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Dongshun Bai

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2000 – 2009

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2009
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Amadine Jouve, Wenbin Hong, D. Blumenshine, JoElle Dachsteiner, Rama Puligadda, Dongshun Bai, J. Diaz, David Henry:
Material improvement for ultrathin-wafer handling in TSV creation and PECVD process. 3DIC 2009: 1-5

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