CN102353197A - Modularized refrigerating unit and refrigerating strip - Google Patents
Modularized refrigerating unit and refrigerating strip Download PDFInfo
- Publication number
- CN102353197A CN102353197A CN2011102088441A CN201110208844A CN102353197A CN 102353197 A CN102353197 A CN 102353197A CN 2011102088441 A CN2011102088441 A CN 2011102088441A CN 201110208844 A CN201110208844 A CN 201110208844A CN 102353197 A CN102353197 A CN 102353197A
- Authority
- CN
- China
- Prior art keywords
- water
- cooling
- shell
- air
- semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005057 refrigeration Methods 0.000 claims abstract description 54
- 239000004065 semiconductor Substances 0.000 claims abstract description 38
- 238000001816 cooling Methods 0.000 claims abstract description 32
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 29
- 238000009413 insulation Methods 0.000 claims abstract description 12
- 238000010438 heat treatment Methods 0.000 claims abstract description 10
- 238000005265 energy consumption Methods 0.000 abstract description 4
- 238000009423 ventilation Methods 0.000 description 18
- 239000005955 Ferric phosphate Substances 0.000 description 1
- 206010037660 Pyrexia Diseases 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 229940032958 ferric phosphate Drugs 0.000 description 1
- 230000027950 fever generation Effects 0.000 description 1
- WBJZTOZJJYAKHQ-UHFFFAOYSA-K iron(3+) phosphate Chemical compound [Fe+3].[O-]P([O-])([O-])=O WBJZTOZJJYAKHQ-UHFFFAOYSA-K 0.000 description 1
- 229910000399 iron(III) phosphate Inorganic materials 0.000 description 1
- 229910052744 lithium Inorganic materials 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 235000012149 noodles Nutrition 0.000 description 1
- 238000010926 purge Methods 0.000 description 1
Images
Landscapes
- Devices That Are Associated With Refrigeration Equipment (AREA)
Abstract
本发明公开了一种模块化制冷单元，包括一端敞口的外壳、绝热层、水冷腔体和半导体制冷片；外壳的内壁设有一层绝热层，水冷腔体和半导体制冷片均设置在外壳内，半导体制冷片的制热面粘结在水冷腔体上，半导体制冷片的制冷面靠近外壳的敞口端；水冷腔体的一端设有进水管，另一端设有出水管；进水管、出水管以及半导体制冷片的正电源引线和负电源引线均伸出外壳。同时，本发明还公开了一种制冷带。该模块化制冷单元主要由一端敞口的外壳、绝热层、水冷腔体、半导体制冷片和风冷板组成，水冷腔体、半导体制冷片和风冷板均安装在外壳内，体积小，移动更方便；其上的半导体制冷片的制冷面产生的冷量对待降温物体进行冷却，冷却效果更佳，且能耗更低。
The invention discloses a modular refrigeration unit, which comprises an open shell at one end, a heat insulating layer, a water-cooling cavity and a semiconductor cooling chip; a layer of heat insulating layer is arranged on the inner wall of the shell, and the water cooling cavity and the semiconductor cooling chip are arranged in the shell , the heating surface of the semiconductor refrigerating sheet is bonded to the water-cooling cavity, and the cooling surface of the semiconductor refrigerating sheet is close to the open end of the shell; one end of the water-cooling cavity is provided with a water inlet pipe, and the other end is provided with a water outlet pipe; The positive and negative power lead wires of the water pipe and the semiconducting refrigerating sheet all extend out of the shell. At the same time, the invention also discloses a refrigeration belt. The modular refrigeration unit is mainly composed of an open shell at one end, a thermal insulation layer, a water-cooled cavity, a semiconductor cooling plate and an air-cooled plate. It is more convenient; the cold energy generated by the cooling surface of the semiconductor cooling sheet on it cools the object to be cooled, the cooling effect is better, and the energy consumption is lower.
Description
Technical field
The present invention relates to a kind of refrigerating plant, relate in particular to a kind of modular refrigeration unit and refrigeration band.
