CN102866750A - Storage heat dissipation device - Google Patents
Storage heat dissipation device Download PDFInfo
- Publication number
- CN102866750A CN102866750A CN2011101895513A CN201110189551A CN102866750A CN 102866750 A CN102866750 A CN 102866750A CN 2011101895513 A CN2011101895513 A CN 2011101895513A CN 201110189551 A CN201110189551 A CN 201110189551A CN 102866750 A CN102866750 A CN 102866750A
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- Prior art keywords
- heat
- conducting plate
- plate
- radiating device
- radiator
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Abstract
The invention relates to a storage heat dissipation device which is used for dissipating heat for a storage and comprises a fixed frame and a heat dissipating structure. The fixed frame is used for accommodating the storage; the heat dissipating structure comprises a first thermal conductive plate, a second thermal conductive plate and a radiating fin; the first thermal conductive plate and the second thermal conductive plate are fixed on the fixed frame; the radiating fin is arranged between the first thermal conductive plate and the second thermal conductive plate; and the storage is pressed against the heat dissipating structure.
Description
Technical field
The present invention relates to a kind of heat abstractor, espespecially a kind of radiating device for memory.
Background technology
Generally speaking, the storeies such as hard disk, CD-ROM drive and floppy drive are installed all in server or the PC, described storer is fixed in the fixed mount.Because storer needs for a long time work, therefore effectively reducing memory temperature on heat dissipation design is an important target.Yet described fixed mount mainly is to be used for fixing described storer, its radiating efficiency extreme difference.
Summary of the invention
In view of above content, be necessary to provide a kind of radiating device for memory that can improve radiating efficiency.
A kind of radiating device for memory, in order to storer is dispelled the heat, include fixed mount and radiator structure, described fixed mount is in order to accommodate described storer, described radiator structure includes the first heat-conducting plate, the second heat-conducting plate and heat radiator, described the first heat-conducting plate and the second heat-conducting plate are fixed in the described fixed mount, and described heat radiator is arranged between described the first heat-conducting plate and the second heat-conducting plate, and described storer and described radiator structure are conflicted.
Preferably, described fixed mount includes biside plate, top board and base plate, and two opposite edges of described top board and described base plate connect respectively two opposite edges of a described side plate.
Preferably, the xsect of described biside plate, described top board and described base plate roughly is a rectangle, the cross-sectional area of two described side plates about equally, the cross-sectional area of described top board and base plate is about equally.
Preferably, described the first heat-conducting plate is parallel with described the second heat-conducting plate.
Preferably, the shape of described the first heat-conducting plate and described the second heat-conducting plate roughly is a rectangle.
Preferably, described the first heat-conducting plate is vertical with two described side plates respectively with described the second heat-conducting plate.
Preferably, the cross-sectional area of the cross-sectional area of described the first heat-conducting plate and the second heat-conducting plate and described top board and base plate about equally.
Preferably, described heat radiator has several, and the parallel described side plate of each heat radiator is vertical respectively with described the first heat-conducting plate and described the second heat-conducting plate.
Preferably, the shape of each heat radiator is all roughly the same and be a rectangle, and the cross-sectional area of each heat radiator about equally.
Preferably, described radiator structure is separated into two resettlement sections with described fixed mount, each resettlement section is in order to accommodate a described storer, described radiator structure when described fixed mount is accommodated two described storeies between described two storeies, described two storeies respectively with described the first heat-conducting plate and described the second heat-conducting plate against.
Compared with prior art, in above-mentioned radiating device for memory, described radiator structure is installed in the described fixed mount, increase heat radiator between described the first heat-conducting plate and the second heat-conducting plate, increase the area of dissipation of fixed mount, improved the radiating efficiency of described fixed mount.
Description of drawings
Fig. 1 is a three-dimensional exploded view of radiating device for memory one preferred embodiment of the present invention and storer.
Fig. 2 is one of the radiating device for memory among Fig. 1 three-dimensional assembly diagram.
Fig. 3 is that Fig. 2 is along the cut-open view of III-III direction.
Fig. 4 is the three-dimensional assembly diagram of Fig. 1.
The main element symbol description
| Fixed |
10 |
| |
11 |
| The resettlement section | 111 |
| Fixed |
113 |
| |
13 |
| |
14 |
| |
30 |
| The first heat-conducting |
31 |
| The second heat-conducting |
33 |
| |
35 |
| |
50 |
| The |
51 |
| |
511 |
| The |
53 |
| |
55 |
| |
57 |
Following embodiment further specifies the present invention in connection with above-mentioned accompanying drawing.
