CN100533234C - Method for forming cell thickness gap of liquid crystal panel - Google Patents
Method for forming cell thickness gap of liquid crystal panel Download PDFInfo
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- CN100533234C CN100533234C CNB2006101704924A CN200610170492A CN100533234C CN 100533234 C CN100533234 C CN 100533234C CN B2006101704924 A CNB2006101704924 A CN B2006101704924A CN 200610170492 A CN200610170492 A CN 200610170492A CN 100533234 C CN100533234 C CN 100533234C
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Abstract
The invention provides a method for forming a cell thickness gap of a liquid crystal panel, which comprises the following steps: positioning the bottom substrate and the top substrate; (B) the isolation layer moves to be positioned; (C) bonding the isolation layer to the bottom substrate: (D) injecting liquid crystal into the void of the isolation layer; (E) bonding the isolation layer and the top substrate; (F) irradiating and heating by using ultraviolet equipment; (G) cutting and forming to form a liquid crystal panel product with a thick cell gap; the spacer cost is saved and the production quality of the liquid crystal unit cell is improved.
Description
One, technical field
The present invention relates to a kind of cell thick clearance formation method of liquid crystal panel, particularly be applied to the liquid crystal panel manufacturing, the separation layer by Pasting about in the of combines the method that forms thick liquid crystal cell gap with the top bottom substrate sticking of liquid crystal panel.
Two, background technology
Liquid crystal is to be widely used in the material that shows product, and liquid crystal is added in double-sided electrode by voltage and forms the logical on-off effect of a light.Usually, the thickness of available liquid crystal layer between two electrodes is very thin, and for example, at the display panels of TFT-LCD kenel, thickness is at 6 to 8 microns (um); Liquid crystal layer and gap at the display panels of TN or STN kenel then are below 10 microns; The liquid crystal layer average thickness of LCOS miniscope (micro display) is about 3 to 5 microns.
Existing liquid crystal panel characteristic than minimal thickness is summarized as follows: 1, liquid crystal molecule rise and fall reaction time extremely fast, the cell gap of thinner thickness and the liquid crystal material of low voltage drive, low voltage drive can reach lower power consumption and design electronic control circuit easily.2, high transmittance, the liquid crystal layer of thinner thickness can produce the higher penetrating rate.3, assembling easily, the cell gap of thinner thickness is kept the cell gap unanimity with the interval grain usually.Cell gap is extensively adopted by the LCD industry, and littler spacer particle is easier to obtain and easily handles in processing procedure.
But in some application, the liquid crystal layer that thickness is thicker is that its necessity and demand are arranged, and the thicker liquid crystal layer of thickness will run into unfavorable manufacturing issue as the liquid crystal layer method for making with above-mentioned existing thinner thickness.As in existing liquid crystal panel production run, by glass substrate at interior millet cake glue and form a liquid crystal chamber for ccontaining liquid crystal, cover on the top by a top glass substrate again, form inner liquid crystal cavity configuration,, liquid crystal is injected in the liquid crystal chamber of vacuum after allowing the liquid crystal chamber vacuumize by evacuator then in edge's opening, or by another existing formula liquid crystal injection mode of dripping, insert in the liquid crystal chamber by liquid crystal droplet, and the mixed interval grain, this cell gap can be formed and keep.
If the liquid crystal cell gap is increased to 30 microns (um), 50 microns (um), 100 microns (um), when perhaps higher, the interval grain is obtained difficult, and the cost of required cost can significantly increase.Even the interval grain supply problem of greater particle size can solve reluctantly, but the adhesion inwall of thinner thickness can't be kept and form to the liquid crystal cavity configuration, and width will greatly increase, and can't satisfy the miniaturization demand, under some processing procedure situation, be to accept this kind structure.
Relevant patented technology document aspect formerly, as No. 200610585 " display panels separation material manufacture method " disclosure of the Invention case of TaiWan, China disclosure of the Invention communique, disclose the method for making of typical available liquid crystal display panel, separation material is evenly distributed, can't reaches the formation effect of thick clearance.
Three, summary of the invention
Fundamental purpose of the present invention is to overcome the above-mentioned shortcoming that existing product exists, and provide a kind of cell thick clearance formation method of liquid crystal panel, it is to set in advance series cavity by a separation layer, injects with the ODF method for liquid crystal, and and then forms cell thick clearance by separation layer.
A further object of the present invention is to provide a kind of cell thick clearance formation method of liquid crystal panel, increases the production cycle, saves grain cost at interval, and promotes the liquid crystal structure cell quality of production.
