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CN101312045A - Configured Metal Frame Piezoelectric Microactuator with Lower Stiffness Suspension Design - Google Patents

Configured Metal Frame Piezoelectric Microactuator with Lower Stiffness Suspension Design Download PDF

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CN101312045A
CN101312045A CNA2008100051506A CN200810005150A CN101312045A CN 101312045 A CN101312045 A CN 101312045A CN A2008100051506 A CNA2008100051506 A CN A2008100051506A CN 200810005150 A CN200810005150 A CN 200810005150A CN 101312045 A CN101312045 A CN 101312045A
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arm
frame assembly
assembly
pattern
support
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姚明高
白石一雅
解贻如
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SAE Magnetics HK Ltd
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SAE Magnetics HK Ltd
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  • Moving Of The Head To Find And Align With The Track (AREA)

Abstract

A frame assembly having a lower stiffness suspension design and a method of making the frame assembly are disclosed. In one embodiment, the framing assembly pattern is cut from a thin planar material, such as metal. The pattern is then bent to form a frame assembly having a base, two arms, and a support for a web. In an alternative embodiment, the base member includes a rear support member and a support base. In another embodiment, excess material surrounding the pattern is cut away to allow for the most efficient use of the material.

Description

具有较低刚度悬挂设计的配置金属框架压电微致动器 Configured Metal Frame Piezoelectric Microactuator with Lower Stiffness Suspension Design

本申请是申请人新科实业有限公司于2002年6月26日提交的同名中国专利申请No.02829226x的分案申请。This application is a divisional application of the Chinese patent application No.02829226x with the same name submitted by the applicant Xinke Industrial Co., Ltd. on June 26, 2002.

技术领域 technical field

本发明涉及磁硬盘驱动器。更具体地,本发明涉及制造用于微致动器的框架组件的方法。The present invention relates to magnetic hard disk drives. More specifically, the present invention relates to methods of manufacturing frame assemblies for microactuators.

背景技术 Background technique

现有技术中,使用不同的方法提高硬盘驱动器的记录密度。图1示出具有配置为读写磁硬盘104的典型驱动臂102的典型盘驱动器。典型地,音圈电机(VCM)106用于控制硬驱动器的臂102在磁硬盘104上的运动。由于仅由VCM106定位记录头108时所存在的固有公差(动态移动),现在用微致动器110“微调”头108的位置。VCM 106用于粗调,然后微致动器110以更小的刻度矫正定位以补偿VCM 106(与臂102)的公差。这样可以获得较小的可记录轨迹宽度,增加硬驱动器的“每英寸轨迹”(TPI)值(增加记录密度)。In the prior art, different methods are used to increase the recording density of hard disk drives. FIG. 1 shows a typical disk drive with a typical drive arm 102 configured to read from and write to a magnetic hard disk 104 . Typically, a voice coil motor (VCM) 106 is used to control the movement of the hard drive arm 102 over the magnetic hard drive 104 . Microactuators 110 are now used to "fine tune" the position of head 108 due to inherent tolerances (dynamic movement) that exist when recording head 108 is positioned by VCM 106 alone. The VCM 106 is used for coarse adjustment, and the microactuator 110 is then corrected in smaller increments to compensate for tolerances of the VCM 106 (and arm 102). This results in a smaller recordable track width, increasing the "tracks per inch" (TPI) value of the hard drive (increasing recording density).

图2提供了现有技术中所用的微致动器的示例。典型地,滑块202(包含一个读写磁头,未示出)用于在磁盘表面104上方保持预定的飞行高度(见图1)。微致动器可以具有柔性桁条204,将支撑器件206与滑块容纳单元208连接,使得滑块202可以独立于驱动臂102运动(见图1)。电磁组件或电磁/铁磁组件(未示出)可以用来提供相对于臂102对滑块/头202的方向/位置的微调(见图1)。Figure 2 provides an example of a microactuator used in the prior art. Typically, slider 202 (including a read/write head, not shown) is used to maintain a predetermined flying height above disk surface 104 (see FIG. 1). The microactuator may have flexible stringers 204 connecting a support device 206 to a slider housing unit 208 so that the slider 202 can move independently of the drive arm 102 (see FIG. 1 ). An electromagnetic assembly or an electromagnetic/ferromagnetic assembly (not shown) may be used to provide fine adjustment of the orientation/position of the slider/head 202 relative to the arm 102 (see FIG. 1 ).

