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2020 – today
- 2024
[c1]Varun Thukral, Chen He, Rebecca Chen, Letian Zhang, Romuald Roucou, Michiel van Soestbergen, Jeroen J. M. Zaal, Rene Rongen, Willem D. van Driel, G. Q. Zhang:
AI-Enabled Board Level Vibration Testing: Unveiling The Physics of Degradation. ITC 2024: 436-444
2010 – 2019
- 2016
- [j5]Amar Mavinkurve, Jaume L. M. Llacer Martinez, Michiel van Soestbergen, Jeroen J. M. Zaal:
Moisture absorption by molding compounds under extreme conditions: Impact on accelerated reliability tests. Microelectron. Reliab. 64: 254-258 (2016) - 2010
- [j4]Hendrik Pieter Hochstenbach, Willem D. van Driel, Dao-Guo Yang, Jeroen J. M. Zaal, E. Bagerman:
Designing for reliability using a new Wafer Level Package structure. Microelectron. Reliab. 50(4): 528-535 (2010) - [j3]Jeroen J. M. Zaal, Willem D. van Driel, G. Q. Zhang:
Challenges in the Assembly and Handling of Thin Film Capped MEMS Devices. Sensors 10(4): 3989-4001 (2010)
2000 – 2009
- 2009
- [j2]Jeroen J. M. Zaal, Hendrik Pieter Hochstenbach, Willem D. van Driel, G. Q. Zhang:
Solder interconnect reliability under drop impact loading conditions using High-speed Cold Bump Pull. Microelectron. Reliab. 49(8): 846-852 (2009) - 2008
- [j1]Jeroen J. M. Zaal, W. D. van Driel, S. Bendida, Q. Li, J. T. M. van Beek, G. Q. Zhang:
Packaging influences on the reliability of MEMS resonators. Microelectron. Reliab. 48(8-9): 1567-1571 (2008)
Coauthor Index
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