The objective of the invention is to realize by following technical scheme.
The cell thick clearance formation method of liquid crystal panel of the present invention is characterized in that, comprises the following steps:
(A) bottom surface substrate and end face substrate orientation, with the fixed position that a bottom surface substrate and an end face substrate are delivered to, promptly the end face substrate is positioned at substrate top, bottom surface;
(B) separation layer moves to the location, and promptly at least one separation layer moves position between the bottom surface substrate that corresponds to steps A and the end face substrate, promptly is positioned at position between substrate top, bottom surface and end face substrate below, is provided with several insulated columns and cavity in the separation layer;
(C) separation layer is bonded to the bottom surface substrate, and the separation layer below that is about to step B is bonded to substrate top, bottom surface;
(D) inject liquid crystal in the cavity of separation layer, step c is finished the separation layer of bonding bottom surface basic unit, the brilliant cavity of injecting the separation layer of this steps A of feed flow;
(E) bonding separation layer and end face substrate, promptly the upper end of finishing the separation layer top of liquid crystal implantation step by step D is bonded to the end face substrate below of steps A, and this bottom surface substrate, separation layer and end face substrate junction are integrated;
(F) with ultraviolet light equipment irradiation heating, be about to the structure that step e is finished bottom surface substrate, separation layer and end face substrate in combination one, shine heating, make between separation layer and bottom surface substrate, end face substrate firmly to combine by ultraviolet light equipment;
(G) cut moulding, be about to the separation layer that step F finishes in the structure of bottom surface substrate, separation layer and end face substrate in combination one of UV-irradiation and cut, form the liquid crystal panel product of a thick cell gap.
The cell thick clearance formation method of aforesaid liquid crystal panel is characterized in that, the bottom surface substrate in the described steps A comprises: a bottom is positioned at the bottom; One ITO conductive layer is incorporated on the bottom; One both alignment layers is incorporated on the ITO conductive layer.
The cell thick clearance formation method of aforesaid liquid crystal panel is characterized in that, described bottom is a glass; Described bottom is that flexible substrate constitutes.
The cell thick clearance formation method of aforesaid liquid crystal panel is characterized in that, the separation layer among the described step B comprises: several insulated columns and cavity, be distributed in the separation layer, and insulated column and cavity formation interlace mode layout; Once the UV adhesive-layer is incorporated into insulated column and below, cavity; Diaphragm once is in conjunction with UV adhesive-layer down, to protect down the UV adhesive-layer; UV adhesive-layer on one is incorporated into insulated column and top, cavity; One upper protective film is in conjunction with the UV adhesive-layer, to protect the UV adhesive-layer and to can be used for sealing empty end face.
The cell thick clearance formation method of aforesaid liquid crystal panel is characterized in that, described insulated column is that teflon constitutes.
The cell thick clearance formation method of aforesaid liquid crystal panel is characterized in that, the separation layer of described step B is banded.
The cell thick clearance formation method of aforesaid liquid crystal panel is characterized in that, the end face substrate of described steps A comprises:
One both alignment layers is positioned at the end face substrate bottom surface; One ITO conductive layer is incorporated on the both alignment layers; One glass basis is incorporated on the ITO conductive layer.
The cell thick clearance formation method of aforesaid liquid crystal panel is characterized in that, the liquid crystal of described step D injects the mode in separation layer cavity and injects (ODF) method for the formula liquid crystal that drips.
The cell thick clearance formation method of aforesaid liquid crystal panel is characterized in that, the separation layer quantity of described step B is two; In conjunction with a two-way orientation film, this two-way orientation film comprises: a transparency carrier between two described separation layers; One first alignment film is coated with and is plated on the transparency carrier end face, is incorporated into a separation layer; One second alignment film is coated with and is plated on the transparency carrier bottom surface, is incorporated into another separation layer; Described transparency carrier is an anisotropy polymer flake; The orientation angle of described first alignment film and the orientation angle of second alignment film differ 90 degree.
