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2010 – 2019
- 2018
[c1]Chao-Kun Hu, James J. Kelly, Huai Huang
, Koichi Motoyama, Hosadurga Shobha, Yuri Ostrovski, James H.-C. Chen, Raghuveer Patlolla, Brown Peethala, Praneet Adusumilli, Terry A. Spooner, Roger Quon, Lynne M. Gignac, Chris M. Breslin, G. Lian, M. Ali, Jacob Benedict, X. S. Lin, S. Smith, Vimal Kamineni, X. Zhang, Frank Wilhelm Mont, Shariq Siddiqui, Frieder H. Baumann:
Future on-chip interconnect metallization and electromigration. IRPS 2018: 4
2000 – 2009
- 2006
- [j2]Chao-Kun Hu, Lynne M. Gignac, R. Rosenberg:
Electromigration of Cu/low dielectric constant interconnects. Microelectron. Reliab. 46(2-4): 213-231 (2006)
1990 – 1999
- 1995
- [j1]Chao-Kun Hu, Kenneth P. Rodbell, Timothy D. Sullivan, Kim Y. Lee, Dennis P. Bouldin:
Electromigration and stress-induced voiding in fine Al and Al-alloy thin-film lines. IBM J. Res. Dev. 39(4): 465-498 (1995)
Coauthor Index
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last updated on 2024-04-24 23:10 CEST by the dblp team
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