CN102592961A - Wafer discharging and arranging machine - Google Patents
Wafer discharging and arranging machine Download PDFInfo
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Abstract
Description
技术领域 technical field
本发明为一种工具机,尤指一种整合有取下晶片功能、筛选排列晶片功能、洗净晶片及研磨盘功能的晶片下片排片机。The invention relates to a machine tool, in particular to a wafer unloading and arranging machine integrated with the functions of removing wafers, screening and arranging wafers, cleaning wafers and grinding discs.
背景技术 Background technique
现有技术的LED晶片制程中,其中有一道手续为研磨晶片,其为将复数晶片上蜡并黏置于一陶瓷或铁制的研磨盘上,再以该研磨盘设置于相对应的研磨机中进行晶片研磨的减薄作业,各晶片于研磨完毕后即可将研磨盘由机器中取出,标准的制程为以有机溶剂将蜡溶解再将晶片由研磨盘上取下,此道手续须以人工运用晶片镊子或安全刮刀将晶片由研磨盘上取下,再以人工筛选破损的晶片以及使用溶剂清洗晶片,然而现有技术的下晶片手续具有下述的缺点;In the LED chip manufacturing process of the prior art, one of the procedures is to grind the wafer, which is to wax a plurality of wafers and stick them on a ceramic or iron grinding disc, and then set the grinding disc on the corresponding grinding machine The thinning operation of wafer grinding is carried out. After each wafer is ground, the grinding disc can be taken out of the machine. The standard process is to dissolve the wax with an organic solvent and then remove the wafer from the grinding disc. This procedure must be Manually use wafer tweezers or a safety scraper to remove the wafer from the grinding disc, and then manually screen the damaged wafer and use a solvent to clean the wafer. However, the wafer removal procedure in the prior art has the following disadvantages;
首先,在制程中使用的溶剂通常具有致癌成分,明显对操作人员的健康有害,再者,以人工方式将晶片取下,不但生产速度慢,而且常因为人员操作的疏失造成晶片破损,提升了生产的不良率,故现有技术的晶片制程实有待进一步改良。First of all, the solvents used in the manufacturing process usually have carcinogenic ingredients, which are obviously harmful to the health of the operators. Furthermore, the manual removal of the wafers not only slows down the production speed, but also often causes wafer damage due to negligence in personnel operations, which increases the The defective rate of production, so the wafer manufacturing process of the prior art needs to be further improved.
发明内容 Contents of the invention
有鉴于现有技术晶片的减薄制程具有人工操作使得产生破片的机率增加并且会因接触溶剂有影响身体健康的风险,因此本发明的发明目的在于提供一种工具机,其可整合制程并提高生产良率。In view of the fact that the wafer thinning process in the prior art has manual operations that increase the probability of chipping and may affect the health of the human body due to exposure to solvents, the purpose of the present invention is to provide a machine tool that can integrate the process and improve Production yield.