Background technology
At present, in many laboratories, all need adopt various refrigeration plants that the equipment of heating is cooled off.In the prior art; Mode in the refrigeration that the experiment heat-producing device is carried out roughly has two kinds: a kind of is that recirculated water cools off; Circulating water pipe is close on heat generating components or the equipment; Heat through the recirculated water in the circulating water pipe and heat generating components or equipment generation is carried out heat exchange, thereby takes away the heat energy of heat generating components or equipment generation, but the mode of this employing recirculated water cooling is lowered the temperature; Volume is relatively large; Be difficult for to move, and cooling-down effect is vulnerable to the influence of circulating water temperature, cooling-down effect is not good; The 2nd, adopt air conditioner refrigerating; The cold air that utilizes air conditioner to produce blows to heat-producing device; And then take away the heat energy that heat-producing device and parts produce; But the mode of this employing air conditioner refrigerating is lowered the temperature; Because of volume is bigger, be difficult for moving, can't realize the heat-producing device part is lowered the temperature; Not only cooling-down effect is not good, and energy consumption is big.
Summary of the invention
To the above-mentioned deficiency that prior art exists, the invention provides a kind of being prone to and move, can realize the cooling of equipment local pyrexia body, and energy consumption is low, the modular refrigeration unit that cooling-down effect is better.
Simultaneously, the present invention also provides a kind of refrigeration band of realizing above-mentioned purpose.
Modular refrigeration unit provided by the invention comprises the uncovered shell of an end, heat insulation layer, water-cooled cavity and semiconductor chilling plate; The inwall of said shell is provided with one deck heat insulation layer, and said water-cooled cavity and semiconductor chilling plate all are provided with in the enclosure, and the face of heating of semiconductor chilling plate is bonded on the water-cooled cavity, and the chill surface of semiconductor chilling plate is near the opening end of shell; One end of said water-cooled cavity is provided with water inlet pipe, and the other end is provided with outlet pipe; The positive supply lead-in wire and the negative supply lead-in wire of said water inlet pipe, outlet pipe and semiconductor chilling plate all stretch out shell.
Further, also comprise ventilation panel, the one side of said ventilation panel and the chill surface of semiconductor chilling plate bonding, the another side of ventilation panel is provided with the parallel air channel of number row, is communicated with between the adjacent air channel; One end of said ventilation panel is provided with blast pipe, and the other end is provided with discharge pipe, and said blast pipe and discharge pipe all stretch out shell.
Further again, the both sides of said shell are equipped with and connect soft band.
The present invention also provides a kind of refrigeration band; This refrigeration band is composed in series by several described modular refrigeration unit successively; Water inlet pipe on the adjacent block refrigeration unit, outlet pipe, blast pipe and discharge pipe are connected in series respectively, positive supply lead-in wire on the adjacent block refrigeration unit and the parallel connection respectively of negative supply lead-in wire.
Further, connect through connecting soft band between the said adjacent block refrigeration unit.
Modular refrigeration unit of the present invention and refrigeration band, compared with prior art, the present invention has following advantage:
1, this modular refrigeration unit mainly is made up of the uncovered shell of an end, heat insulation layer, water-cooled cavity, semiconductor chilling plate and ventilation panel, and water-cooled cavity, semiconductor chilling plate and ventilation panel are installed in the shell, and volume is little, moves more convenient.
2, the cold that produces of the chill surface of the semiconductor chilling plate on this modular refrigeration is treated the cooling object and is cooled off, and cooling effect is better, and energy consumption is lower.
3, can connect the refrigeration band by demand, can give the almost object cooling of arbitrary shape.
Description of drawings
Fig. 1 is the front view of modular refrigeration unit;
Fig. 2 is the right perspective view of modular refrigeration unit;
Fig. 3 is the perspective view of bowing of modular refrigeration unit;
Fig. 4 is the stereochemical structure perspective view of modular refrigeration unit.
The specific embodiment
Below in conjunction with the accompanying drawing and the specific embodiment the present invention is done to describe in further detail.