The cell thick clearance formation method of liquid crystal panel of the present invention is characterized in that it may further comprise the steps:
(a) bottom surface substrate and end face substrate orientation are about to the fixed position that a bottom surface substrate and end face substrate are delivered to, and promptly the end face substrate is positioned at substrate top, bottom surface;
(b) separation layer moves to the location, promptly a banded separation layer moves and corresponds to position between step (a) bottom surface substrate and the end face substrate, promptly is positioned at substrate top, bottom surface and end face substrate lower position, be provided with several insulated columns and cavity in this separation layer, this cavity one side forms a filling orifice at least;
(c) separation layer is bonded to the bottom surface substrate, and the separation layer below that is about to step (b) is bonded to substrate top, bottom surface;
(d) bonding separation layer and end face substrate are promptly finished the upper end that separation layer is bonded to the separation layer top of bottom surface substrate step by step (c) and are bonded to step (a) end face substrate below, and this bottom surface substrate, separation layer and end face substrate junction are integrated;
(e) by ultraviolet light equipment irradiation heating, be about to step (d) and finish the structure of bottom surface substrate, separation layer and end face substrate in combination one, shine heating with a ultraviolet light equipment, make the following UV adhesive-layer of separation layer lower end and the last UV adhesive-layer heat hardening of upper end, allow separation layer with the bottom surface substrate with the end face substrate is firm combines;
(f) cut moulding, after being about to step (e) and finishing separation layer in the structure of bottom surface substrate, separation layer and end face substrate in combination one of UV-irradiation and cut, form the unit piece of a liquid crystal panel;
(g) the liquid crystal vacuum is injected the separation layer cavity, promptly by existing vacuum injection mode, the separation layer filling orifice of liquid crystal via the liquid crystal panel unit spare of step (f) is injected to fill up whole cavity;
(h) sealing filling orifice promptly after step (g) is finished the empty step of liquid crystal injection separation layer, is sealed the separation layer filling orifice, forms a liquid crystal panel product.
The cell thick clearance formation method of aforesaid liquid crystal panel, wherein the separation layer in the step (b) comprises: several insulated columns and cavity are distributed in the separation layer; Once the UV adhesive-layer is incorporated into insulated column and below, cavity; Diaphragm once is in conjunction with UV adhesive-layer down, to protect down the UV adhesive-layer; LTV adhesive-layer on one is incorporated into insulated column and top, cavity; One upper protective film is in conjunction with the UV adhesive-layer, to protect the UV adhesive-layer and can seal empty end face.
The cell thick clearance formation method of aforesaid liquid crystal panel, wherein insulated column is irregularly shaped.
The beneficial effect of the cell thick clearance formation method of liquid crystal panel of the present invention is, the cell thick clearance formation method of the present invention's liquid crystal panel, be that bottom surface substrate by a liquid crystal panel is fixed to the location, at least one separation layer, upper and lowerly be provided with at least one UV adhesive-layer, separation layer inside is provided with several cavities (picture element viewing area), and this separation layer contraposition is to bottom surface basic unit position, and is pasted on base plate basic unit by the UV adhesive-layer of lower end; Liquid crystal is inserted in each hole of separation layer by drip formula liquid crystal injecting method or vacuum liquid crystal injection mode again, by the UV adhesive-layer of separation layer upper end and the end face substrate sticking contraposition of a liquid crystal panel, heat by UV-irradiation afterwards, make this two UV adhesive-layer sclerosis up and down, also two UV adhesive-layers separately shine the sclerosis mode up and down, allow the bottom surface substrate of liquid crystal panel and bottom surface and the end face that the end face substrate is incorporated into separation layer respectively, reach the effect that makes separation layer form the cell thick clearance of liquid crystal panel.
Four, description of drawings
Fig. 1 is the bottom board structure amplification profile of the inventive method first embodiment.
Fig. 2 is the inventive method first embodiment insulation layer structure amplification profile.
Fig. 3 is the inventive method first embodiment top layer board structure amplification profile.
Fig. 4 is the inventive method first embodiment process flow diagram.
Fig. 5 is the inventive method first embodiment bottom surface substrate, separation layer and end face substrate positioning structure stereographic map.
Fig. 6 is a structure for amplifying sectional view of the present invention, shows that the first embodiment separation layer is bonded to bottom surface substrate state.
Fig. 7 is a structure for amplifying sectional view of the present invention, shows that first embodiment injects liquid crystal in separation layer cavity state.
Fig. 8 is a structure for amplifying sectional view of the present invention, shows the first embodiment bottom surface substrate, separation layer and the end face substrate irradiation heated condition that integrally combines.
Fig. 9 is the formed liquid crystal panel structure amplification profile of the inventive method first embodiment.
Figure 10 is that the formed liquid crystal panel second of the inventive method is implemented illustration.
Figure 11 is the three-dimensional decomposition chart of two-sided orientation film among Figure 10.
Figure 12 is inventive method the 3rd embodiment bottom surface substrate, separation layer and end face board structure.
Figure 13 is the inventive method the 3rd embodiment bottom surface substrate, separation layer and end face substrate orientation stereographic map.
Figure 14 is the inventive method the 3rd embodiment process flow diagram.