本发明为一种晶片下片排片机,其包括有一下片机、一排片筛片机与一洗净机;The present invention is a wafer unloading machine, which includes a unloading machine, a wafer screening machine and a cleaning machine;
该下片机的机架上设有一进料输送装置、复数个溶剂槽、至少一纯水槽、一升降装置、一横移装置以及一出料输送装置;The frame of the unloading machine is provided with a feeding conveying device, a plurality of solvent tanks, at least one pure water tank, a lifting device, a transverse moving device and a discharging conveying device;
该进料输送装置设置于机架的一端处;The feeding conveying device is arranged at one end of the frame;
该溶剂槽内设有溶剂,各溶剂槽依序设置于机架上并以其一端相邻于该进料输送装置;The solvent tank is provided with a solvent, and each solvent tank is sequentially arranged on the frame and one end thereof is adjacent to the feeding conveying device;
该纯水槽内设有纯水,该纯水槽设置于溶剂槽的另一端的机架上;The pure water tank is provided with pure water, and the pure water tank is arranged on the frame at the other end of the solvent tank;
该升降装置包括有复数升降臂,各升降臂分别设置于各槽体的上方处,该升降臂可降下位于槽体内或升起位于槽体上方;The lifting device includes a plurality of lifting arms, each lifting arm is respectively arranged above each tank body, and the lifting arm can be lowered to be located in the tank body or raised to be positioned above the tank body;
该横移装置设置于各槽体的一侧,该横移装置具有复数个推杆,在各槽体的一侧分别设有一推杆,该推杆可朝向于机架的一端推动或收回;The traversing device is arranged on one side of each trough, and the traversing device has a plurality of push rods, and a push rod is respectively provided on one side of each trough, and the push rod can be pushed or retracted towards one end of the frame;
该出料输送装置设置于机体的另一端处;The discharge conveying device is arranged at the other end of the machine body;
该排片筛片机包括有一机械手臂与一视觉检测装置;该机械手臂相邻于该下片机的出料输送装置;该视觉检测装置的位置相对于该机械手臂;The sheet arranging and screening machine includes a mechanical arm and a visual detection device; the mechanical arm is adjacent to the discharge conveying device of the unloading machine; the position of the visual detection device is relative to the mechanical arm;
该洗净机的机架上设有一进料输送装置、至少一溶剂槽、复数个纯水槽、至少一氮气烘干装置、一升降装置、一横移装置以及一出料输送装置;The frame of the washing machine is provided with a feeding conveying device, at least one solvent tank, a plurality of pure water tanks, at least one nitrogen drying device, a lifting device, a transverse moving device and a discharging conveying device;
该进料输送装置设置于机架的一端并相邻于该机械手臂;The feeding conveying device is arranged at one end of the frame and adjacent to the mechanical arm;
该溶剂槽内设有溶剂,该溶剂槽设置在机架上并相邻于进料输送装置处;The solvent tank is provided with a solvent, and the solvent tank is arranged on the frame and adjacent to the feeding conveying device;
该纯水槽内设有纯水,各纯水槽依序设置于机架上并以一端相邻于该溶剂槽;The pure water tank is provided with pure water, and each pure water tank is sequentially arranged on the frame and one end is adjacent to the solvent tank;
该氮气烘干装置设置于机架上并相邻于该纯水槽的另一端;The nitrogen drying device is arranged on the frame and adjacent to the other end of the pure water tank;
该升降装置包括有复数升降臂,各升降臂分别设置于各槽体的上方处,该升降臂可降下位于槽体内或升起位于槽体上方;The lifting device includes a plurality of lifting arms, each lifting arm is respectively arranged above each tank body, and the lifting arm can be lowered to be located in the tank body or raised to be positioned above the tank body;
该横移装置设置于各槽体的一侧,该横移装置具有复数个推杆,在各槽体的一侧分别设有一推杆,该推杆可朝向于机架的一端推动或收回;The traversing device is arranged on one side of each trough, and the traversing device has a plurality of push rods, and a push rod is respectively provided on one side of each trough, and the push rod can be pushed or retracted towards one end of the frame;
该出料输送装置设置于机架的另一端,并相邻于该氮气烘干装置。The discharge conveying device is arranged at the other end of the frame, and is adjacent to the nitrogen drying device.
所述的晶片下片排片机,其中该下片机的各溶剂槽内设有电热器以及超音波装置,该电热器可对溶剂进行加热;The wafer unloading machine, wherein each solvent tank of the unloading machine is equipped with an electric heater and an ultrasonic device, and the electric heater can heat the solvent;
该下片机的纯水槽内设有电热器以及超音波装置,该电热器可对纯水进行加热。The pure water tank of the unloading machine is equipped with an electric heater and an ultrasonic device, and the electric heater can heat the pure water.
所述的晶片下片排片机,其中该洗净机的各溶剂槽内设有电热器以及超音波装置,该电热器可对溶剂进行加热;The wafer unloading and arranging machine, wherein each solvent tank of the cleaning machine is equipped with an electric heater and an ultrasonic device, and the electric heater can heat the solvent;
该洗净机的纯水槽内设有电热器以及超音波装置,该电热器可对纯水进行加热。The pure water tank of the washing machine is equipped with an electric heater and an ultrasonic device, and the electric heater can heat the pure water.