Fig. 1 is the front view of modular refrigeration unit, and Fig. 2 is the right perspective view of modular refrigeration unit, and Fig. 3 is the perspective view of bowing of modular refrigeration unit, and Fig. 4 is the stereochemical structure perspective view of modular refrigeration unit, as shown in the figure.Modular refrigeration unit comprises the uncovered shell of an end 1, heat insulation layer 2, water-cooled cavity 3, semiconductor chilling plate 4 and ventilation panel 5.The inwall of shell 1 is provided with one deck heat insulation layer 2; Water-cooled cavity 3 all is arranged in the shell 1 with semiconductor chilling plate 4; The face of heating of semiconductor chilling plate 4 is bonded on the water-cooled cavity 3; The one side of ventilation panel 5 bonds with the chill surface of semiconductor chilling plate 4; The another side of ventilation panel 4 is with uncovered parallel; And this face is provided with the parallel air channel 51 of number row, is communicated with between the adjacent air channel 51.One end of water-cooled cavity 3 is provided with water inlet pipe 31, and the other end is provided with outlet pipe 32.One end of ventilation panel 5 is provided with blast pipe 52, and the other end is provided with discharge pipe 53, and the positive supply lead-in wire 41 and the negative supply lead-in wire 42 of water inlet pipe 31, outlet pipe 32, blast pipe 52, discharge pipe 53 and semiconductor chilling plate 4 all stretch out shell 1.
The both sides of shell 1 are equipped with to connect softly is with 6, and the soft 6 use flexible materials of being with of this connections are processed, and are convenient to connect each other, and connect more convenient.Be communicated with through arc groove between the adjacent air channel 51; The braking gas resistance; Be convenient to gas communication; The cross section in air channel 51 is U type structure; This face that ventilation panel 5 is provided with air channel 51 is with after the object of waiting to lower the temperature closely contacts; Gas in the air channel 51 of U type structure can fully contact with object surfaces to be lowered the temperature, and treats the cooling object surfaces and purges, and prevents to wait to lower the temperature the object surfaces frosting.
The face that heats of semiconductor chilling plate 4 and the one side of water-cooled cavity 3 are fitted through the mode of bonding; Fit through the mode of bonding in the face that heats of semiconductor chilling plate 4 and a plane of ventilation panel 5, this face that ventilation panel 5 is provided with air channel 51 closely contacts with the object of waiting to lower the temperature.Water-cooled cavity 3, semiconductor chilling plate 4 and ventilation panel 5 are fitted through the mode of bonding and are one; And then the heat insulation layer 2 that on five faces of this fitting body, bonds; This face that is provided with air channel 51 heat insulation layer of need not fitting; The last fitting body that will be bonded with heat insulation layer 2 again is installed in the shell 1, and this face that is provided with air channel 51 is uncovered equal with shell 1.This face that ventilation panel 5 is provided with air channel 51 is with after the object of waiting to lower the temperature closely contact, and heat insulation layer 2 will inside and outsidely completely cut off with shell 1 effectively, and avoiding all around, environment exerts an influence to refrigeration.
When using this modular refrigeration unit, the water inlet pipe on the water-cooled cavity 3 31 is connected with water pump through pipeline, the outlet pipe 32 on the water-cooled cavity 3 is connected with water tank through pipeline; The positive supply of semiconductor chilling plate 4 lead-in wire 41 and negative supply lead-in wire 42 are connected (power supply can use ferric phosphate lithium cell to supply power, and is easy to carry) with power supply; Blast pipe 52 on the ventilation panel 5 is connected with source of the gas, and this face that ventilation panel 5 is provided with air channel 51 closely contacts with the object of waiting to lower the temperature.After semiconductor chilling plate 4 energisings; The chill surface of semiconductor chilling plate 4 feels cold, and derives the cold of semiconductor chilling plates 4 through ventilation panel 5, reduces the temperature of the object of waiting to lower the temperature; Therefore, can be widely used in chemical reaction cooling, experimental facilities cooling and Medical Devices etc.The chill surface of semiconductor chilling plate 4 and the temperature difference between the heating face can reach about 60 degree; In order to prevent to wait to lower the temperature object surperficial frosting in temperature-fall period; Lower the temperature and influence the object of waiting to lower the temperature; Therefore must be at input compressed air in blast pipe 52; Compressed air is treated the cooling object surfaces and is purged, and prevents to wait to lower the temperature the body surface frosting effectively.The heating face heating of semiconductor chilling plate 4; Water flowing in water-cooled cavity 3, mobile water are just carried out heat exchange with the heating face of semiconductor chilling plate 4, reduce the temperature of the heating face of semiconductor chilling plate 4; Keep cooling piece huyashi-chuuka (cold chinese-style noodles) low temperature, strengthen the refrigeration of semiconductor chilling plate 4.