Figure 15 is the inventive method the 3rd embodiment liquid crystal panel unit spare structural drawing.
Figure 16 is the liquid crystal panel structure figure of the inventive method.
Major label description in figure: 10 bottom surface substrates; 11 bottoms; 12 is the ITO conductive layer; 13 both alignment layers; 20 separation layers; 20 ' separation layer; 21 insulated columns; 22 cavities; 23 times UV adhesive-layers; 24 times diaphragms; UV adhesive-layer on 25; 26 upper protective films; 30 end face substrates; 31 both alignment layers; 32 is the ITO conductive layer; 33 glass basiss; 40 bottom surface substrates and end face substrate orientation; 41 separation layers move to the location; 42 separation layers are bonded to the bottom surface substrate; 43 inject liquid crystal in the separation layer cavity; 44 bonding separation layers and end face substrate; 45 with ultraviolet light equipment irradiation heating; 46 cut moulding; 50 ultraviolet light equipment; 60 two-sided orientation films; 61 transparency carriers; 62 first alignment films; 63 second alignment films; 70 separation layers; 71 insulated columns; 72 cavities; 721 filling orifices; 73 times UV adhesive-layers; 74 times diaphragms; UV adhesive-layer on 75; 76 upper protective films; 80 bottom surface substrates and end face substrate orientation; 81 separation layers move to the location; 82 separation layers are bonded to the bottom surface substrate; 83 bonding separation layers and end face substrate; 84 with ultraviolet light equipment irradiation heating; 85 cut moulding; 86 liquid crystal vacuum are injected the separation layer cavity; 87 sealing filling orifices; 100 liquid crystal panels; 100 ' liquid crystal panel; the H height.
Five, embodiment
Consult shown in Figure 1, the cell thick clearance formation method of liquid crystal panel of the present invention, the bottom surface substrate 10 that comprises a liquid crystal panel, this bottom surface substrate 10 comprises a bottom 11, ITO conductive layer (Indium Tin OxideLayer) 12 and at least one both alignment layers (Alignment Layer) 13, this bottom 11 is positioned at the bottom, can be glass or other transparency material, perhaps be that flexible base plate (flexible substrate) constitutes, for example: materials such as PC, PET and PES; One ITO conductive layer 12 is incorporated on the bottom 11, and this both alignment layers 13 is incorporated on the ITO conductive layer 12.
Consult shown in Figure 2; at least one separation layer 20; comprise: several insulated columns 21; several cavities 22; at least one UV adhesive-layer 23 down; following diaphragm 24; at least one UV adhesive-layer 25 and upper protective film 26 gone up; this insulated column 21 is distributed in the separation layer 20 with cavity 22; and insulated column 21 forms interlace mode with cavity 22 and arranges; insulated column 21 materials are not limit; be to be example in the present invention with the teflon (Teflon) or the material that can not react mutually with liquid crystal; insulated column 21 height H can infinite range preestablish to be made; but be the also infinite range thickenings of separation layer 20 integral thickness scopes; this time UV adhesive-layer 23 is incorporated into insulated column 21 and empty 22 belows; following UV adhesive-layer 23 surfaces are by diaphragm 24 applying protections down; in case divest down diaphragm 24; can allow down UV adhesive-layer 23 have viscosity; UV adhesive-layer 25 be should go up and insulated column 21 and empty 22 tops were incorporated into; should go up LTV adhesive-layer 25 surfaces by upper protective film 26 applying protections; upper protective film 26 can be used for sealing empty 22 end faces; similarly; tear upper protective film 26 off, can make UV adhesive-layer 25 have stickiness and the cavity 22 is exposed.Above-mentioned UV adhesive-layer 23 and adhesive-layer 25 are not to exceed to have diaphragm 24 and diaphragm; be incorporated into insulated column 21 and empty 22 belows as directly being coated with UV adhesive-layer 23; and the adhesive-layer 25 direct modes that are incorporated into insulated column 21 and empty 22 tops that are coated with, also belong to technology category of the present invention.The form of this separation layer 20 is not limit, is in the present invention to constitute band shape (as shown in Figure 5) with several separation layer 20 adjacent connections, and also can be the single component form.
Consult shown in Figure 3, the end face substrate 30 of one liquid crystal panel comprises-both alignment layers 31, ITO conductive layer 32 and glass basis (Glass Substrate) 33 that both alignment layers 31 is positioned at end face substrate 30 bottom surfaces, ITO conductive layer 32 is incorporated on the both alignment layers 31, and glass basis 33 is incorporated on the ITO conductive layer 32.