所述的晶片下片排片机,其进一步在下片机的机架上设置一吸取装置,该吸取装置包括有一升降机构、一横移机构与一吸盘部,该吸盘部位于该下片机的出料输送装置的上方,该吸盘部可受升降机构与横移机构带动进行升降与横移。The wafer unloading machine is further provided with a suction device on the frame of the unloading machine. The suction device includes a lifting mechanism, a lateral movement mechanism and a suction cup part, and the suction cup part is located at the exit of the unloading machine. Above the material conveying device, the suction cup part can be driven by the lifting mechanism and the traversing mechanism to lift and move laterally.
所述的晶片下片排片机,其进一步在下片机的机架上设置一盘体输送装置,其具有一滑轨、一升降台与一输送带;该输送带设置于机架上并突伸于机架的进料输送装置下方,该滑轨连接设置于该出料输送装置的下方处与该输送带,该升降台与该滑轨为可滑动的结合,该升降台可沿该滑轨升起位于出料输送装置的表面,也可沿该升降滑轨下降位于该输送带表面。The described wafer unloading machine is further provided with a disc conveying device on the frame of the unloading machine, which has a slide rail, a lifting table and a conveyor belt; the conveyor belt is arranged on the frame and protrudes Below the feed conveying device of the frame, the slide rail is connected to the conveyer belt at the bottom of the discharge conveying device, the lifting platform and the slide rail are slidably combined, and the lifting platform can move along the slide rail It can be raised on the surface of the discharge conveying device, and can also be lowered along the lifting slide rail to be located on the surface of the conveyor belt.
所述的晶片下片排片机,其中该下片机的横移装置包括有一横移推臂,该横移推臂位于各液体槽的一侧面,各推杆与该横移推臂垂直连接并位于液体槽的一侧。The wafer unloading machine, wherein the traversing device of the unloading machine includes a traversing push arm, the traversing push arm is located on one side of each liquid tank, and each push rod is vertically connected with the traversing push arm and Located on the side of the liquid tank.
所述的晶片下片排片机,其中该洗净机的横移装置包括有一横移推臂,该横移推臂位于各液体槽的一侧面,各推杆与该横移推臂垂直连接并位于液体槽的一侧。Said wafer unloading machine, wherein the traversing device of the cleaning machine includes a traversing push arm, the traversing push arm is located on one side of each liquid tank, and each push rod is vertically connected with the traversing push arm and Located on the side of the liquid tank.
所述的晶片下片排片机,其中该机械手臂是一种六轴式的机械手臂。In the wafer unloading and arranging machine, the mechanical arm is a six-axis mechanical arm.
藉上述的技术手段,以下片机对研磨盘进行取下晶片的作业,并可将研磨盘清洗并回收,以排片筛片机排除破损的晶片,并将良好的晶片置入一晶片载座中,该洗净机可对晶片载座内的晶片进行清洗,再将清洗完的晶片以氮气烘干,本发明将取下晶片、清洗研磨盘、筛选破片、排列晶片以及清洗晶片五项生产制程整合,并可藉由连接控制系统达到标准化、自动化的生产,可有效增加产能,并排除因人为疏失造成晶片破损的不良率,有效降低人事成本,也可进一步避免操作人员接触溶剂产生影响身体健康的风险,以符合各国的设厂规范。By means of the above-mentioned technical means, the lower chip machine can remove the wafer from the grinding disc, and the grinding disc can be cleaned and recovered, and the damaged wafer can be removed by the sorting and screening machine, and the good wafer can be placed in a wafer carrier , the cleaning machine can clean the wafers in the wafer carrier, and then dry the cleaned wafers with nitrogen gas. The present invention will take off the wafers, clean the grinding disc, screen the broken pieces, arrange the wafers and clean the wafers. Five production processes Integration, and can achieve standardized and automated production by connecting the control system, which can effectively increase production capacity, eliminate the defect rate of chip damage caused by human error, effectively reduce personnel costs, and further prevent operators from contacting solvents that affect their health risks in order to comply with the factory specifications of various countries.
附图说明 Description of drawings
图1为本发明的上视图。Figure 1 is a top view of the present invention.