Embodiment
See also Fig. 1, in the present invention's one better embodiment, a radiating device for memory in order to the heat radiation of two storeies 50, includes a fixed mount 10 and is fixed on a radiator structure 30 on the described fixed mount 10.Described storer 50 can be hard disk, CD-ROM drive, floppy drive or other data-carrier stores.
Please refer to Fig. 1 to Fig. 3, described fixed mount 10 comprises two parallel side plates 11 and connects respectively a top board 13 and a base plate 14 of two parallel institute side plate 11 opposite edges.In one embodiment, described top board 13 is parallel with described base plate 14, and described top board 13 and base plate 14 be vertical two described side plates 11 respectively.In another embodiment, the xsect of every side plate 11, described top board 13 and base plate 14 all roughly is a rectangle, the cross-sectional area of two parallel described side plates 11 about equally, the cross-sectional area of described top board 13 and described base plate 14 about equally, two described side plates 11, described top board 13 and described base plate 14 consist of a rectangular parallelepiped.
Described radiator structure 30 includes one first heat-conducting plate 31, one second heat-conducting plate 33 and some heat radiator 35, and described heat radiator 35 is arranged between described the first heat-conducting plate 31 and described the second heat-conducting plate 33, and vertical with two described side plates 11 respectively.In one embodiment, described the first heat-conducting plate 31 is parallel with described the second heat-conducting plate 33.In another embodiment, described the first heat-conducting plate 31 roughly is a rectangle with the shape of the xsect of described the second heat-conducting plate 33, described the first heat-conducting plate 31 is connected with two described side plates 11 respectively with two opposite edges of described the second heat-conducting plate 33, the cross-sectional area of described the first heat-conducting plate 31 and the second heat-conducting plate 33 about equally and with the cross-sectional area of described top board 13 and base plate 14 about equally.The opposite edges of each heat radiator 35 connect respectively described the first heat-conducting plate 31 and the second heat-conducting plate 33.In one embodiment, the shape of each heat radiator 35 is all roughly the same and be a rectangle, the cross-sectional area of each heat radiator 35 about equally, each heat radiator 35 parallel described side plate 11, and vertical with described the first heat-conducting plate 31 and described the second heat-conducting plate 33.
Please refer to Fig. 2, described radiator structure 30 can be fixed in the described fixed mount 10 by welding or other fixed forms, and described radiator structure 30 is separated into up and down two resettlement sections 111 with described fixed mount 10, and each resettlement section 111 can be in order to accommodate a storer 50.Offer respectively four fixed orifices 113 on the described biside plate 11, a corresponding resettlement section 111, the position of two fixed orifices 113 on every side plate 11.
Each storer 50 includes two parallel the first sides 51, connects two parallel the second side 53, upper surface 55 and lower surfaces 56 of two first lateral edge respectively.Offer respectively two mounting holes 511 on the relative position of two described the first sides 51.In one embodiment, the outside surface of each storer 50 roughly is a rectangular parallelepiped.The length of described two first sides 51 roughly with the equal in length of two parallel side plates 11, the length of described the second side 53 is less than the width of described top board 13 or base plate 14.
Please refer to Fig. 4, during assembling, 53 corresponding described resettlement sections 111, one second side with a storer 50, ordering about described storer 50 moves, described storer 50 is contained in the described resettlement section 111, upper surface 55 and the lower surface 56 of described storer 50 are being resisted against on described top board 13 and described the first heat-conducting plate 31 respectively, and make two mounting holes 511 on each first side 51 of described storer 50 corresponding with two fixed orifices 113 on every side plate 11 of fixed mount 10 respectively, use four screws 57 to lock respectively in corresponding fixed orifice 113 and the mounting hole 511, thereby a storer 50 is fixed on the described fixed mount 10.Use identical method, another storer 50 fixedly is contained in the described fixed mount 10, and the upper surface 55 of described storer 50 and lower surface lean respectively on described the second heat-conducting plate 33 and base plate 14.Like this, described two storeies 50 just are housed in the described fixed mount 10, and described radiator structure 30 is between described two storeies 50.
During use, the heat that described storer 50 produces is delivered on the described radiator structure 30, and distributes by described the first heat-conducting plate 31, the second heat-conducting plate 33 and heat radiator 35, thereby effectively described two storeies 50 is dispelled the heat.
To those skilled in the art, can make other corresponding changes or adjustment in conjunction with the actual needs of producing according to invention scheme of the present invention and inventive concept, and these changes and adjustment all should belong to the protection domain of claim of the present invention.