Consult Fig. 4, Fig. 5, Fig. 6, Fig. 7 and shown in Figure 8, the cell thick clearance formation method of liquid crystal panel of the present invention, its step comprises that step 40 is to 49; Wherein:
(40) bottom surface substrate and end face substrate orientation are about to above-mentioned bottom surface shown in Figure 1 substrate 10 and end face substrate 30 and are delivered to as shown in Figure 5 fixed position, and promptly end face substrate 30 is positioned at bottom surface substrate 10 tops.
(41) separation layer moves to the location, and promptly banded separation layer 20 as shown in Figure 2 moves and corresponds to step
(40) position between bottom surface substrate 10 and the end face substrate 30 promptly is positioned at bottom surface substrate 10 tops and end face substrate 30 lower positions as shown in Figure 5.
(42) separation layer is bonded to the bottom surface substrate, and the following diaphragm 24 that is about to step (41) separation layer 20 is removed, and UV adhesive-layer 23 is binded to the both alignment layers 13 on bottom surface substrate 10 tops, as shown in Figure 6.
(43) inject liquid crystal in the cavity of separation layer; be about to step (42) and finish the upper protective film 26 of the separation layer 20 of bonding bottom surface basic unit 10 and remove, cavity 22 is exposed, and inject liquid crystal one by one in cavity 22; as with drip the filling of formula liquid crystal injecting method in the cavity 22 in, as shown in Figure 7.
(44) bonding separation layer and end face substrate, promptly the last UV adhesive-layer 25 of finishing separation layer 20 tops of liquid crystal implantation step by step (43) is bonded to the both alignment layers 31 of end face substrate 30 belows shown in the step 40, makes bottom surface substrate 10, separation layer 20 and end face substrate 30 be combined into as shown in Figure 8 integrative-structure.
(45) with ultraviolet light equipment irradiation heating, be about to step (44) and finish bottom surface substrate 10, the structure that separation layer 20 and end face substrate 30 are combined integrated, utilize a ultraviolet light equipment 50 to shine heating, make the following UV adhesive-layer 23 of separation layer 20 lower ends and last UV adhesive-layer 25 heat hardenings of upper end, as shown in Figure 8, separation layer 20 is firmly combined with bottom surface substrate 10 and end face substrate 30.
(46) cut moulding, after being about to step (45) and finishing separation layer 20 cuttings in the combined integrated structure of the bottom surface substrate 10 of UV-irradiation, separation layer 20 and end face substrate 30, promptly form liquid crystal panel 100 products of thick cell gap of the present invention as shown in Figure 9.
Consult shown in Figure 10, second embodiment that shows the cell thick clearance formation method of liquid crystal panel of the present invention, wherein, be presented between end face substrate 30 and the bottom surface substrate I0, the bottom surface substrate links two separation layers 20 and 20 ', the mode of connection of the mode of connection that this separation layer 20 and end face substrate are 30 and separation layer 20 ' and bottom surface substrate 10 is identical with mode of connection between Fig. 8 and separation layer 20 shown in Figure 9 and bottom surface substrate 10 and the end face substrate 30.
Consult shown in Figure 11, be combined with a two-sided orientation film 60 between above-mentioned two separation layers 20 and 20 ', this two-sided orientation film 60 comprises a transparency carrier 61, first alignment film 62 and second alignment film 63, transparency carrier 61 is that an anisotropy polymer flake (anistropic polymer films) constitutes, these first alignment film, 62 coatings are incorporated into transparency carrier 61 end faces, second alignment film, 63 coatings are incorporated into transparency carrier 61 bottom surfaces, first alignment film 62 is binded by the UV adhesive-layer 25 of separation layer 20, second alignment film 63 by this separation layer 20 ' UV adhesive-layer 23 bonding in addition, the orientation angle of this first alignment film 62 and second alignment film 63 is not limit, be that orientation angle with first alignment film 62 is 45 degree in the present invention, the orientation angle of second alignment film 63 is that 145 degree are example, this kind quadrature orientation angle design, can make the liquid crystal optics polar biased light interdependence between two separation layers 20 and 20 ' do optimal pairing, and can increase the liquid crystal cell gap thickness of liquid crystal panel 100, can not increase required driving voltage and corresponding reaction time again.
Figure 10 and shown in Figure 11, second embodiment of the liquid crystal cell thick clearance constructive method of liquid crystal panel 100 of the present invention, it forms step and can finish to 46 according to as shown in Figure 4 step 40, simultaneously, add bottom 11, can change the profile of liquid crystal panel 100, to meet different application scenario demands as flexual bottom surface substrate 10, for example: the optical characteristics of the liquid crystal cell gap of the liquid crystal camera lens of spherical mirror or increase liquid crystal panel 100, for example: the optical focal length characteristic.
