A (en) * | 2006-01-17 | 2007-08-02 | Seiko Instruments Inc | Wiring board for dynamic quantity sensor, manufacturing method of the wiring board for dynamic quantity sensor, and dynamic quantity sensor |
| CN101681818A (en) * | 2007-05-25 | 2010-03-24 | Esi电子科技工业公司 | Be used to pass the technology that metallic packaging forms the conductive contact of isolating |
| CN101686620A (en) * | 2008-09-24 | 2010-03-31 | 比亚迪股份有限公司 | Through-hole dust proofing method and electronic product shell adopting same |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105665229A (en) * | 2016-03-08 | 2016-06-15 | 广东欧珀移动通信有限公司 | Brushing method and device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN102957075B (en) | 2015-05-13 |
| TWI454320B (en) | 2014-10-01 |
| TW201309393A (en) | 2013-03-01 |
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Effective date of registration: 20200409 Address after: No. 6 Lianhui Street, Xixing Street, Binjiang District, Hangzhou City, Zhejiang Province Patentee after: Silergy Semiconductor Technology (Hangzhou) Ltd. Address before: Chinese Taiwan New Taipei City Patentee before: JIENG TAI INTERNATIONAL ELECTRIC Corp. |
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Effective date of registration: 20200616 Address after: 210042 302, Xuanwu Road, 7, Xuanwu Road, Xuanwu District, Nanjing, Jiangsu, China, 7 Patentee after: Nanjing Sili Microelectronics Technology Co.,Ltd. Address before: 310051 No. 6 Lianhui Street, Xixing Street, Binjiang District, Hangzhou City, Zhejiang Province Patentee before: Silergy Semiconductor Technology (Hangzhou) Ltd. |
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