Claims (10)
1. radiating device for memory, in order to storer is dispelled the heat, include fixed mount and radiator structure, described fixed mount is in order to accommodate described storer, it is characterized in that: described radiator structure includes the first heat-conducting plate, the second heat-conducting plate and heat radiator, described the first heat-conducting plate and the second heat-conducting plate are fixed in the described fixed mount, and described heat radiator is arranged between described the first heat-conducting plate and the second heat-conducting plate, and described storer and described radiator structure are conflicted.
2. radiating device for memory according to claim 1, it is characterized in that: described fixed mount includes biside plate, top board and base plate, and two opposite edges of described top board and described base plate connect respectively two opposite edges of a described side plate.
3. radiating device for memory according to claim 2, it is characterized in that: the xsect of described biside plate, described top board and described base plate roughly is a rectangle, the cross-sectional area of two described side plates about equally, the cross-sectional area of described top board and base plate is about equally.
4. radiating device for memory according to claim 1, it is characterized in that: described the first heat-conducting plate is parallel with described the second heat-conducting plate.
5. radiating device for memory according to claim 1, it is characterized in that: the shape of described the first heat-conducting plate and described the second heat-conducting plate roughly is a rectangle.
6. radiating device for memory according to claim 2, it is characterized in that: described the first heat-conducting plate is vertical with two described side plates respectively with described the second heat-conducting plate.
7. radiating device for memory according to claim 2, it is characterized in that: the cross-sectional area of described the first heat-conducting plate and the second heat-conducting plate and the cross-sectional area of described top board and base plate are about equally.
8. radiating device for memory according to claim 2, it is characterized in that: described heat radiator has several, and the parallel described side plate of each heat radiator is vertical respectively with described the first heat-conducting plate and described the second heat-conducting plate.
9. radiating device for memory according to claim 8 is characterized in that: the shape of each heat radiator is all roughly the same and be a rectangle, and the cross-sectional area of each heat radiator about equally.
10. radiating device for memory according to claim 1, it is characterized in that: described radiator structure is separated into two resettlement sections with described fixed mount, each resettlement section is in order to accommodate a described storer, described radiator structure when described fixed mount is accommodated two described storeies between described two storeies, described two storeies respectively with described the first heat-conducting plate and described the second heat-conducting plate against.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011101895513A CN102866750A (en) | 2011-07-07 | 2011-07-07 | Storage heat dissipation device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011101895513A CN102866750A (en) | 2011-07-07 | 2011-07-07 | Storage heat dissipation device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102866750A true CN102866750A (en) | 2013-01-09 |
Family
ID=47445662
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011101895513A Pending CN102866750A (en) | 2011-07-07 | 2011-07-07 | Storage heat dissipation device |
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| Country | Link |
|---|---|
| CN (1) | CN102866750A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2020107296A1 (en) * | 2018-11-28 | 2020-06-04 | 威刚科技股份有限公司 | Dynamic random access memory device having heat dissipation function |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5424916A (en) * | 1989-07-28 | 1995-06-13 | The Charles Stark Draper Laboratory, Inc. | Combination conductive and convective heatsink |
| CN2519316Y (en) * | 2001-12-14 | 2002-10-30 | 威达电股份有限公司 | Multi-tier Active Disk Shelf |
| CN2582048Y (en) * | 2002-10-22 | 2003-10-22 | 郑建荣 | Disk extraction mechanism with cooling function |
| TW200949830A (en) * | 2008-05-23 | 2009-12-01 | Foxconn Tech Co Ltd | Fixing device |
| CN101930782A (en) * | 2009-06-26 | 2010-12-29 | 鸿富锦精密工业（深圳）有限公司 | Hard disk fixing mechanism and electronic device provided with same |
-
2011
- 2011-07-07 CN CN2011101895513A patent/CN102866750A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5424916A (en) * | 1989-07-28 | 1995-06-13 | The Charles Stark Draper Laboratory, Inc. | Combination conductive and convective heatsink |
| CN2519316Y (en) * | 2001-12-14 | 2002-10-30 | 威达电股份有限公司 | Multi-tier Active Disk Shelf |
| CN2582048Y (en) * | 2002-10-22 | 2003-10-22 | 郑建荣 | Disk extraction mechanism with cooling function |
| TW200949830A (en) * | 2008-05-23 | 2009-12-01 | Foxconn Tech Co Ltd | Fixing device |
| CN101930782A (en) * | 2009-06-26 | 2010-12-29 | 鸿富锦精密工业（深圳）有限公司 | Hard disk fixing mechanism and electronic device provided with same |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2020107296A1 (en) * | 2018-11-28 | 2020-06-04 | 威刚科技股份有限公司 | Dynamic random access memory device having heat dissipation function |
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Application publication date: 20130109 |
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