"Physical-aware Interconnect Testing and Repairing of Chiplets."

Changming Cui et al. (2023)

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DOI: 10.1109/ETS56758.2023.10174179

access: closed

type: Conference or Workshop Paper

metadata version: 2023-07-14

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Changming Cui, Tuanhui Xu, Haitao Fu, Junlin Huang:
Physical-aware Interconnect Testing and Repairing of Chiplets. ETS 2023: 1-4

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