现有设计往往具有动态问题。这些问题的原因在于由环境、处理、或制造引起的弯曲电缆变化。此外,现有的微致动器框架通常由诸如锆钛酸铅(PZT)或氧化锆等材料制成,往往比较重,从而影响头万向节组件的磁读写头在盘上快速移动的能力。某些微致动器还具有产生微粒的问题,这有可能损坏盘驱动器中的部分。较轻和刚度较小的微致动器能够显著改善盘驱动器的动态性能。Existing designs often have dynamic issues. These problems are due to variations in bending cables caused by environment, handling, or manufacturing. In addition, existing microactuator frames are typically made of materials such as lead zirconate titanate (PZT) or zirconia, which tend to be relatively heavy, affecting the ability of the head gimbal assembly's magnetic read/write head to move rapidly across the disk. ability. Certain microactuators also have problems with particle generation, which can damage parts in the disk drive. Lighter and less rigid microactuators can significantly improve the dynamic performance of disk drives.

发明内容Contents of the invention

根据本发明的一个方面,一种微致动器框架组件,包括:According to one aspect of the present invention, a microactuator frame assembly includes:

从单个薄平面材料模制而成的基准件,其将装配到头万向节组件上;A reference piece molded from a single thin planar material that will fit onto the head gimbal assembly;

从该单个薄平面材料模制而成的第一臂,其弯曲成在所述基准件的第一侧垂直于所述基准件的表面;和a first arm molded from the single thin planar material bent perpendicular to the surface of the datum at the first side of the datum; and

从该单个薄平面材料模制而成的第二臂,其弯曲成在所述基准件的第二侧垂直于所述基准件的表面;a second arm molded from the single thin planar material bent perpendicular to the surface of the datum on a second side of the datum;

第一支撑件,用于装配到磁头上的一个连接板,该第一支撑件弯曲为垂直于所述第一臂;和a first support for fitting to a connecting plate on the magnetic head, the first support bent perpendicular to said first arm; and

用于装配到磁头上的该连接板的第二支撑件,该第二支撑件弯曲为垂直于所述第二臂。A second support of the connection plate for fitting onto the magnetic head, the second support being bent perpendicular to said second arm.

根据本发明的另一个方面,一个系统,包括:According to another aspect of the present invention, a system includes:

包含数据的盘;disk containing data;

具有悬挂组件的头万向节组件;head gimbal assembly with suspension assembly;

用于从所述盘读取所述数据的磁读写头;a magnetic read/write head for reading said data from said disc;

印刷电路组件,用于控制该磁读写头;a printed circuit assembly for controlling the magnetic read-write head;

将所述磁读写头与印刷电路组件电耦合的连接板;和a connection plate electrically coupling the magnetic read/write head to a printed circuit assembly; and

从单个薄平面材料模制而成的框架组件,用于将所述磁读写头装配到所述头万向节组件上,其中该框架组件包括:a frame assembly molded from a single thin planar material for assembling said magnetic read/write head to said head gimbal assembly, wherein the frame assembly comprises:

用于装配到所述头万向节组件的基准件;datum for assembly to said head gimbal assembly;

弯曲成在所述基准件的第一侧与所述基准件的表面垂直的第一臂;a first arm bent perpendicular to a surface of the datum on a first side of the datum;

弯曲成在所述基准件的第二侧与所述基准件的表面垂直的第二臂。A second arm bent perpendicular to the surface of the datum on a second side of the datum.

