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CN102265293B - 通过带机械连接的射频发射接收装置制造芯片的组装件的方法 - Google Patents

通过带机械连接的射频发射接收装置制造芯片的组装件的方法 Download PDF

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CN102265293B
CN102265293B CN200980151862.1A CN200980151862A CN102265293B CN 102265293 B CN102265293 B CN 102265293B CN 200980151862 A CN200980151862 A CN 200980151862A CN 102265293 B CN102265293 B CN 102265293B
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D.维卡德
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Abstract

本发明涉及用于制造装备有射频发射接收装置的芯片(2)的组装件的方法，所述方法依次包括：在基板(1)上提供多个芯片，每个芯片包括至少一个接收区域(3)；使用电性绝缘的扁平带(4)使组装件的芯片(2)的接收区域(3)串联连接，该带(4)包括多个彼此电性绝缘的金属图案(5)，每个图案(5)界定扁平天线的至少一部分，该天线在天线的至少一个连接区域(6)的位置电性连接到对应的接收区域(3)；以及在基板(1)的位置分离芯片(2)，所述芯片通过所述带(4)彼此机械连接。

Description

通过带机械连接的射频发射接收装置制造芯片的组装件的方法
技术领域
本发明涉及一种制造芯片的组装件的方法，所述芯片装备有射频发射接收装置。
背景技术
装备有射频发射接收装置的微电子芯片可用作电子RFID标签。这些芯片随后配备以天线，并可用于目标的远程识别。
这种标签的传统应用是贮备管理和可追溯性。这些芯片的有源部分一般被高度微型化，即它们的边可小于400μm。这些芯片尽管被微型化但仍然需要天线，天线的尺寸达到对应于芯片的工作频率的波长的数量级。通常，在硅晶片上制作RFID标签的有源部分，然后对每个芯片进行切片，以将其与晶片上现存的其他芯片分离。接着，将芯片放置在印刷电路上，该印刷电路包含RFID标签工作所需的天线。天线一般以印刷在基板上的金属迹线的形式被制作。
在某些应用中，RFID芯片可集成在纤维中以形成纸片(paper sheet)。因而，芯片必须相对薄，厚度为约25μm(芯片及其相关天线)。对于这样的厚度，将芯片转移到其天线上的现有技术不是很可靠，芯片断裂或损坏的可能性高。
发明内容
本发明的目的是提供一种以柔性方式使芯片彼此机械连接的方法，这种方法不存在现有技术的缺点。
此目的通过所附权利要求实现，更具体地通过顺次包括以下步骤的方法实现：
-在基板上制造多个芯片，每个芯片包括至少一个接收区域，
-借助于电性绝缘的扁平带(flat ribbon)将组装件的芯片的接收区域串联连接，该扁平带包括多个彼此电性绝缘的金属图案，形成扁平天线的至少一部分的每个图案经由所述天线的至少一个连接区域电性连接到对应的接收区域，以及
-在基板位置分离芯片，所述芯片通过所述带彼此机械连接。
附图说明
根据本发明的具体实施例的以下描述，其他优势和特征将变得更明显，这些具体实施例仅用于非限制性的示例目的并且在附图中呈现，其中：
图1示出包括实施本方法所需芯片的基板的俯视图。
图2、3和4示出根据本方法的第一实施例的不同步骤，图1的基板的截面视图。
图5示出设计用以连接基板的芯片的带的具体实施例。
图6示出使用图5所示的带的组装件的变型。
图7、8和9示出组装方法的第二实施例。
图10、11和12示出组装方法的第三实施例。
具体实施方式
如图1至图3所示，在基板1上制造多个微电子芯片2，微电子芯片2装备有设计用以形成RFID标签的射频发射接收装置，基板1可以是硅基板。芯片可以是相同或不同。每个芯片2包括至少一个接收区域3。在多个芯片2已被制造到基板上之后，在多个芯片2在基板1的位置被分离之前，多个芯片2通过带4在接收区域3(图1)的位置串联连接。在多个芯片2已被分离之后，芯片通过带彼此机械连接，如图4所示。
当在基板1上制造芯片时，芯片可以以行的形式排列，从而基板包括多个实质上彼此平行的芯片行。带4可串联连接同一行芯片中的芯片，但是也可以以相同的方式(如图1中用相同的带4或者用不同的带4)连接相邻行。带4的宽度优选被确定以使得一旦带4的分别与一行芯片相关的两个相邻部分已被固定到相应的接收区域3，带4的分别与一行芯片相关的两个相邻部分之间没有重叠。当带4被放置于一行芯片的中线上时，带4的最大宽度等于垂直于带4的纵轴的行宽加上分隔两行芯片的距离。由此防止上述重叠。
串联连接芯片2的带在接收区域4的位置是电性绝缘的扁平带4。此带4可以是具有矩形截面的导线或者聚合物膜。采用的聚合物优选为聚酯。如图5所示，带4包括彼此电性绝缘的多个金属图案5。每个图案5形成扁平天线的至少一部分。此天线优选制作在带上，即与带4共面。
扁平天线设计为在串联连接的步骤中电性连接到芯片。此连接在所述天线的至少一个连接区域6到对应的芯片2的接收区域3的位置制作。图5的具体实施例是设计为在每个芯片2的位置形成双极天线的带。因此，根据图5的天线由彼此电性绝缘的两个金属图案5和5’构成。带包括由天线之间的间隔7彼此分离的多个天线。形成天线的两个相邻图案各包括连接区域6，连接区域6设计以分别电性连接同一芯片2的两个接收区域3和3’，如图6。选取图案的长度l1以适合于天线的期望长度，该天线与包含射频发射接收装置的芯片相关联。沿着带4的纵轴的两个图案5和5’的总长度l2为约λ/2，其中λ表示发射接收波段的中心频率的波长。
