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Presentation + Paper
28 April 2023 0.33 NA EUV systems for high volume manufacturing
Author Affiliations +
Abstract
ASML NXE (0.33 NA) scanners are now commonly used for High Volume Manufacturing (HVM) of 7nm and 5 nm logic devices as well as 1z memory node devices. In 2021, ASML has introduced the NXE:3600D scanner to the market, targeting 3nm logic and 1a and 1b memory nodes. This system has entered the HVM phase and is shipping in volume. In this paper we will share the latest performance, with excellent imaging, overlay and productivity results. For the latter we will show record performance of 185 Wafers per Hour at dose 30mJ/cm2 and over 3000 Wafers per Day at customer. Furthermore, we will address the ASML roadmap and introduce the NXE:3800E scanner. The NXE:3800E will first ship in the fourth quarter of 2023, targeting the 2 nm logic node. Lastly, ASML will show its carbon footprint and energy reduction roadmap.
Conference Presentation
© (2023) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Christophe Smeets, Nico Benders, Frank Bornebroek, Joe Carbone, Roderik van Es, Arthur Minnaert, Guido Salmaso, and Stuart Young "0.33 NA EUV systems for high volume manufacturing", Proc. SPIE 12494, Optical and EUV Nanolithography XXXVI, 1249406 (28 April 2023); https://doi.org/10.1117/12.2658046
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KEYWORDS
Extreme ultraviolet

High volume manufacturing

Semiconducting wafers

Carbon

Scanners

Semiconductors

Wavefront aberrations

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