CN102363326A - Silicon chip cutting machine - Google Patents
Silicon chip cutting machine Download PDFInfo
- Publication number
- CN102363326A CN102363326A CN2011101735054A CN201110173505A CN102363326A CN 102363326 A CN102363326 A CN 102363326A CN 2011101735054 A CN2011101735054 A CN 2011101735054A CN 201110173505 A CN201110173505 A CN 201110173505A CN 102363326 A CN102363326 A CN 102363326A
- Authority
- CN
- China
- Prior art keywords
- glass plate
- silicon chip
- framework
- supporting plate
- cutting machine
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 18
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 18
- 239000010703 silicon Substances 0.000 title claims abstract description 18
- 238000005520 cutting process Methods 0.000 title abstract description 6
- 239000011521 glass Substances 0.000 claims abstract description 25
- 238000004519 manufacturing process Methods 0.000 abstract description 3
- 239000004484 Briquette Substances 0.000 description 6
- 238000004026 adhesive bonding Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 229910000831 Steel Inorganic materials 0.000 description 2
- 239000012467 final product Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000004570 mortar (masonry) Substances 0.000 description 1
- -1 supporting plate Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Landscapes
- Processing Of Stones Or Stones Resemblance Materials (AREA)
Abstract
The invention provides a silicon chip cutting machine, which comprises a support plate, a glass plate and a silicon block, wherein the support plate is detachably connected into a whole with the glass plate through a connecting device. The support plate is detachably connected into the whole with the glass plate through the connecting device, so when the silicon block needs to be replaced, the replacement can be carried out through taking down the glass plate, the operation is convenient, the production efficiency is improved, and in addition, the silicon chip cutting machine has a simple structure.
Description
Technical field
The present invention relates to a kind of cutting machine, particularly a kind of silicon chip cutter belongs to the technical field of silicon chip process equipment.
Background technology
In the slicing processes of existing silicon chip, utilize steel wire to drive mortar and carry out cutting operation, existing silicon chip cutter sweep; Comprise silico briquette, supporting plate, glass plate, wherein, said supporting plate is connected on the glass plate through gluing; Again through steel wire cutting silicon chip; The silicon chip cutter sweep of this structure is because glass plate and supporting plate are through gluing all-in-one-piece, inconvenient operation.
Summary of the invention
Technical problem to be solved by this invention provides a kind of silicon chip cutter easy to operate, simple in structure.
In order to solve the problems of the technologies described above, a kind of silicon chip cutter of the present invention comprises supporting plate, glass plate, silico briquette, and wherein, said supporting plate is through jockey and said glass plate is dismountable links into an integrated entity.
Above-mentioned a kind of silicon chip cutter; Wherein, Said jockey comprises framework, and the bottom surface of said framework is fixedly installed on the said supporting plate, is respectively equipped with a chimb on said framework two medial surfaces; The base of said chimb and said framework forms a gathering sill, and the width of said gathering sill equates with the thickness of said glass plate.
The present invention can realize following beneficial effect:
1, since said supporting plate through jockey with said glass plate is dismountable links into an integrated entity, when the replacing silico briquette, glass plate is taken off, change and get final product, easy to operate and improved production efficiency, in addition, the present invention is simple in structure.
2, because said jockey comprises framework; The bottom surface of framework is fixedly installed on the said supporting plate, is respectively equipped with a chimb on said framework two medial surfaces, and the base of corresponding said chimb and corresponding said framework forms a gathering sill; The width of said gathering sill equates with the thickness of said glass plate; During use, glass plate is directly inserted in the gathering sill, install more convenient.
Description of drawings
Fig. 1 is a structural representation of the present invention.
The specific embodiment
Below in conjunction with accompanying drawing the present invention is described further.
As shown in the figure, in order to solve the problems of the technologies described above a kind of silicon chip cutter of the present invention; Comprise supporting plate 1, glass plate 2, silico briquette 3, silico briquette 3 can be integral through gluing with glass plate 2, and said supporting plate 1 is through jockey and said glass plate 2 dismountable linking into an integrated entity; Because said supporting plate 1 through jockey and said glass plate 2 dismountable linking into an integrated entity, when changing silico briquette, takes off glass plate 2; Change and get final product; Easy to operate and improved production efficiency, in addition, the present invention is simple in structure.