图2为本发明的下片机的上视图。Fig. 2 is a top view of the unloading machine of the present invention.
图3为本发明的下片机的侧视图。Fig. 3 is a side view of the unloading machine of the present invention.
图4为本发明的排片筛片机的上视图。Fig. 4 is a top view of the sheet arranging and screening machine of the present invention.
图5为本发明的排片筛片机的侧视图。Fig. 5 is a side view of the sheet arranging and screening machine of the present invention.
图6为本发明的洗净机的上视图。Fig. 6 is a top view of the washing machine of the present invention.
图7为本发明的洗净机的侧视图。Fig. 7 is a side view of the washing machine of the present invention.
图8为本发明的研磨盘与承载台的立体外观图。FIG. 8 is a three-dimensional appearance view of the grinding disc and the carrying table of the present invention.
图9为本发明的研磨盘与承载台的剖面示意图。FIG. 9 is a schematic cross-sectional view of the grinding disc and the carrying table of the present invention.
附图标记说明Explanation of reference signs
10下片机 11机架10
111外端 112内端111
113轨道113 tracks
12进料输送装置 121横移气缸12 Input delivery device 121 horizontal movement cylinder
122升降气缸 1221伸缩杆122 lift cylinder 1221 telescopic rod
13液体槽13 liquid tank
131、132、133、134、135溶剂槽131, 132, 133, 134, 135 solvent tank
136、137纯水槽 138电热器136, 137
139超音波设备139 Ultrasonic equipment
14升降装置 141升降气缸14
142升降滑轨 143升降座142 lifting slide rails 143 lifting seat
144升降臂 145叉架144 lifting arm 145 fork
15横移装置15 traverse device
151横移推臂 152推杆151
16出料输送装置 161出料平台16
1611入料端 1612出料端1611 input end
162吸取装置 1621升降机构162 Suction device 1621 Lifting mechanism
1622横移机构 1623吸盘部1622 Traversing mechanism
17盘体输送装置17 Tray conveying device
171滑轨 172升降台171 slide rails 172 lift table
173输送带 18溶剂循环槽173
20排片筛片机 21机架20 racks and sieving
22机械手臂 23视觉检测装置22
30洗净机 31机架30
311内端 312外端311
313轨道313 tracks
32进料输送装置 321输送带32
322升降气缸322 lifting cylinder
33液体槽 331溶剂槽33
332、333、334纯水槽332, 333, 334 pure water tank
335电热器 336超音波设备335
34氮气烘干装置 35升降装置34
351升降气缸 352升降滑轨351
353升降座 354升降臂353
355叉架355 fork
36横移装置36 traverse device
361横移推臂 362推杆361
37出料输送装置 371输送带37
372升降气缸372 lifting cylinder
40研磨盘 41承载台40
42晶片载座 50晶片42
具体实施方式 Detailed ways
本发明的晶片下片排片机,如图1所示,其包括有一下片机10、一排片筛片机20与一洗净机30;The wafer unloading machine of the present invention, as shown in FIG. 1 , includes a unloading
该下片机10,请参阅图2及图3所示,其包括有一机架11、一进料输送装置12、复数个液体槽13、一升降装置14、一横移装置15、一出料输送装置16、一盘体输送装置17与一溶剂循环槽18;This unloading
该机架11为一架体,其具有一外端111与一内端112,并于机架11上设有复数个轨道113,各轨道113间以一间隔设置;The
该进料输送装置12设置于机架11的外端111处,其包括有相互连接的一横移气缸121与一升降气缸122,该横移汽121可朝向机架11的外端111方向将该升降汽缸122推出或收回,该升降汽缸122具有一可顶升或下降的伸缩杆1221,该升缩杆1221于顶端设有一可承载物件的平台,该进料输送装置12可将平台上的物件以横移汽缸121朝向机架11的外端111推移再以升降气缸122顶升而位于机架11内;The