如图6中，带4能够例如根据天线之间的间隔7的长度相对于基板垂直拉伸，并且在两个相邻芯片之间形成例如半环(half-loop)。可在芯片串联连接的步骤中进行此垂直拉伸，例如在将带4连接到第一芯片上之后且在将带4连接到相邻芯片的接收区域3上之前。
天线之间的间隔7可根据应用类型来确定。为了示例的目的，希望连接天线之间的间隔7的长度较长，从而随后可实现例如以卷盘(reel)或卷筒(roll)的形式的芯片的存储。因此，带优选为柔性的，以允许调节天线之间的间隔7的长度并以卷盘或卷筒的形式存储。
因此，当在基板1的位置通过带4串联连接芯片时，带4相对于基板1的垂直拉伸可实现要获得的卷筒的两个芯片之间的任何类型间隔。换句话说，当执行两个相邻芯片的接收区域3的串联连接时，带4在两个相邻芯片之间相对于基板垂直拉伸，使得芯片已被分离之后，两个相邻芯片以预定距离分离。
例如，通过带4的表面上的金属沉积物获得图案5，且沉积物随后通过化学蚀刻或者通过金属沉积物的局部销蚀(ablation)或者通过本领域技术人员已知的任何其他方法被图案化。根据此方法可以制作任何类型的天线。形成天线的图案的尺寸和形状适用于待连接芯片的发射接收装置和/或RFID标签的使用。此图案可以由铜或铝制成。
芯片2的串联连接步骤可以通过在芯片之上展开带(图1)并且对应待连接芯片2的接收区域3标记对应的天线的每个连接区域6来执行。这样，在接合或者超声焊接之前，每个连接区域6放置为面向对应的接收区域3。为了便于此标记，带4优选为透明的。带的透明性可实现可视(optically)标记，从而将每个连接区域6定位为面向对应的接收区域3。一旦连接区域6被放置与对应的接收区域3接触，则通过本领域技术人员在考虑带4和金属图案5的特性(带的材料的温度制约、应力等)的情况下有可能使用的任何类型的技术，两个区域被彼此电性和机械固定。为了示例的目的，通过接合(导电粘接剂)或者通过超声焊接可执行固定。带4优选确保连接区域6与接收区域3之间的接触，然后施加超声振动以执行焊接。当芯片包括两个接收区域3(图6)时，相关联的天线的连接区域6可相伴随固定。
在每个芯片2的位置执行连接步骤。包括芯片2的基板优选与芯片2的制造期间在电学测试步骤中确定的缺陷的对应表相关联。如果天线之间的间隔可使下一个功能芯片被连接，则可以通过不将它们并入组装件来忽略某些有缺陷的芯片。
如图4所示，基板随后被图案化，以在基板的位置将芯片彼此分离。接着，单独借助于带4通过柔性机械连接使芯片串联连接。在体基板1的情况下以传统方式执行芯片2的分离，例如，通过切片(dicing)(注意不要切到带4并且不要损坏天线)。
由于所有芯片被初始固定到由基板构成的同一刚性支撑件上，因此这种方法有助于带与多个芯片之间的安装。因而，上述操作类似于微电子工业中传统上采用的技术。
在图7至图9所示的第二实施例中，基板1包括形成保持膜的临时支撑件8(图7)。此临时支撑件8初始沉积在基板1的表面上，该表面与包含芯片2的表面相反。如图8所示，通过部分切划(slicing)直至临时支撑件8，芯片2彼此分离。由此，借助于临时支撑件8，芯片2在基板1的位置保持彼此机械固定。可通过任何适当的方法执行芯片的此部分分离、例如通过切片或者等离子体蚀刻。
如图9所示，然后，如上文所述，带4在每个接收区域3的位置被安装到每个芯片2，注意在进行电性连接之前，将与芯片2相关的天线的连接区域6布置为面向对应的接收区域3。然后，去除临时支撑件8，芯片则仅借助于带4形成的柔性机械连接彼此连接(图4)。
在图10所示的第三实施例中，芯片被集成在绝缘体上硅(SOI)类型的基板1上。后者传统上包括有源基板9，设置在支撑基板11上形成的埋入绝缘体10上。埋入绝缘体10和支撑基板11形成基板1的临时支撑件8。以与图8类似的方式，在图11中，芯片在有源基板9的位置被部分分离，且带4安装到每一个芯片。然后，例如通过湿蚀刻埋入绝缘体10(具体地借助于氢氟酸(图4))，芯片从埋入绝缘体和支撑基板11形成的临时支撑件8上分离。此外，也可以通过分割(未示出)使临时支撑件8分离，临时支撑件8于是被固定到芯片但不再提供任何机械功能，如图12。如上文，芯片仅借助于带4保持彼此连接。
通过上文所述的不同方法获得的组装件，可获得多个芯片，各个芯片包括至少一个接收区域3。然后，通过包括多个彼此电性绝缘的金属图案5的电性绝缘的扁平带4，芯片2被串联连接。每个图案5形成扁平天线的至少一部分，扁平天线在所述天线的至少一个连接区域6的位置电性连接到对应的接收区域3。
第二和第三实施例显示包括一个接收区域的芯片。这些实施例当然也可以在每个芯片的位置包括两个(如图6)或者更多的接收区域。
通常，形成在同一基板1(即相同的晶片)上的大量芯片2通过至少一个弹性带4彼此串联连接，在大量芯片2在基板1的位置被彼此分离之前。由此获得柔性菊花链(daisy chain)形式的芯片的组装件，其能够以卷盘或卷筒的形式存储，并且可以在天线之间的间隔7的位置根据需要被切划。上述组装件有利地被聚合物或者任何其他材料涂覆，以提供对外界环境侵蚀的保护。
本发明不限于上文中所述的实施例。具体地，源自不同基板的不同类型的芯片可通过同一个带来连接。组装件的制造可以进一步使用上文中关于不同实施例所述的特征的结合。
这种方法使得RFID芯片能够以执行连接时不损坏芯片的简单的方式连接到它们各自的天线。这些芯片可随后被直接并入纸片中。

