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Yufeng Jin
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2020 – today
- 2024
- [j6]Feng Cao, Yufeng Jin, Chongben Tao, Xizhao Luo, Zhen Gao, Zufeng Zhang, Sifa Zheng, Yuan Zhu:
TFIENet: Transformer Fusion Information Enhancement Network for Multimodel 3-D Object Detection. IEEE Trans. Instrum. Meas. 73: 1-13 (2024) - [c42]Ping Lu, Ting Deng, Haoyuan Zhang, Yufeng Jin, Feiyi Liu, Tiancheng Mao, Lexiao Liu:
Ontology-Mediated Query Answering Using Graph Patterns with Conditions. ICDE 2024: 382-395 - 2023
- [c41]Yufeng Jin, Guosheng Hu, Haonan Chen, Duoqian Miao, Liang Hu, Cairong Zhao:
Cross-Modal Distillation for Speaker Recognition. AAAI 2023: 12977-12985 - 2021
- [c40]Sandip Purnapatra, Nic Smalt, Keivan Bahmani, Priyanka Das, David Yambay, Amir Mohammadi, Anjith George, Thirimachos Bourlai, Sébastien Marcel, Stephanie Schuckers, Meiling Fang, Naser Damer, Fadi Boutros, Arjan Kuijper, Alperen Kantarci, Basar Demir, Zafer Yildiz, Zabi Ghafoory, Hasan Dertli, Hazim Kemal Ekenel, Son Vu, Vassilis Christophides, Dashuang Liang, Guanghao Zhang, Zhanlong Hao, Junfu Liu, Yufeng Jin, Samo Liu, Samuel Huang, Salieri Kuei, Jag Mohan Singh, Raghavendra Ramachandra:
Face Liveness Detection Competition (LivDet-Face) - 2021. IJCB 2021: 1-10 - [c39]Yinghao He, Yaoping Liu, Wei Wang, Yufeng Jin:
A clogging rate prediction model based on porous microarray membranes for liquid biopsies. NEMS 2021: 898-901 - [c38]Jiangcheng Cao, Tingting Hun, Wenbo Zhou, Zheng Liu, Wei Wang, Yufeng Jin:
A Method for Automatic Counting and Labeling of Cells Stained with Microporous Membrane. NEMS 2021: 949-952 - [i1]Yuanhan Zhang, Zhenfei Yin, Jing Shao, Ziwei Liu, Shuo Yang, Yuanjun Xiong, Wei Xia, Yan Xu, Man Luo, Jian Liu, Jianshu Li, Zhijun Chen, Mingyu Guo, Hui Li, Junfu Liu, Pengfei Gao, Tianqi Hong, Hao Han, Shijie Liu, Xinhua Chen, Di Qiu, Cheng Zhen, Dashuang Liang, Yufeng Jin, Zhanlong Hao:
CelebA-Spoof Challenge 2020 on Face Anti-Spoofing: Methods and Results. CoRR abs/2102.12642 (2021)
2010 – 2019
- 2019
- [c37]Weili Wang, Yihsiang Chiu, Dan Gong, Shenglin Ma, Wen Lei, Hungping Lee, Huguang Liu, Yufeng Jin:
Effect of Shared Cavity on Electromechanical Performance of Piezoelectric Based Micro-machined Ultrasonic Transducer Array. NEMS 2019: 482-487 - [c36]Li Wang, Yihsiang Chiu, Dan Gong, Shenglin Ma, Yang Yang, Heng Li, Hungping Lee, Huguang Liu, Yufeng Jin:
Fabrication Process and Performance Analysis of AlN based Piezoelectric Micromachined Ultrasonic Transducer with a Suspended Structure. NEMS 2019: 514-519 - [c35]Nan Li, Yihsiang Chiu, Dan Gong, Shenglin Ma, Yunheng Sun, Tingyu Li, Hungping Lee, Huguang Liu, Yufeng Jin:
Thermal Effect of PMUT and Its Application to the Heat Dissipation of Power Electronics. NEMS 2019: 540-544 - [c34]Heng Li, Meixuan Zhang, Juntao Li, Guangyi Shi, Yufeng Jin:
Design and Development of a Robotic Arm for Evaluation of Medical MEMS Sensors. RCAR 2019: 305-310 - 2018
- [j5]Xiao Dong, Meixuan Zhang, YinHua Lei, Zhihong Li, Yufeng Jin, Wei Wang:
Parylene-MEMS technique-based flexible electronics. Sci. China Inf. Sci. 61(6): 060419:1-060419:9 (2018) - [c33]Yanming Xia, Tao Wang, Lu Song, Xuanyanz Li, Shenglin Ma, Rongfeng Luo, Jing Chen, Wei Wang, Yufeng Jin:
A Study on High Resolution Batch-Mode Micro-Utralsonic-Machining with Constant Feed Force of Sapphire for MEMS Application. NEMS 2018: 304-307 - 2017
- [j4]Xiaole Cui, Xiaoxin Cui, Yewen Ni, Min Miao, Yufeng Jin:
An Enhancement of Crosstalk Avoidance Code Based on Fibonacci Numeral System for Through Silicon Vias. IEEE Trans. Very Large Scale Integr. Syst. 25(5): 1601-1610 (2017) - [c32]Zhongliang Luo, Zhe Li, Chengchen Gao, Yilong Hao, Yufeng Jin:
Anemometer for detection of very low speed air flow with three-dimensional directionality. NEMS 2017: 615-618 - [c31]Tong Liu, Chunhua He, Qiancheng Zhao, Zhenchuan Yang, Guizhen Yan, Yufeng Jin:
Research on the Zero-Rate Output compensation for MEMS vibratory gyroscopes. NEMS 2017: 804-807 - [c30]Xiaowei Jiang, Li Ma, Jie Cao, Xuyu Zhang, Xiewei Xie, Yufeng Jin, Guangyi Shi:
Research of on-line modeling and real-time filtering for MEMS gyroscope random noise. RCAR 2017: 151-155 - [c29]Xuyu Zhang, Liang Xiao, Chenlong Zou, Linqi Guo, Yufeng Jin, Guangyi Shi:
A novel calibration method of electronic compass based on multi-redundancy. RCAR 2017: 156-161 - [c28]Li Dong, Yahua Huang, Yufeng Jin, Liang Xu, Mingyue Liu, Weimin Zhang, Guangyi Shi:
A newly fast method of magnetometer calibration based on hexahedron measurement. RCAR 2017: 162-166 - [c27]Li Ma, Xiaowei Jiang, Li Dong, Jie Cao, Yufeng Jin, Guangyi Shi:
Vibration effects rectification of IMU attitude based on gradient descent algorithm. RCAR 2017: 167-171 - [c26]Xiaole Cui, Chunliang Liu, Guangyi Shi, Yufeng Jin:
A new calibration method for MEMS accelerometers with genetic algorithm. RCAR 2017: 240-245 - [c25]Xiewei Xie, Qiaoyuan Chen, Kun Ming, Chen Wang, Yufeng Jin, Guangyi Shi:
A method for high accuracy heading angle combined with ellipsoid calibration and BP neural network. RCAR 2017: 258-261 - [c24]Yahua Huang, Jiachao Gong, Tianyi Yao, Cheng Wang, Yufeng Jin, Guangyi Shi:
High accuracy extend Kalman filter for posture measurement based on attitude and heading reference system. RCAR 2017: 262-266 - [c23]Xiyang Chen, Wei Yan, Zhenyu Wang, Yufeng Jin, Guangyi Shi:
Optimization and simulation of satellite IMS access gateway and signal's propagation dela. RCAR 2017: 366-370 - 2016
- [c22]Yong Guan, Qinghua Zeng, Jing Chen, Shenglin Ma, Yufeng Jin:
Fabrication and characterization of fine pitch TSV integration with self-aligned backside insulation layer opening. NEMS 2016: 91-94 - [c21]Wei Meng, Qinghua Zeng, Yong Guan, Jing Chen, Yufeng Jin:
Thermal-mechanical reliability analysis of connection structure between redistribution layer and TSV for MEMS packaging. NEMS 2016: 384-387 - 2015
- [c20]Bingqiang Jing, Xiaole Cui, Yalin Ran, Yufeng Jin:
Post-bond test for TSVs using voltage division. ASICON 2015: 1-4 - [c19]Hupo Wei, Xiaole Cui, Qiang Zhang, Yufeng Jin:
An enhanced decoder for multiple-bit error correcting BCH codes. ASICON 2015: 1-4 - [c18]Shijie Zhang, Xiaole Cui, Qiang Zhang, Yufeng Jin:
A TSV repair method for clustered faults. ASICON 2015: 1-4 - 2013
- [j3]Xin Sun, Yunhui Zhu, Zhen Hua Liu, Qing-hu Cui, Shenglin Ma, Jing Chen, Min Miao, Yufeng Jin:
Electrical characterization of integrated passive devices using thin film technology for 3D integration. J. Zhejiang Univ. Sci. C 14(4): 235-243 (2013) - [c17]Guangmin Sun, Zibo Li, Yufeng Jin, Junling Sun, Kun Zheng, Dequn Zhao:
A new fast adopted image matching approach with arbitrary rotation. APSIPA 2013: 1-4 - [c16]Yibo He, Xiaole Cui, Chung Len Lee, Xiaoxin Cui, Yufeng Jin:
New DfT architectures for 3D-SICs with a wireless test port. ASICON 2013: 1-4 - [c15]Xiaolin Zhou, Guangmin Sun, Dequn Zhao, Zhimeng Wang, Li Gao, Xiaomeng Wang, Yufeng Jin:
A Fuzzy Enhancement Method for Transmission Line Image Based on Genetic Algorithm. IIH-MSP 2013: 223-226 - [c14]Zhiyuan Zhu, Shaonan Wang, Yichao Xu, Guanjiang Wang, Yudan Pi, Peiquan Wang, Yunhui Zhu, Xin Sun, Min Yu, Jing Chen, Min Miao, Yufeng Jin:
Investigations of silicon wafer bonding using thin Al and Sn films for heterogeneous integration. NEMS 2013: 155-158 - [c13]Yichao Xu, Guanjiang Wang, Xin Sun, Runiu Fang, Min Miao, Yufeng Jin:
In-line testing of blind TSVs for 3D IC integration and M/NEMS packaging. NEMS 2013: 233-236 - [c12]Peiquan Wang, Dayu Tian, Shaonan Wang, Min Yu, Yufeng Jin:
Research on the structure of ultrathin Si PIN detector. NEMS 2013: 629-632 - 2012
- [c11]Songtao Jia, Min Miao, Runiu Fang, Shichao Guo, Duwei Hu, Yufeng Jin:
A 3D micro-channel cooling system embedded in LTCC packaging substrate. NEMS 2012: 649-652 - 2011
- [c10]Fu-Yun Zhu, Chen Wang, Min Yu, Xin Zhao, Yufeng Jin, Haixia Zhang:
Development of TSV simulator: FASTsv. NEMS 2011: 217-220 - [c9]Hua Gan, Yufeng Jin, Min Miao, Xin Sun:
A novel LTCC capacitive accelerometer embedded in LTCC packaging substrate. NEMS 2011: 796-799 - 2010
- [c8]Min Miao, Jing Zhang, Yunsong Qiu, Yangfei Zhang, Yufeng Jin, Hua Gan:
A LTCC microsystem vacuum package substrate with embedded cooling microchannel and Pirani gauge. NEMS 2010: 399-403 - [c7]Ying Li, Shenglin Ma, Yufeng Jin, Min Yu, Lu Zhang, Jinyan Wang:
Fabrication and characterization of ultra-thin PIN detector. NEMS 2010: 513-517
2000 – 2009
- 2009
- [c6]Min Miao, Yufeng Jin, Hongguang Liao, Liwei Zhao, Yunhui Zhu, Xin Sun, Yunxia Guo:
Research on deep RIE-based through-Si-via micromachining for 3-D system-in-package integration. NEMS 2009: 90-93 - [c5]Guangyi Shi, Yuexian Zou, Yufeng Jin, Yali Zheng, Wen Jung Li:
Multi-category human motion recognition based on MEMS inertial sensing data. NEMS 2009: 489-493 - [c4]Yuexian Zou, Guangyi Shi, Yufeng Jin, Yali Zheng:
Extraocular image processing for retinal prosthesis based on DSP. NEMS 2009: 563-566 - [c3]Yuexian Zou, Yali Zheng, Yufeng Jin, Guangyi Shi:
Signal modulation schemes comparison in the telemetry unit for retinal prosthesis system. NEMS 2009: 632-636 - 2008
- [c2]Guangyi Shi, Yuexian Zou, Yufeng Jin, Wen Jung Li:
PCA/ICA-based SVM for fall recognition using MEMS motion sensing data. APCCAS 2008: 69-72 - [c1]Guangyi Shi, Yuexian Zou, Yufeng Jin, Xiaole Cui, Wen Jung Li:
Towards HMM based human motion recognition using MEMS inertial sensors. ROBIO 2008: 1762-1766 - 2003
- [j2]Yufeng Jin, Jun Wei, Peck Cheng Lim, Zhenfeng Wang:
Hermetic Packaging Of Mems With Thick Electrodes By Silicon-Glass Anodic Bonding. Int. J. Comput. Eng. Sci. 4(2): 335-338 (2003) - [j1]Zhenfeng Wang, G. J. Qi, Jun Wei, Peck Cheng Lim, Yufeng Jin, C. K. Wong:
A Novel Wafer-Level Packaging Solution For Mems. Int. J. Comput. Eng. Sci. 4(2): 339-342 (2003)
Coauthor Index
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last updated on 2024-10-07 21:22 CEST by the dblp team
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