根据本发明的又一个方面,一种方法,包括:According to yet another aspect of the present invention, a method includes:

从一个薄平面材料产生用于一个微致动器的框架组件图案,该框架组件图案包括:A frame assembly pattern for a microactuator is generated from a thin planar material, the frame assembly pattern comprising:

用于装配到头万向节组件的基准件,Datums for assembly to head gimbal assemblies,

第一臂,和first arm, and

第二臂;second arm;

将所述第一臂弯曲到垂直于所述基准件的位置;bending the first arm to a position perpendicular to the datum;

将一个第一支撑件弯曲为垂直于该第一臂的位置,该第一支撑件用于装配到一个连接板,所述连接板将磁头与一个印刷电路组件电耦合;bending a first support member to be perpendicular to the position of the first arm, the first support member is adapted to be assembled to a connection board, and the connection board electrically couples the magnetic head to a printed circuit assembly;

将所述第二臂弯曲到垂直于所述基准件的位置;和bending the second arm to a position perpendicular to the datum; and

将一个用于装配到所述连接板的第二支撑件弯曲为垂直于该第二臂的位置。A second support for fitting to the web is bent perpendicular to the position of the second arm.

附图说明 Description of drawings

图1示出现有技术中所用的包括配置为读写磁硬盘的驱动臂的盘驱动器的内部视图;Figure 1 shows an internal view of a disk drive as used in the prior art including a drive arm configured to read and write to a magnetic hard disk;

图2示出现有技术中所用的微致动器;Fig. 2 shows the microactuator used in the prior art;

图3a-b示出具有根据本发明原理的U形微致动器的硬盘驱动头万向节装置(HGA);Figures 3a-b illustrate a hard disk drive head gimbal assembly (HGA) with a U-shaped microactuator according to the principles of the present invention;

图4a-b示出框架组件的一个实施例;Figures 4a-b illustrate one embodiment of a frame assembly;

图5a-c示出本发明中使用的磁读写头、压电材料条纹、和HGA的实施例;Figures 5a-c illustrate embodiments of magnetic read/write heads, piezoelectric material stripes, and HGAs used in the present invention;

图6a-b示出将框架组件装配到头万向节组件的方法;Figures 6a-b illustrate a method of assembling a frame assembly to a head gimbal assembly;

图7a-b示出将磁读写头和压电材料条纹装配到框架组件的方法;Figures 7a-b illustrate a method of assembling a magnetic read/write head and stripes of piezoelectric material to a frame assembly;

图8a-d示出制作框架组件的第一种方法;Figures 8a-d illustrate a first method of making a frame assembly;

图9a-d示出制作框架组件的第二种方法;Figures 9a-d illustrate a second method of making a frame assembly;

图10a-b示出框架组件的一种可选设计;Figures 10a-b illustrate an alternative design of the frame assembly;

图11a-e示出制作上述可选框架组件的第一种方法;Figures 11a-e illustrate a first method of making the optional frame assembly described above;

图12a-e示出制作上述可选框架组件的第二种方法。Figures 12a-e illustrate a second method of making the optional frame assembly described above.

具体实施方式 Detailed ways

公开了一种具有降低刚度设计的框架组件和制造该框架组件的方法。在一个实施例中,从一片薄平面材料如类似金属的不锈钢切割框架组件图案。然后弯曲该图案,以形成具有基准件、两个臂、和用于连接板的支架的框架组件。在一个可选实施例中,基准件包括一个后部支架和一个支撑基准件。在另一实施例中,围绕图案的多于材料被切去,以便允许最有效利用材料。由该方法制造的配置PZT金属框微致动器往往具有大于1400G垂直倾斜下落冲击的高冲击性能,每20+/-20V激励电压2.5μm峰-峰值的高位移,以及大于250kHz的高谐振频率。A frame assembly having a reduced stiffness design and a method of making the frame assembly are disclosed. In one embodiment, the frame assembly pattern is cut from a sheet of thin planar material, such as metal-like stainless steel. The pattern is then bent to form a frame assembly with a datum, two arms, and brackets for connecting the plates. In an alternative embodiment, the datum includes a rear bracket and a supporting datum. In another embodiment, excess material surrounding the pattern is cut away to allow for the most efficient use of material. Microactuators configured with PZT metal frames fabricated by this method tend to have high shock performance greater than 1400G vertically inclined drop shock, high displacement of 2.5μm peak-to-peak value per 20+/-20V excitation voltage, and high resonance frequency greater than 250kHz .