该液体槽13为一中空槽体,各液体槽内设有液体、电热器138与超音波设备139,各液体槽13包括有五个内设有溶剂的溶剂槽131、132、133、134、135与两个内设有纯水的纯水槽136、137,该电热器138可对液体槽13内的液体进行加热,该超音波设备139为现有技术,其可于液体内产生真空气泡,溶剂槽131、132、133、134、135与纯水槽136、137沿外端111至内端112的方向依序设置于该机架11上,并且各溶剂槽13顶端的两侧与该轨道113相连接;The
该升降装置14设置于机架11上,其包括有一升降汽缸141、复数个升降滑轨142、复数个升降座143以及复数个升降臂144,该升降滑轨142直立设置于机架11上,该升降座143与该升降滑轨142为可滑动的互相结合,该升降气缸141可驱动该升降座143于升降滑轨142上进行上升或下降的位移,该升降臂144的顶端与该升降座143连接,该升降臂144的底端设有一可于顶面承载物件的叉架145,该升降臂144于升降座143上升时可位于各液体槽13的上方处,该升降臂144的叉架145于升降座143下降时可位于各液体槽13内部;The lifting
该横移装置15设置于机架11上,其包括有一横移气缸(图中未示)、一横移推臂151与复数个推杆152,该横移推臂151设置于各液体槽13的一侧处,该横移推臂151的臂体上突伸有复数个推杆152,在两相邻的液体槽13间设置一推杆152,且于该进料输送装置12的上方设有一推杆152,该横移气缸可推移该横移推臂151朝向机架11内端112的方向推出或收回,该横移推臂151可带动各推杆152朝向机架11内端112的方向推出或收回;The
该出料输送装置16,其包括有一出料平台161与一吸取装置162;该出料平台161的顶面可承载物件,且该出料平台具有一入料端1611与一出料端1612,该出料平台161以入料端1611连接该纯水槽137旁的轨道113;该吸取装置162包括有一升降气缸1621、一横移气缸1622与一吸盘部1623,该吸盘部1623相对于该出料平台161的上方处,该吸盘部1623可以底部将位于出料平台161上的物件吸起或放下,并可受该升降气缸1621与横移气缸1622带动进行升降及横向的位移;The
该盘体输送装置17包括有一滑轨171、一升降台172以及一输送带173,该输送带173设置于机架11下部并可由一马达(图中未示)驱动位移,该输送带173可将物件由机架11的内端112输送至外端111,该滑轨171垂直设置于该出料平台161的入料端1611与该输送带173间,该升降台172设置于该滑轨171上并具有一升降气缸1721,该升降台172可以升降气缸1721驱动以沿该滑轨181进行上升或下降的位移,该升降台172的顶面于上升后位于出料输送装置16的入料端1611表面,在下降后位于输送带173的表面;The
该溶剂循环槽18位于机架11上,其内部设有溶剂并与各溶剂槽131、132、133、134、135相互连通,该溶剂循环槽18可对各溶剂槽131、132、133、134、135内的溶剂进行循环更新;This
该排片筛片机20,请配合参阅图4及图5所示,其包括有一机架21、一机械手臂22与一视觉检测装置23;The sheet arranging and
该机架21为一架体,该架体设置于该下片部10的内端112的一侧;The
该机械手臂22设置于该机架21上,其为一六轴式的机械手臂22,可进行多方向的转动,该机械手臂22可以前端夹取物件或放下;The
该视觉检测装置23为一现有技术,其设置于该下片机10的机架11上并朝向于该机械手臂22,该视觉检测装置23可与机械手臂22配合运作;The
该洗净机30,请参阅图6及图7所示,其包括有一机架31、一进料输送装置32、复数个液体槽33、至少一氮气烘干装置34、一升降装置35、一横移装置36与一出料输送装置37;This cleaning
该机架31为一架体,其具有一内端311与外端312,该机架31的内端311位于机械手臂22的一侧,并于机架31上设有复数个轨道313,各轨道313间以一间隔设置;The
该进料输送装置32设置于机架31的内端311处,其包括有一可受马达(图中未示)驱动旋转的输送带321与一升降气缸322,该输送带321可输送物件至升降气缸322处,该升降气缸322可将物件顶升进入机架31的内端311处;The
该液体槽33为一内设有液体的中空槽体,其包括有一个内设有溶剂的溶剂槽331以及三个内设有纯水的纯水槽332、333、334,该溶剂槽331、纯水槽332、纯水槽333与纯水槽334沿内端311至外端312的方向依序设置于该机架31上,各液体槽33的顶端两侧分别与该轨道313连接,各槽体内设有电热器335,该电热器335可对液体槽33内的液体进行加热,并分别于溶剂槽331与纯水槽332、333内设有超音波设备336,该超音波设备336为现有技术,其可于上述溶剂槽331与纯水槽332、333内产生真空的气泡;The
该氮气烘干装置34设置于机架31的相邻于纯水槽334处,该氮气烘干装置34顶端两侧分别与该轨道313相连接,且其一侧的轨道313与该纯水槽334相连接,该氮气烘干装置34可对内部的物件进行烘干;The