Claims (9)

1.一种用于制造装备有射频发射接收装置的芯片(2)的组装件的方法，其特征在于该方法依次包括：
－提供包括多个芯片的基板(1)，每个芯片包括至少一个导电接收区域(3)，
－借助于电性绝缘的扁平带(4)，使所述组装件的芯片(2)的所述导电接收区域(3)串联连接，所述扁平带(4)包括多个彼此电性绝缘的金属图案(5)，每个图案(5)形成扁平天线的至少一部分，所述扁平天线的至少一个连接区域(6)电性连接到对应的导电接收区域(3)，以及
－从所述基板(1)分离所述芯片(2)，所述芯片通过所述扁平带(4)彼此机械连接。
2.根据权利要求1所述的方法，其特征在于每个芯片(2)包括两个导电接收区域(3)，所述扁平带(4)在每个芯片(2)的位置包括两个图案(5，5’)，所述两个图案(5，5’)分别电性连接到所述芯片的所述导电接收区域(3，3’)以形成双极天线。
3.根据权利要求1和2之一的方法，其特征在于通过展开所述扁平带(4)并且通过标记对应于待连接芯片的所述导电接收区域(3)的所述扁平天线的每个连接区域(6)，执行串联连接，在接合或超声焊接之前，每个连接区域(6)被放置为面向对应的导电接收区域(3)。
4.根据权利要求1至2之一所述的方法，其特征在于所述扁平带(4)是聚合物膜。
5.根据权利要求1至2中任一项所述的方法，其特征在于所述扁平带(4)是柔性的以及透明的。
6.根据权利要求1至2中任一项所述的方法，其特征在于图案(5)是由铜或铝制成。
7.根据权利要求1至2中任一项所述的方法，其特征在于所述基板(1)包括临时支撑件(8)，所述方法包括在串联连接所述导电接收区域(3)之前，在所述基板(1)的位置部分切划所述芯片(2)的步骤，当执行所述芯片(2)的分离时，所述临时支撑件(8)被去除。
8.根据权利要求1至2中任一项所述的方法，其特征在于所述芯片(2)的组装件形成卷盘。
9.根据权利要求1至2中任一项所述的方法，其特征在于当执行两个相邻芯片(2)的所述导电接收区域(3)的串联连接时，所述扁平带(4)在所述两个相邻芯片之间相对于所述基板垂直拉伸，使得在所述芯片被分离之后，所述两个相邻芯片以预定距离分离。
CN200980151862.1A 2008-12-22 2009-12-21 通过带机械连接的射频发射接收装置制造芯片的组装件的方法 Expired - Fee Related CN102265293B (zh)

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