图3a以上下颠倒的方向描述了具有U形微致动器的硬盘驱动头万向节组件(HGA)的一个实施例。在一个实施例中,磁读写头或滑块302装配到框架组件304上,形成一个U形微致动器。在另一个实施例中,U形微致动器具有压电锆钛酸铅(PZT)梁(臂)306,附着在框架组件304每一侧上的臂308上。在一个实施例中,印刷电路组件310电耦合到滑块302,以控制读写功能。微致动器306装配到悬挂组件312,悬挂组件是头万向节组件(HGA)314的一部分。在HGA316中切出第一孔316以减小重量。第二孔318允许HGA314安装在枢轴上。图3b以相反的方向示出该实施例。Figure 3a depicts an embodiment of a hard disk drive head gimbal assembly (HGA) with U-shaped microactuators in an upside-down orientation. In one embodiment, a magnetic read/write head or slider 302 is mounted to a frame assembly 304 to form a U-shaped microactuator. In another embodiment, a U-shaped microactuator has piezoelectric lead zirconate titanate (PZT) beams (arms) 306 attached to arms 308 on each side of frame assembly 304 . In one embodiment, printed circuit assembly 310 is electrically coupled to slider 302 to control read and write functions. Microactuator 306 is mounted to suspension assembly 312 , which is part of head gimbal assembly (HGA) 314 . A first hole 316 is cut in the HGA 316 to reduce weight. Second hole 318 allows HGA 314 to be mounted on a pivot. Figure 3b shows this embodiment in the opposite direction.

图4a-b示出框架组件402的一个实施例,该框架组件用于产生微致动器,和将微致动器附着于滑块302和HGA314。图4a示出框架组件的一个实施例的顶视图。在一个实施例中,框架组件402具有基准件404,两个臂406从该基准件延伸出来。在另一个实施例中,每个臂406具有从该臂延伸的支撑件408。在一个实施例中,支撑件408在两个臂406之间。图4b示出框架组件的一个实施例的侧视图。在一个实施例中,支撑件408在与基准件404平行但不同的一个平面内,以便在滑块302与悬挂舌312之间保持一个平行的间隙。在一个实施例中,框架组件402为金属,例如不锈钢。Figures 4a-b illustrate one embodiment of a frame assembly 402 for creating a microactuator and attaching the microactuator to slider 302 and HGA 314. Figure 4a shows a top view of one embodiment of a frame assembly. In one embodiment, the frame assembly 402 has a datum 404 from which two arms 406 extend. In another embodiment, each arm 406 has a support 408 extending therefrom. In one embodiment, the support 408 is between the two arms 406 . Figure 4b shows a side view of one embodiment of a frame assembly. In one embodiment, the support member 408 is in a plane parallel to but different from the reference member 404 so as to maintain a parallel gap between the slider 302 and the suspension tongue 312 . In one embodiment, frame assembly 402 is metal, such as stainless steel.

图5a-c示出各个组件的实施例,当这些组件装配到框架组件402时将形成HGA314和具有读写头302的微致动器。图5a示出读写头302的一个实施例。图5b示出两条PZT材料306。在一个实施例中,两个电接触衬垫502在每条PZT材料306的外部。图5c示出HGA314的一个实施例。该HGA具有悬挂组件或悬挂舌312以便装配到框架组件上。在另一实施例中,HGA314具有连接板504,其允许印刷电路组件310电耦合到磁读写头302。在一个实施例中,滑块电衬垫506与微致动器电衬垫508固定在连接板504上。在一个实施例中,两个突出的梁510装配到悬挂舌312上。每个突出的梁具有一个弯头514以维持悬挂舌312与承载梁512之间的平行空间。FIGS. 5 a - c illustrate embodiments of various components that, when assembled to the frame assembly 402 , will form the HGA 314 and the microactuator with the read/write head 302 . One embodiment of a read/write head 302 is shown in FIG. 5 a. FIG. 5b shows two strips of PZT material 306 . In one embodiment, two electrical contact pads 502 are on the outside of each strip of PZT material 306 . One embodiment of HGA314 is shown in FIG. 5c. The HGA has a suspension assembly or tongue 312 for fitting to the frame assembly. In another embodiment, the HGA 314 has a connection plate 504 that allows the printed circuit assembly 310 to be electrically coupled to the magnetic read/write head 302 . In one embodiment, slider electrical pads 506 and microactuator electrical pads 508 are affixed to connection board 504 . In one embodiment, two protruding beams 510 are fitted to the suspension tongue 312 . Each protruding beam has a bend 514 to maintain a parallel space between the suspension tongue 312 and the load beam 512 .