该升降装置35设置于机架31上,其包括有一升降汽缸351、复数个升降滑轨352、复数个升降座353以及复数个升降臂354,该升降滑轨352直立设置于机架31上,该升降座353与该升降滑轨352为可滑动的互相结合,该升降气缸351可驱动该升降座353于升降滑轨352上进行上升或下降的位移,该升降臂354的顶端与该升降座353连接,该升降臂354的底端设有一可于顶面承载物件的叉架355,该升降臂354于升降座353上升时可位于各液体槽33的上方处,各升降臂354的叉架355于升降座353下降时可位于各液体槽33及氮气烘干装置34内部;The lifting
该横移装置36设置于机架31上,其包括有一横移气缸(图中未示)、一横移推臂361与复数个推杆362,该横移推臂361设置于各液体槽33的一侧处,该横移推臂361的臂体上突伸有复数个推杆362,在两相邻的液体槽33间设置一推杆362,且于该进料输送装置32的上方设有一推杆362,该横移气缸可推移该横移推臂361朝向机架31外端312的方向推出或收回,该横移推臂361可带动各推杆362朝向机架31外端312的方向推出或收回;The
该出料输送装置37设置于机架31的外端312处,其包括有一可受马达(图中未示)驱动旋转的输送带371与一升降气缸372,该升降气缸372可将机架31的外端312处的物件降下,并连接该输送带371以将该物件远离该机架31方向输送;The
本发明在使用时配合一研磨盘40、一承载台41与一晶片载座42使用,请参阅图8及图9所示,该研磨盘40为一圆形盘体,其一端面以蜡黏有复数晶片50,该承载台41为一块体,块体侧面相对于研磨盘40具有晶片50的侧面形成一结合面411,并于该结合面411内对应于各晶片50的位置凹设有复数个容置槽412,并于各容置槽412表面穿设有一流道413,以提供研磨盘40与承载台41结合时,液体可透过该流道413流入或流出该容置槽412;该晶片载座42为一块体,其可承载复数片晶片50;When the present invention is in use, it is used with a grinding
本发明在实际使用时,将该研磨盘40与承载台41互相结合,以将黏置于研磨盘40上的各晶片50位于承载台40的各容置槽412内,将该结合后的研磨盘40与承载台41以下片机10处的进料输送装置12运送进入机架11的外端111处,以该横移装置15的推杆152相对于该研磨盘40与承载台41的侧面并沿该轨道113推移,使该研磨盘40与承载台41位于该溶剂槽131的上方的升降臂144的叉架145上,以该升降装置14的升降臂144将该研磨盘40与承载台41下降至溶剂槽131处进行清洗,溶剂可沿承载台41底面的流道413流入容置槽412内部对晶片50与研磨盘40间的蜡质进行溶解,再将该升降臂144升起带动该研磨盘40与承载台41位于溶剂槽131的上方处,该容置槽412内的溶剂可沿流道413流出,该横移装置15可由推杆152推动该研磨盘40与承载台41至下一升降臂144处,并依此步骤依序以溶剂槽132、133、134、135以及纯水槽136、137对研磨盘40与晶片间的蜡质进行溶解与清洗,再以推杆152推动该研磨盘40与承载台41进入出料平台161的入料端1611,以吸取装置162的吸盘部1623将研磨盘40与承载台41共同吸附升起并朝向出料平台161的出料端1612移动,该吸盘部1623将吸起的承载台41降下并位于该出料端1612处,该吸盘部1623再将该研磨盘40移至出料平台161的入料端1611并降下,使该研磨盘40位于升降台172的上方,该升降台172可将研磨盘40降下至输送带173处并向机架11的外端111输送;该出料平台161上的承载台41内的晶片50此时可被机械手臂22夹取并以视觉检测装置23检查是否有破损情形,如无破损情形该机械手臂22将夹取该晶片50至洗净部30的进料输送装置32上的晶片载座42内,该晶片载座42可由进料输送装置32带动进入洗净机30的机架31内端311下方并由该升降气缸322顶升,以该横移装置36的推杆362相对于该晶片载座42的侧面并沿该轨道313推移,使该晶片载座42位于该溶剂槽331的上方的升降臂354的叉架355上,以该升降装置35的升降臂354将该晶片载座42下降至溶剂槽331处进行清洗再上升,并依此步骤依序将该晶片载座42下降位于各液体槽33进行清洗再上升,以该横移装置36带动前进至下一个液体槽33处,该晶片载座42于纯水槽334清洗完毕后将由升降臂354带动而进入氮气烘干装置34将晶片50上的水分烘干,再经由机架31外端312的出料输送装置37输出。When the present invention is actually used, the grinding disc 40 and the carrying table 41 are combined with each other, so that each wafer 50 stuck on the grinding disc 40 is located in each accommodating groove 412 of the carrying table 40, and the combined grinding The disc 40 and the carrier table 41 are transported into the outer end 111 of the frame 11 by the feed conveying device 12 at the lower chip machine 10, and the push rod 152 of the traverse device 15 is relatively to the sides of the grinding disc 40 and the