Consult Figure 12; shown in Figure 13; the 3rd embodiment for the cell thick clearance formation method of liquid crystal panel of the present invention; wherein; one separation layer 70 is positioned at 30 of this bottom surface substrate 10 and end face substrates; this separation layer 70; comprise several insulated columns 71; several cavities 72; at least one UV adhesive-layer 73 down; following diaphragm 74; at least one UV adhesive-layer 75 and upper protective film 76 gone up; insulated column 71 shapes are not limit; it in Figure 12 and Figure 13 an irregularly shaped example; and be not for above-mentioned separation layer 20 or 20 ' insulated column 21 cylindrical shapes; this cavity 72 is distributed in the separation layer 70; each cavity 72 1 side forms at least one filling orifice 721; this time UV adhesive-layer 73 is incorporated into sealing insulated column 71 and empty 72 belows; this time UV adhesive-layer 73 surfaces are by the protection of being fitted of following diaphragm 74; in case divest down diaphragm 74; can allow down UV adhesive-layer 73 have viscosity; last UV adhesive-layer 75 is in conjunction with being closed in insulated column 71 and empty 72 tops; and last UV adhesive-layer 75 surfaces are by the protection of being fitted of this upper protective film 76; similarly; tear upper protective film 76 off, can make UV adhesive-layer 75 have stickiness.
Consult Figure 14, Figure 15 and shown in Figure 16, Figure 14 is the process flow diagram of cell thick clearance formation method the 3rd embodiment of above-mentioned Figure 12 and liquid crystal panel of the present invention shown in Figure 13, comprises that step 80 is to 86, wherein:
(80) bottom surface substrate and end face substrate orientation are about to bottom surface substrate shown in Figure 13 10 and end face substrate 30 and are delivered to as shown in figure 13 fixed position, and promptly end face substrate 30 is positioned at bottom surface substrate 10 tops.
(81) separation layer moves to the location, i.e. banded separation layer 70 as shown in figure 13 moves position between the bottom surface substrate 10 that corresponds to step 80 and the end face substrate 30, promptly is positioned at bottom surface substrate 10 tops and end face substrate 30 lower positions as shown in figure 13.
(82) separation layer is bonded to the bottom surface substrate, and soon the diaphragm 74 of the below UV adhesive-layer 73 of the separation layer 70 of step (81) is removed, and UV adhesive-layer 73 is binded to the both alignment layers 13 on bottom surface substrate 10 tops, and its practice is analogous to above-mentioned steps (42).
(83) bonding separation layer and end face substrate, promptly finishing separation layer 70 by step (82) binds to bottom surface substrate 10 steps, the last UV adhesive-layer 75 on these separation layer 70 tops is bonded to the both alignment layers 31 of end face substrate 30 belows shown in the step (80), makes this bottom surface substrate 10, separation layer 70 and end face substrate 30 be combined into as shown in figure 12 integrative-structure.
(84) with ultraviolet light equipment irradiation heating, be about to step (83) and finish bottom surface substrate 10, separation layer 70 and end face substrate 30 combined integrated structures, shine heating by a ultraviolet light equipment 50, make the following UV adhesive-layer 73 of separation layer 70 lower ends and last UV adhesive-layer 75 heat hardenings of upper end, allow separation layer 20 firmly combine with end face substrate 30 with bottom surface substrate 10.
(85) cut moulding, after being about to step (84) and finishing separation layer 70 in the combined integrated structure of the bottom surface substrate 10 of UV-irradiation, separation layer 70 and end face substrate 30 and cut, i.e. as shown in figure 15 liquid crystal panel 100 of formation ' unit piece.
(86) the liquid crystal vacuum is injected the separation layer cavity, promptly by existing vacuum injection mode, with liquid crystal via the formed liquid crystal panel 100 of step (85) ' the filling orifice 721 of unary separation layer 70 inject, to fill up whole empty 72.
(87) sealing filling orifice after being about to step (86) and finishing cavity 72 processing procedures that liquid crystal injects separation layer 70, is sealed the filling orifice 721 of separation layer 70, forms as liquid crystal panel 100 ' product shown in Figure 16.