图6a示出装配在HGA314上的框架组件402的一个实施例的顶视图。基准件404装配到HGA314的悬挂舌312。在一个实施例中,基准件404通过焊接装配到悬挂舌312。在一个替换实施例中,基准件404使用紫外线固化的环氧树脂装配到悬挂舌312。连接板504装配在支撑件408上。在一个实施例中,连接板504通过激光焊接装配到支撑件408。在一个替换实施例中,连接板504使用紫外线固化的环氧树脂装配到支撑件408。图6b示出装配在HGA314上的框架组件402的一个实施例的侧视图。支撑件408位于连接板504与悬挂舌312之间。基准件404在HGA314外部的一侧装配到悬挂舌312。在一个实施例中,基准件404与支撑件408的平行平面之间的不同有助于在连接板504或微致动器框架支撑件408与悬挂舌312之间维持平行间隙。在一个实施例中,一个突起602有助于突出的梁510在悬挂舌312与承载梁512之间维持平行的间隙。FIG. 6 a shows a top view of one embodiment of frame assembly 402 assembled on HGA 314 . Datum 404 fits to hanging tongue 312 of HGA 314 . In one embodiment, the fiducial 404 is assembled to the suspension tongue 312 by welding. In an alternate embodiment, fiducial 404 is mounted to suspension tongue 312 using UV cured epoxy. The connection plate 504 is assembled on the support 408 . In one embodiment, the connection plate 504 is assembled to the support 408 by laser welding. In an alternative embodiment, the connection plate 504 is mounted to the support 408 using UV cured epoxy. FIG. 6 b shows a side view of one embodiment of frame assembly 402 assembled on HGA 314 . The support 408 is located between the connecting plate 504 and the suspension tongue 312 . The datum 404 is fitted to the suspension tongue 312 on a side outside the HGA 314 . In one embodiment, the difference between the parallel planes of the fiducial 404 and the support 408 helps maintain a parallel gap between the connection plate 504 or microactuator frame support 408 and the suspension tongue 312 . In one embodiment, a protrusion 602 helps the protruding beam 510 maintain a parallel gap between the suspension tongue 312 and the load beam 512 .

图7a示出装配到框架组件402的两条PZT材料306的一个实施例的顶视图。在一个实施例中,每条PZT材料306装配到框架组件402的一个臂406。在另一实施例中,两条PZT材料306的外部的每个接触衬垫502电耦合到连接板504上固定的微致动器电衬垫508。FIG. 7 a shows a top view of one embodiment of strips of PZT material 306 assembled to frame assembly 402 . In one embodiment, each strip of PZT material 306 is fitted to one arm 406 of frame assembly 402 . In another embodiment, each contact pad 502 on the outside of the strip of PZT material 306 is electrically coupled to a microactuator electrical pad 508 fixed on the connection plate 504 .

图7b示出装配到HGA314的磁读写头302的一个实施例的顶视图。在一个实施例中,磁读写头装配到连接板504。在另一实施例中,磁读写头还电耦合到固定在连接板504上的滑块电衬垫502。FIG. 7b shows a top view of one embodiment of the magnetic read/write head 302 mounted to the HGA 314. FIG. In one embodiment, a magnetic read/write head is mounted to the connection plate 504 . In another embodiment, the magnetic read/write head is also electrically coupled to the slider electrical pad 502 fixed on the connection plate 504 .

图8a-d示出制作框架组件402的方法的一个实施例。图8a示出一系列框架组件图案802从单个薄平面材料804中切割出来。在图8b中,框架组件预案802与其它图案和剩余材料804分开。在一个实施例中,基准件404、两臂406、和支撑件408都在图案中。图8c中,臂406垂直于基准件404弯曲。图8d中,支撑件408垂直于臂406弯曲。One embodiment of a method of making a frame assembly 402 is shown in FIGS. 8a-d. FIG. 8 a shows a series of frame component patterns 802 cut from a single thin planar material 804 . In FIG. 8 b , the frame assembly pre-plan 802 is separated from the other patterns and remaining material 804 . In one embodiment, the fiducial 404, the arms 406, and the support 408 are all in a pattern. In FIG. 8 c , the arm 406 is bent perpendicular to the reference member 404 . In FIG. 8d the support 408 is bent perpendicular to the arm 406 .