carrier table 41 And move along this track 113, make this grinding disc 40 and carrying platform 41 be positioned on the fork frame 145 of lifting arm 144 above this solvent tank 131, with the lifting arm 144 of this lifting device 14 this grinding disc 40 and carrying platform 41 descends to the solvent tank 131 for cleaning, the solvent can flow into the interior of the accommodating tank 412 along the flow channel 413 on the bottom surface of the carrier 41 to dissolve the wax between the wafer 50 and the grinding disc 40, and then lift the lifting arm 144 to drive The grinding disc 40 and the carrying platform 41 are located above the solvent tank 131, the solvent in the accommodating tank 412 can flow out along the flow channel 413, and the traversing device 15 can be pushed by the push rod 152 to push the grinding disc 40 and the carrying platform 41 to At the next lifting arm 144, and follow this step to dissolve and clean the wax between the grinding disc 40 and the wafer with solvent tanks 132, 133, 134, 135 and pure water tanks 136, 137, and then push with push rod 152 The grinding disc 40 and the carrying platform 41 enter the feeding end 1611 of the discharge platform 161, and the grinding disc 40 and the carrying platform 41 are jointly sucked up by the suction cup portion 1623 of the suction device 162 and moved towards the discharging end 1612 of the discharging platform 161. Move, the suction cup part 1623 lowers the carrier table 41 sucked up and is positioned at the
由上述可知本发明藉此将晶片取下、清洗研磨盘、筛选破片、排列晶片以及清洗晶片五项生产制程整合,并可藉由将下片机、排片筛片机与洗净机连接控制系统达到标准化、自动化的生产,可有效增加产能,并排除因人为疏失造成晶片破损的不良率,有效降低人事成本,更避免操作人员接触溶剂产生致癌风险,以进一步符合各国的设厂规范。From the above, it can be seen that the present invention integrates the five production processes of wafer removal, cleaning of grinding discs, screening of fragments, arraying of wafers, and cleaning of wafers, and can be achieved by connecting the unloading machine, wafer sorting and screening machine and cleaning machine to the control system Achieving standardized and automated production can effectively increase production capacity, eliminate the defect rate of wafer damage caused by human error, effectively reduce personnel costs, and avoid the risk of cancer caused by operators' contact with solvents, so as to further comply with the factory establishment regulations of various countries.
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