Above-mentioned Fig. 1 is to the cell thick clearance formation method of liquid crystal panel of the present invention shown in Figure 16, the wherein explanation that is disclosed and graphic, be for ease of illustrating technology contents of the present invention and technological means, the a corner of the preferred embodiment that discloses, it only is preferred embodiment of the present invention, be not that the present invention is done any pro forma restriction, every foundation technical spirit of the present invention all still belongs in the scope of technical solution of the present invention any simple modification, equivalent variations and modification that above embodiment did.
Claims (12)
1, a kind of cell thick clearance formation method of liquid crystal panel is characterized in that, comprises the following steps:
(A) bottom surface substrate and end face substrate orientation, with the fixed position that a bottom surface substrate and an end face substrate are delivered to, promptly the end face substrate is positioned at substrate top, bottom surface;
(B) separation layer moves to the location, and promptly at least one separation layer moves position between the bottom surface substrate that corresponds to steps A and the end face substrate, promptly is positioned at position between substrate top, bottom surface and end face substrate below, is provided with several insulated columns and cavity in the separation layer;
(C) separation layer is bonded to the bottom surface substrate, and the separation layer below that is about to step B is bonded to substrate top, bottom surface;
(D) inject liquid crystal in the cavity of separation layer, step c is finished the separation layer of bonding bottom surface basic unit, the brilliant cavity of injecting the separation layer of this step B of feed flow;
(E) bonding separation layer and end face substrate, promptly the upper end of finishing the separation layer top of liquid crystal implantation step by step D is bonded to the end face substrate below of steps A, and this bottom surface substrate, separation layer and end face substrate junction are integrated;
(F) with ultraviolet light equipment irradiation heating, be about to the structure that step e is finished bottom surface substrate, separation layer and end face substrate in combination one, shine heating, make between separation layer and bottom surface substrate, end face substrate firmly to combine by ultraviolet light equipment;
(G) cut moulding, be about to the separation layer that step F finishes in the structure of bottom surface substrate, separation layer and end face substrate in combination one of UV-irradiation and cut, form the liquid crystal panel product of a thick cell gap.
2, the cell thick clearance formation method of liquid crystal panel according to claim 1 is characterized in that, the bottom surface substrate in the described steps A comprises: a bottom is positioned at the bottom; One ITO conductive layer is incorporated on the bottom; One both alignment layers is incorporated on the ITO conductive layer.
3, the cell thick clearance formation method of liquid crystal panel according to claim 2 is characterized in that, described bottom is a glass; Described bottom is that flexible substrate constitutes.
4, the cell thick clearance formation method of liquid crystal panel according to claim 1 is characterized in that, the separation layer among the described step B comprises: several insulated columns and cavity, be distributed in the separation layer, and insulated column and cavity formation interlace mode layout; Once the UV adhesive-layer is incorporated into insulated column and below, cavity; Diaphragm once is in conjunction with UV adhesive-layer down, to protect down the UV adhesive-layer; UV adhesive-layer on one is incorporated into insulated column and top, cavity; One upper protective film is gone up adhesive-layer in conjunction with UV, to protect the UV adhesive-layer and to can be used for sealing empty end face.
5, the cell thick clearance formation method of liquid crystal panel according to claim 4 is characterized in that, described insulated column is that teflon constitutes.
6, the cell thick clearance formation method of liquid crystal panel according to claim 1 is characterized in that, the separation layer of described step B is banded.
7, the cell thick clearance formation method of liquid crystal panel according to claim 1 is characterized in that, the end face substrate of described steps A comprises:
One both alignment layers is positioned at the end face substrate bottom surface; One ITO conductive layer is incorporated on the both alignment layers; One glass basis is incorporated on the ITO conductive layer.
8, the cell thick clearance formation method of liquid crystal panel according to claim 1 is characterized in that: the mode that the liquid crystal of described step D injects the separation layer cavity is the formula liquid crystal injecting method that drips.
9, the cell thick clearance formation method of liquid crystal panel according to claim 1 is characterized in that: the separation layer quantity of described step B is two; In conjunction with a two-way orientation film, this two-way orientation film comprises: a transparency carrier between two described separation layers; One first alignment film is coated with and is plated on the transparency carrier end face, is incorporated into a separation layer; One second alignment film is coated with and is plated on the transparency carrier bottom surface, is incorporated into another separation layer; Described transparency carrier is an anisotropy polymer flake; The orientation angle of described first alignment film and the orientation angle of second alignment film differ 90 degree.