图9a-d示出制作框架组件402的方法的一个可选实施例。图9a示出围绕从单个薄平面材料906中切割出来的一系列框架组件图案904的材料902。在一个实施例中,每个图案包括基准件404、两臂406、和支撑件408。图9b中,臂406垂直于基准件404弯曲。图9c中,支撑件408垂直于臂406弯曲。在图9d中,单个框架组件402与其它框架组件分开。An alternative embodiment of a method of making a frame assembly 402 is shown in FIGS. 9a-d. FIG. 9 a shows material 902 surrounding a series of frame component patterns 904 cut from a single thin planar material 906 . In one embodiment, each pattern includes a fiducial 404 , two arms 406 , and a support 408 . In FIG. 9 b , the arm 406 is bent perpendicular to the reference member 404 . In FIG. 9c the support 408 is bent perpendicular to the arm 406 . In Figure 9d, a single frame assembly 402 is separated from other frame assemblies.

图10a-b示出框架组件402的一种可选实施例。图10a示出顶视图,而图10b示出侧视图。框架组件402的该实施例具有两臂406,且每臂具有一个支撑件408,而基准件404具有一个后部支撑件1002和支撑基座1004。在一个实施例中,一个或两个臂406连接到后部支撑件1002,而框架组件402在支撑基座1004处装配到HGA314。在一个实施例中,后部支撑件1002与支撑基座支撑基座1004垂直,且臂406垂直于后部支撑件1002和支撑基座1004。An alternative embodiment of the frame assembly 402 is shown in FIGS. 10a-b. Figure 10a shows a top view, while Figure 10b shows a side view. This embodiment of the frame assembly 402 has two arms 406 with a support 408 per arm, while the reference 404 has a rear support 1002 and support base 1004 . In one embodiment, one or both arms 406 are connected to rear support 1002 while frame assembly 402 is assembled to HGA 314 at support base 1004 . In one embodiment, rear support 1002 is perpendicular to support base support base 1004 and arm 406 is perpendicular to rear support 1002 and support base 1004 .

图11a-e示出制作框架组件402的可选实施例的方法的一个实施例。图11a示出一系列框架组件图案1102从单个薄平面材料1104中切割出来。在图11b中,框架组件图案1102与其它图案和剩余材料1104分开。在一个实施例中,后部支撑件1002、支撑基座1004、两臂406、和支撑件408都在图案中。图11c中,支撑基座1004垂直于后部支撑件1002弯曲。在图11d中,臂406垂直于后部支撑件1002弯曲。图11d中,支撑件408垂直于臂406弯曲。11a-e illustrate one embodiment of a method of making an alternative embodiment of a frame assembly 402. FIG. FIG. 11 a shows a series of frame component patterns 1102 cut from a single thin planar material 1104 . In FIG. 11 b , frame component pattern 1102 is separated from other patterns and remaining material 1104 . In one embodiment, rear support 1002, support base 1004, arms 406, and support 408 are all in a pattern. In FIG. 11 c , the support base 1004 is bent perpendicular to the rear support 1002 . In FIG. 11d the arms 406 are bent perpendicular to the rear support 1002 . In FIG. 11d the support 408 is bent perpendicular to the arm 406 .

图12a-e示出制作框架组件402的可选实施例的方法的一个可选实施例。图12a示出围绕从单个薄平面材料1206中切割出来的一系列框架组件图案1204的材料1202。在一个实施例中,每个图案包括后部支撑件1002、支撑基座1004、两臂406、和支撑件408。在图12b中,臂406和后部支撑件1002垂直于支撑基座1004弯曲。图12c中,支撑件408垂直于臂406弯曲。在图12d中,单个框架组件图案1204与其它框架组件图案1204分开。在图12e中,臂406垂直于后部支撑件1002弯曲。12a-e illustrate an alternative embodiment of a method of making an alternative embodiment of a frame assembly 402. FIG. FIG. 12 a shows material 1202 surrounding a series of frame component patterns 1204 cut from a single thin planar material 1206 . In one embodiment, each pattern includes a rear support 1002 , a support base 1004 , two arms 406 , and a support 408 . In FIG. 12 b , the arms 406 and rear support 1002 are bent perpendicular to the support base 1004 . In FIG. 12c the support 408 is bent perpendicular to the arm 406 . In FIG. 12d , a single frame component pattern 1204 is separated from other frame component patterns 1204 . In FIG. 12e the arms 406 are bent perpendicular to the rear support 1002 .