The structure of jockey is unrestricted; In the present embodiment, said jockey comprises framework 11, and underrun welding or other modes of said framework 11 are fixedly installed on the said supporting plate 1; Framework 1 is a groove member; Be respectively equipped with a chimb 12 on 11 liang of medial surfaces of said framework, said chimb 12 forms a gathering sill with the base 13 of said framework 1, and the width of said gathering sill equates with the thickness of said glass plate 2.Because said jockey comprises framework; The bottom surface of framework is fixedly installed on the said supporting plate, is respectively equipped with a chimb on said framework two medial surfaces, and the base of corresponding said chimb and corresponding said framework forms a gathering sill; The width of said gathering sill equates with the thickness of said glass plate; During use, glass plate is directly inserted in the gathering sill, install more convenient.
Here description of the invention and application is illustrative, is not to want that therefore, the present invention does not receive the restriction of present embodiment with scope restriction of the present invention in the above-described embodiments, and the technical scheme that any employing equivalence replacement obtains is all in the scope of the present invention's protection.
Claims (2)
1. a silicon chip cutter comprises supporting plate, glass plate, it is characterized in that, said supporting plate is through jockey and said glass plate is dismountable links into an integrated entity.
2. a kind of according to claim 1 silicon chip cutter; It is characterized in that; Said jockey comprises framework, and the bottom surface of said framework is fixedly installed on the said supporting plate, is respectively equipped with a chimb on said framework two medial surfaces; The base of said chimb and said framework forms a gathering sill, and the width of said gathering sill equates with the thickness of said glass plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011101735054A CN102363326A (en) | 2011-06-27 | 2011-06-27 | Silicon chip cutting machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011101735054A CN102363326A (en) | 2011-06-27 | 2011-06-27 | Silicon chip cutting machine |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102363326A true CN102363326A (en) | 2012-02-29 |
Family
ID=45689934
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011101735054A Pending CN102363326A (en) | 2011-06-27 | 2011-06-27 | Silicon chip cutting machine |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102363326A (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0450275A1 (en) * | 1990-04-04 | 1991-10-09 | Festo KG | Mounting plate |
| EP1555101A1 (en) * | 2003-12-17 | 2005-07-20 | HCT Shaping Systems SA | Wire saw device |
| CN201122255Y (en) * | 2007-11-23 | 2008-09-24 | 联想(北京)有限公司 | Mobile computation equipment with dismountable display screen |
| DE102009023119A1 (en) * | 2009-05-22 | 2010-11-25 | Gebr. Schmid Gmbh & Co. | Support for silicon block, has undercut grooves at upper side averted from silicon block, and movable threaded element with inner thread is provided in groove for engaging screw at upper side in direction perpendicular to groove |
| CN201792431U (en) * | 2010-05-18 | 2011-04-13 | 云南蓝晶科技股份有限公司 | Sapphire crystal axial positioning bonding device |
-
2011
- 2011-06-27 CN CN2011101735054A patent/CN102363326A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0450275A1 (en) * | 1990-04-04 | 1991-10-09 | Festo KG | Mounting plate |
| EP1555101A1 (en) * | 2003-12-17 | 2005-07-20 | HCT Shaping Systems SA | Wire saw device |
| CN201122255Y (en) * | 2007-11-23 | 2008-09-24 | 联想(北京)有限公司 | Mobile computation equipment with dismountable display screen |
| DE102009023119A1 (en) * | 2009-05-22 | 2010-11-25 | Gebr. Schmid Gmbh & Co. | Support for silicon block, has undercut grooves at upper side averted from silicon block, and movable threaded element with inner thread is provided in groove for engaging screw at upper side in direction perpendicular to groove |
| CN201792431U (en) * | 2010-05-18 | 2011-04-13 | 云南蓝晶科技股份有限公司 | Sapphire crystal axial positioning bonding device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20120229 |