10, a kind of cell thick clearance formation method of liquid crystal panel, it is characterized in that: it may further comprise the steps:
(a) bottom surface substrate and end face substrate orientation are about to the fixed position that a bottom surface substrate and end face substrate are delivered to, and promptly the end face substrate is positioned at substrate top, bottom surface;
(b) separation layer moves to the location, promptly a banded separation layer moves and corresponds to position between step (a) bottom surface substrate and the end face substrate, promptly is positioned at substrate top, bottom surface and end face substrate lower position, be provided with several insulated columns and cavity in this separation layer, this cavity one side forms a filling orifice at least;
(c) separation layer is bonded to the bottom surface substrate, and the separation layer below that is about to step (b) is bonded to substrate top, bottom surface;
(d) bonding separation layer and end face substrate are promptly finished the upper end that separation layer is bonded to the separation layer top of bottom surface substrate step by step (c) and are bonded to step (a) end face substrate below, and this bottom surface substrate, separation layer and end face substrate junction are integrated;
(e) by ultraviolet light equipment irradiation heating, be about to step (d) and finish the structure of bottom surface substrate, separation layer and end face substrate in combination one, shine heating with a ultraviolet light equipment, make the following UV adhesive-layer of separation layer lower end and the last UV adhesive-layer heat hardening of upper end, allow separation layer with the bottom surface substrate with the end face substrate is firm combines;
(f) cut moulding, after being about to step (e) and finishing separation layer in the structure of bottom surface substrate, separation layer and end face substrate in combination one of UV-irradiation and cut, form the unit piece of a liquid crystal panel;
(g) the liquid crystal vacuum is injected the separation layer cavity, promptly by existing vacuum injection mode, the separation layer filling orifice of liquid crystal via the liquid crystal panel unit spare of step (f) is injected to fill up whole cavity;
(h) sealing filling orifice promptly after step (g) is finished the empty step of liquid crystal injection separation layer, is sealed the separation layer filling orifice, forms a liquid crystal panel product.
11, the cell thick clearance formation method of liquid crystal panel according to claim 10 is characterized in that: the separation layer in the described step (b) comprises: several insulated columns and cavity are distributed in the separation layer; Once the UV adhesive-layer is incorporated into insulated column and below, cavity; Diaphragm once is in conjunction with UV adhesive-layer down, to protect down the UV adhesive-layer; UV adhesive-layer on one is incorporated into insulated column and top, cavity; One upper protective film is in conjunction with last UV adhesive-layer, to protect the UV adhesive-layer and can seal empty end face.
12, the cell thick clearance formation method of liquid crystal panel according to claim 10 is characterized in that, described insulated column is irregularly shaped.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CNB2006101704924A CN100533234C (en) | 2006-12-31 | 2006-12-31 | Method for forming cell thickness gap of liquid crystal panel |
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| CNB2006101704924A CN100533234C (en) | 2006-12-31 | 2006-12-31 | Method for forming cell thickness gap of liquid crystal panel |
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| CN101211071A CN101211071A (en) | 2008-07-02 |
| CN100533234C true CN100533234C (en) | 2009-08-26 |
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| KR20100138148A (en) * | 2009-06-24 | 2010-12-31 | 동우 화인켐 주식회사 | Aqueous cleaning liquid composition |
| JP2011099880A (en) * | 2009-11-03 | 2011-05-19 | Sony Corp | Method for manufacturing liquid crystal display device |
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|---|---|---|---|---|
| CN1202683A (en) * | 1997-05-20 | 1998-12-23 | 索尼株式会社 | Method of manufacturing plasma addressed electro-optical display |
| JP2002196339A (en) * | 2000-12-26 | 2002-07-12 | Sony Corp | Test cell for evaluating liquid crystal material |
| US20030214623A1 (en) * | 2002-05-14 | 2003-11-20 | Fujitsu Limited | Liquid crystal display and manufacturing method of same |
| CN1672088A (en) * | 2002-08-02 | 2005-09-21 | 三星电子株式会社 | Panel for liquid crystal display, liquid crystal display including same, and manufacturing method thereof |
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2006
- 2006-12-31 CN CNB2006101704924A patent/CN100533234C/en not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1202683A (en) * | 1997-05-20 | 1998-12-23 | 索尼株式会社 | Method of manufacturing plasma addressed electro-optical display |
| JP2002196339A (en) * | 2000-12-26 | 2002-07-12 | Sony Corp | Test cell for evaluating liquid crystal material |
| US20030214623A1 (en) * | 2002-05-14 | 2003-11-20 | Fujitsu Limited | Liquid crystal display and manufacturing method of same |
| CN1672088A (en) * | 2002-08-02 | 2005-09-21 | 三星电子株式会社 | Panel for liquid crystal display, liquid crystal display including same, and manufacturing method thereof |
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| CN101211071A (en) | 2008-07-02 |
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