尽管此处具体描述了几个实施例,但应当理解,本发明的修改和变化将由以上阐述所覆盖,并属于所附权利要求的范围,而不脱离本发明的精神和范围。Although several embodiments have been specifically described herein, it should be understood that modifications and variations of the present invention are covered by the above description and fall within the purview of the appended claims without departing from the spirit and scope of the invention.

Claims (9)

1.一种方法,包括:1. A method comprising: 从一个薄板材模制产生用于一个微致动器的框架组件图案,该框架组件图案包括:A frame assembly pattern for a microactuator is molded from a thin sheet material, the frame assembly pattern comprising: 用于装配磁头的第一臂和第二臂,the first arm and the second arm for assembling the magnetic head, 第一侧臂,和first side arm, and 第二侧臂;second side arm; 一个后部支撑件a rear support 将所述第一侧臂弯曲到垂直于所述后部支撑件的位置;bending the first side arm to a position perpendicular to the rear support; 将一个第一侧臂弯曲为垂直于该第一臂的位置,该第一侧臂用于装配到一个连接板,所述连接板将磁头与一个印刷电路组件电耦合;bending a first side arm to a position perpendicular to the first arm, the first side arm is adapted to fit to a connection plate electrically coupling the magnetic head to a printed circuit assembly; 将所述第二臂弯曲到垂直于所述后部支撑件的位置;和bending the second arm to a position perpendicular to the rear support; and 将一个第二侧臂弯曲为垂直于该第二臂的位置,该第二侧臂用于装配到一个连接板Bend a second side arm to a position perpendicular to the second arm for fitting to a connection plate 2.如权利要求1所述的方法,进一步包括将所述框架组件装配到所述头万向节组件的一个悬挂组件上。2. The method of claim 1, further comprising assembling said frame assembly to a suspension assembly of said head gimbal assembly. 3.如权利要求1所述的方法,其中所述框架组件由金属构成。3. The method of claim 1, wherein the frame assembly is constructed of metal. 4.如权利要求1所述的方法,进一步包括将所述基准件的一个侧臂弯曲到垂直于所述基准件的一个后部支撑件的位置,该后部支撑件用于装配到所述头万向节上。4. The method of claim 1, further comprising bending a side arm of the datum to a position perpendicular to a rear support of the datum for fitting to the head on the gimbal. 5.如权利要求4所述的方法,其中第一臂和第二臂被弯曲为垂直于第一侧臂和第二侧臂,所述第一臂和第二臂于磁头相连.5. The method of claim 4, wherein the first arm and the second arm are bent perpendicular to the first side arm and the second side arm, the first arm and the second arm being connected to the magnetic head. 6.如权利要求1所述的方法,进一步包括耦合到所述第一臂的第一条压电致动器材料。6. The method of claim 1, further comprising a first strip of piezoelectric actuator material coupled to the first arm. 7.如权利要求1所述的方法,进一步包括耦合到所述第二臂的第二条压电致动器材料。7. The method of claim 1, further comprising a second strip of piezoelectric actuator material coupled to the second arm. 8.如权利要求1所述的方法,其中所述框架组件图案是通过从所述薄平面材料切割所述框架组件图案来制作的。8. The method of claim 1, wherein the frame component pattern is fabricated by cutting the frame component pattern from the thin planar material. 9.如权利要求1所述的方法,其中所述框架元件图案是通过从所述薄平面材料将多余材料切除,然後分割剩余的框架元件图案组来制作的。9. The method of claim 1, wherein the frame element pattern is produced by cutting away excess material from the thin planar material and then dividing the remaining frame element pattern groups.
CNA2008100051506A 2002-06-26 2002-06-26 Configured Metal Frame Piezoelectric Microactuator with Lower Stiffness Suspension Design Pending CN101312045A (en)

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