A kind of refrigeration band is composed in series by several modular refrigeration unit successively, softly is with 6 to connect through connecting between the adjacent block refrigeration unit.Water inlet pipe 31 on the adjacent block refrigeration unit, outlet pipe 32, blast pipe 52 and discharge pipe 53 are connected in series respectively, positive supply lead-in wire 41 on the adjacent block refrigeration unit and negative supply lead-in wire 42 parallel connection respectively.This refrigeration band can be chosen the quantity of modular refrigeration unit according to the object surfaces size of waiting to lower the temperature; Through connecting soft 6 connections of being with; The position of modular refrigeration unit fully can be adjusted; Both applicable on rectangular surfaces; Also applicable on periphery, it is very strong to treat cooling object surfaces applicability.
Explanation is at last; Above embodiment is only unrestricted in order to technical scheme of the present invention to be described; Although the present invention is described in detail with reference to preferred embodiment; Those of ordinary skill in the art is to be understood that; Can make amendment or be equal to replacement technical scheme of the present invention; And not breaking away from the aim and the scope of technical scheme of the present invention, it all should be encompassed in the middle of the claim scope of the present invention.
Claims (5)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011102088441A CN102353197A (en) | 2011-07-25 | 2011-07-25 | Modularized refrigerating unit and refrigerating strip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011102088441A CN102353197A (en) | 2011-07-25 | 2011-07-25 | Modularized refrigerating unit and refrigerating strip |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102353197A true CN102353197A (en) | 2012-02-15 |
Family
ID=45576817
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011102088441A Pending CN102353197A (en) | 2011-07-25 | 2011-07-25 | Modularized refrigerating unit and refrigerating strip |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102353197A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109595876A (en) * | 2018-12-29 | 2019-04-09 | 余跃 | A kind of modularization cooling capacity shared device |
| CN109610101A (en) * | 2018-11-29 | 2019-04-12 | 颍上谢桥鑫合服饰有限公司 | A kind of clothing template machine |
| CN110572979A (en) * | 2018-06-06 | 2019-12-13 | 酷码科技股份有限公司 | Cooling system and water cooler |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6182824A (en) * | 1984-10-01 | 1986-04-26 | Shimadzu Corp | Electronic dehumidifier |
| DE3936977A1 (en) * | 1989-11-07 | 1991-05-08 | Manuela Troussas | Cooling device for extracting humidity from air - uses Peltier elements between hot and cold plates supported above condensate collection tank |
| FR2783043A1 (en) * | 1998-09-09 | 2000-03-10 | Richard Bazan | Cooling system for plastics blower molding mandrels has a housing to dissipate the heat containing Peltier effect modules without a heat exchange liquid circuit |
| GB2356044A (en) * | 1999-11-02 | 2001-05-09 | Smc Corp | A pipe cooler and temperature control apparatus |
| CN2569048Y (en) * | 2002-08-22 | 2003-08-27 | 深圳市唯亚太科技股份有限公司 | Small semiconductor air conditioner |
| CN2578753Y (en) * | 2002-10-17 | 2003-10-08 | 奉继军 | Electronic air-conditioner |
| CN101221006A (en) * | 2008-01-30 | 2008-07-16 | 上海微电子装备有限公司 | Temperature control device for improving probability and efficiency of refrigerating system |
| CN201726638U (en) * | 2010-06-21 | 2011-01-26 | 西安亚强电气产品成套有限公司 | Dehumidifying device for airtight box body |
-
2011
