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Shin-Young Chung
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2020 – today
- 2024
- [c15]Sangmin Oh, Taeyoung Jeong, Junghwan Yum, Minhyuk Lim, Yoohwan Kim, Bongyong Jeong, Jeongmin Jo, Hyewon Shim, Shin-Young Chung, Paul Jung:
An Analysis of CDM-induced BTI-like Degradation using VF-TLP in Advanced FinFET Technology. IRPS 2024: 1-5 - [c14]Taiki Uemura, Byungjin Chung, Jaehee Choi, Seungbae Lee, Shin-Young Chung, Yuchul Hwang, Sangwoo Pae:
Soft-Error Sensitivity in SRAM Manufactured by Bulk Gate-All-Around (GAA) Technology. IRPS 2024: 1-6 - [c13]Taiki Uemura, Byungjin Chung, Jaehee Choi, Seungbae Lee, Shin-Young Chung, Yuchul Hwang, Sangwoo Pae:
Comprehensive Study of SER in FDSOI-Planar: 28 nm to 18 nm Scaling Effect and Temperature Dependence. IRPS 2024: 1-5 - [c12]Yinghong Zhao, Hokyung Park, Ki-Don Lee, Liangshan Chen, Manisha Sharma, Sugento Huandra, Hanson Mao, Brian Filemyr Smith, Wei Xia, Joonah Yoon, Junehwan Kim, Myungsoo Yeo, Shin-Young Chung, Ju Kwang Kim:
Impacts of Post-Cu CMP Queue Time on Reliability. IRPS 2024: 1-5 - [c11]Rakesh Ranjan, Pavitra R. Perepa, Ki-Don Lee, Ashish Kumar Jha, Kartika C. Sahoo, Kayla N. Sanders, Robert Moeller, Prateek Sharma, Minhyo Kang, Peter Kim, Kwanjae Song, Yongwoo Jeon, Seungho Kim, Hyewon Shim, Shin-Young Chung, Ju Kwang Kim:
A Systematic Study of HCI Improvement in FinFET with Source/Drain Implant and Geometry Modulation. IRPS 2024: 5 - [c10]Seongkyung Kim, Junkyo Jeong, Eunyu Choi, Jinyoung Kim, Hyewon Shim, Shin-Young Chung, Paul Jung:
Hot-Carrier-Degradation Characterization for Accurate End-of-Life Prediction with 3nm GAA Logic Technology Featuring Multi-Bridge-Channel FET. VLSI Technology and Circuits 2024: 1-2 - 2023
- [c9]Seongkyung Kim, Hyerim Park, Eunyu Choi, Young Han Kim, Dahyub Kim, Hyewon Shim, Shin-Young Chung, Paul Jung:
Reliability Assessment of 3nm GAA Logic Technology Featuring Multi-Bridge-Channel FETs. IRPS 2023: 1-8 - [c8]Rakesh Ranjan, Pavitra Ramadevi Perepa, Ki-Don Lee, Hokyung Park, Peter Kim, Ganesh Chakravarthy Yerubandi, Jon Haefner, Caleb Dongkyun Kwon, Minjung Jin, Wenhao Zhou, Hyewon Shim, Shin-Young Chung:
Impact of Barrier Metal Thickness on SRAM Reliability. IRPS 2023: 1-6 - [c7]SungMan Rhee, Hyunjin Kim, Sangku Park, Taiki Uemura, Yuchul Hwang, Seungjin Choo, Jinju Kim, Hwasung Rhee, Shin-Young Chung:
Machine Learning Based V-ramp VBD Predictive Model Using OCD-measured Fab Parameters for Early Detection of MOL Reliability Risk. IRPS 2023: 1-4 - [c6]Manisha Sharma, Hokyung Park, Yinghong Zhao, Ki-Don Lee, Liangshan Chen, Joonah Yoon, Rakesh Ranjan, Caleb Dongkyan Kwon, Hyewon Shim, Myungsoo Yeo, Shin-Young Chung, Jon Haefner:
Polarity Dependency of MOL-TDDB in FinFET. IRPS 2023: 1-3 - [c5]Taiki Uemura, Byungjin Chung, Shin-Young Chung, Seungbae Lee, Yuchul Hwang, Sangwoo Pae:
Impact of Design and Process on Alpha-Induced SER in 4 nm Bulk-FinFET SRAM. IRPS 2023: 1-8 - 2022
- [c4]Taiki Uemura, Byungjin Chung, Jegon Kim, Hyewon Shim, Shin-Young Chung, Brandon Lee, Jaehee Choi, Shota Ohnishi, Ken Machida:
Thermal-Neutron SER Mitigation by Cobalt-Contact in 7 nm Bulk-FinFET Technology. IRPS 2022: 7 - [c3]Seongkyung Kim, Ukjin Jung, Seungjin Choo, Kihyun Choi, Tae-Jin Chung, Shin-Young Chung, Euncheol Lee, Juhun Park, Deokhan Bae, Myungyoon Um:
Middle-of-the-Line Reliability Characterization of Recessed-Diffusion-Contact Adopted sub-5nm Logic Technology. IRPS 2022: 11 - [c2]Taiki Uemura, Byungjin Chung, Jegon Kim, Hyewon Shim, Shin-Young Chung, Brandon Lee, Jaehee Choi, Shota Ohnishi, Ken Machida:
Accelerator-Based Thermal-Neutron Beam by Compact and Low-Cost Moderator for Soft-Error Evaluation in Semiconductor Devices. IRPS 2022: 53-1
2010 – 2019
- 2019
- [c1]Ghil-Geun Oh, Jong-Ho Eun, Shin-Young Chung, Brandon Lee:
Advanded Design Verification and Debugging Techniques Based on Optical Fault Isolation Method. ISOCC 2019: 44-45
Coauthor Index

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