- 2011-07-25 CN CN2011102088441A patent/CN102353197A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6182824A (en) * | 1984-10-01 | 1986-04-26 | Shimadzu Corp | Electronic dehumidifier |
| DE3936977A1 (en) * | 1989-11-07 | 1991-05-08 | Manuela Troussas | Cooling device for extracting humidity from air - uses Peltier elements between hot and cold plates supported above condensate collection tank |
| FR2783043A1 (en) * | 1998-09-09 | 2000-03-10 | Richard Bazan | Cooling system for plastics blower molding mandrels has a housing to dissipate the heat containing Peltier effect modules without a heat exchange liquid circuit |
| GB2356044A (en) * | 1999-11-02 | 2001-05-09 | Smc Corp | A pipe cooler and temperature control apparatus |
| CN2569048Y (en) * | 2002-08-22 | 2003-08-27 | 深圳市唯亚太科技股份有限公司 | Small semiconductor air conditioner |
| CN2578753Y (en) * | 2002-10-17 | 2003-10-08 | 奉继军 | Electronic air-conditioner |
| CN101221006A (en) * | 2008-01-30 | 2008-07-16 | 上海微电子装备有限公司 | Temperature control device for improving probability and efficiency of refrigerating system |
| CN201726638U (en) * | 2010-06-21 | 2011-01-26 | 西安亚强电气产品成套有限公司 | Dehumidifying device for airtight box body |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110572979A (en) * | 2018-06-06 | 2019-12-13 | 酷码科技股份有限公司 | Cooling system and water cooler |
| CN110572979B (en) * | 2018-06-06 | 2021-02-26 | 酷码科技股份有限公司 | Cooling system and water-cooling row |
| CN109610101A (en) * | 2018-11-29 | 2019-04-12 | 颍上谢桥鑫合服饰有限公司 | A kind of clothing template machine |
| CN109595876A (en) * | 2018-12-29 | 2019-04-09 | 余跃 | A kind of modularization cooling capacity shared device |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TWI410595B (en) | Thermoelectric drinking apparatus and thermoelectric heat pump | |
| CN102713462A (en) | Refrigeration device | |
| JP2010540845A5 (en) | ||
| CN102573420B (en) | Embedded cabinet air-conditioning refrigeration system | |
| CN102353197A (en) | Modularized refrigerating unit and refrigerating strip | |
| CN109935854A (en) | A kind of humidifier, fuel cell and vehicle | |
| CN205505256U (en) | Integrated natural cooling's modularization refrigeration station system | |
| CN103445682B (en) | Water dispenser and thermoelectric heat pump device used by same | |
| CN202309486U (en) | A frequency converter with air-water cooling and heat dissipation | |
| CN106524567A (en) | Box-type semi-conductor refrigerating device | |
| CN102457162A (en) | Frequency changer with water cooling radiating function | |
| CN204442886U (en) | With the outdoor communication cabinet of transverse-plug type communication equipment | |
| CN215676618U (en) | Refrigerating system | |
| KR100579560B1 (en) | Exhaust Gas Heat Exchanger of Cogeneration System | |
| CN217721805U (en) | Refrigerating system | |
| CN206743766U (en) | A new type of heat dissipation device for electrical equipment | |
| CN214153001U (en) | Air duct device | |
| CN201608166U (en) | Controllable bidirectional cross circulation ventilation device | |
| CN110763046B (en) | Cooling and radiating system and cooling and radiating method for high-temperature heat source equipment | |
| CN211796858U (en) | A cabinet for treatment room | |
| CN110671953B (en) | Heat dissipation cooling system and heat dissipation cooling method for high-temperature heat source equipment | |
| CN207699457U (en) | A kind of vacuum glass closing device with cooling system | |
| KR100759105B1 (en) | High efficiency vacuum device using refrigerant | |
| CN212431393U (en) | Double-effect semiconductor refrigerator | |
| CN220450285U (en) | Cavity cooling system and vapor deposition vacuum equipment |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C12 | Rejection of a patent application after its publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20120215 |